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Polymer flexible circuit board and preparation method thereof

A flexible circuit board and polymer technology, applied in printed circuit manufacturing, circuit substrate materials, printed circuits, etc., can solve the problems of low photon quantum efficiency and low solar energy utilization rate, achieve light transmission, improve photocatalytic properties and Sensitivity, effect of increasing loading of sensitive components

Inactive Publication Date: 2017-05-10
GUANGDONG KINGSHINE ELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But due to TiO 2 The conduction band width is wide, and it can only be excited by ultraviolet light with a short wavelength, so the utilization rate of solar energy is very low.
In addition, due to the recombination of electrons and holes generated by photoexcitation, the photon quantum efficiency is very low.

Method used

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Effect test

Embodiment

[0021] A polymer flexible circuit board, the circuit board includes a base layer, an intermediate layer, a conductive layer and via holes, the two sides of the base layer are respectively covered with an intermediate layer, the surface of the intermediate layer is provided with a conductive layer, and the conductive layer The through hole runs through the conductive layer, the intermediate layer and the base layer, and the surface of the through hole is provided with a conductive layer, and the raw material of the base layer is composed of the following components by weight: 27 parts of polyethylene, 13 parts of cycloolefin resin, polyurethane 11 parts, 9 parts of acrylic resin, 0.2 part of anti-aging agent. Through the compounding and synergistic effect between the components of the base layer of the present invention, light transmission can be realized, and it can also be applied to available light, so that the light transmittance can reach 88%-93%, which not only improves th...

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Abstract

The invention provides a polymer flexible circuit board and a preparation method thereof. A conductive coating is added to the surface of a conductive layer, through cooperation with a base layer provided by the invention, while it is ensured that conducting performance and photoelectrocatalysis performance are satisfied, light penetration can be realized, photocatalytic activity is enhanced, a porous metal material is employed as the conductive layer, the sensitive component load capacity of the circuit board is increased, and the photoelectrocatalysis feature and the sensitivity of the circuit board are further improved.

Description

technical field [0001] The invention belongs to the technical field of PCB processing, and in particular relates to a polymer flexible circuit board and a preparation method thereof. Background technique [0002] Environment and energy are major issues facing and urgently needed to be resolved by mankind in the 21st century. Photocatalysis has unique properties such as deep reaction at room temperature and can directly use solar energy as a light source to drive the reaction. Electrocatalysis is a kind of catalysis that makes the charge transfer on the electrode and electrolyte interface accelerate the reaction. Photoelectrocatalysis is expected to become an ideal environmental pollution control technology and clean energy production technology, and has attracted much attention. [0003] Photocatalytic purification technology is the process of using light to excite semiconductors to decompose organic matter. The mechanism is that semiconductor photocatalysts are excited by ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/03H05K1/09H05K3/02
CPCH05K1/0353H05K1/09H05K3/022H05K2201/0145H05K2201/0158H05K2201/0323H05K2201/0326
Inventor 李叶飞柳超付建云
Owner GUANGDONG KINGSHINE ELECTRONICS TECH CO LTD
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