Au-base slicken solder and preparation method thereof
A soft solder, gold-based technology, applied in the field of gold-based soft solder and its preparation, can solve the problems of easy oxidation and high tin slag output, and achieve the effects of reducing melting point, improving welding performance, and reducing melting point of solder
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Embodiment 1
[0023] This embodiment provides a gold-based soft solder, which is made of the following raw materials in terms of mass percentage: Au8%, Si 3%, Ge 10%, Ni 0.8%, Sb: 0.3%, P0.003%, S0.001% , Fe 0.05%, Al 0.01%, the balance is Sn and unavoidable impurities.
[0024] The preparation method of the gold-based soft solder of the present embodiment may further comprise the steps:
[0025] (1) Weigh P and half of the mass of Sn and put them in the vacuum melting furnace, cover the furnace cover, start the vacuum pump to form a negative pressure in the furnace cavity, the vacuum degree is -0.2MPa, and then turn on the heating power supply to heat the materials in the furnace , to 550°C, keep it for 3 hours and then stop heating. When the temperature of the material in the furnace drops to 420°C, open the furnace cover and stir the material at a stirring speed of 60 rpm, stir for 0.5 hours, and wait for the temperature to drop to 380-400°C , casting a strip-shaped Sn-P master alloy; ...
Embodiment 2
[0031] This embodiment provides a gold-based soft solder, which is made of the following raw materials in terms of mass percentage: Au10%, Si2%, Ge 12%, Ni 0.1-0.8%, Sb: 0.5%, P0.002%, S0.002 %, Fe 0.03%, Al 0.03%, the balance is Sn and unavoidable impurities.
[0032] The preparation method of gold-based soft solder of the present embodiment comprises the following steps:
[0033] (1) Weigh P and half of the mass of Sn and put them in the vacuum melting furnace, cover the furnace cover, start the vacuum pump to form a negative pressure in the furnace cavity, the vacuum degree is -0.2MPa, and then turn on the heating power supply to heat the materials in the furnace , to 500°C, keep it for 3 hours and then stop heating. When the temperature of the material in the furnace drops to 400°C, open the furnace cover and stir the material at a stirring speed of 60 rpm, stirring for 0.5 hours, until the temperature drops to 380-400 ℃, cast into a strip-shaped Sn-P master alloy;
[00...
Embodiment 3
[0039]This embodiment provides a gold-based soft solder, which is made of the following raw materials in terms of mass percentage: Au12%, Si1%, Ge 15%, Ni 0.1%, Sb: 0.8%, P0.001%, S0.003%, Fe 0.01%, Al 0.05%, the balance is Sn and unavoidable impurities.
[0040] The preparation method of gold-based soft solder of the present embodiment comprises the following steps:
[0041] (1) Weigh P and half of the mass of Sn and put them in the vacuum melting furnace, cover the furnace cover, start the vacuum pump to form a negative pressure in the furnace cavity, the vacuum degree is -0.2MPa, and then turn on the heating power supply to heat the materials in the furnace , to 580°C, keep it for 3 hours, then stop heating, when the temperature of the material in the furnace drops to 450°C, open the furnace cover, stir the material, the stirring speed is 60 rpm, stir for 0.5 hour, and wait for the temperature to drop to 380-400°C , casting a strip-shaped Sn-P master alloy;
[0042] (2) W...
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