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Au-base slicken solder and preparation method thereof

A soft solder, gold-based technology, applied in the field of gold-based soft solder and its preparation, can solve the problems of easy oxidation and high tin slag output, and achieve the effects of reducing melting point, improving welding performance, and reducing melting point of solder

Inactive Publication Date: 2017-05-24
ANHUI HUAZHONG WELDING MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The invention provides a gold-based soft solder, which solves the problems that the existing gold-based soft solder is easy to oxidize during soldering and has a high yield of tin slag

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] This embodiment provides a gold-based soft solder, which is made of the following raw materials in terms of mass percentage: Au8%, Si 3%, Ge 10%, Ni 0.8%, Sb: 0.3%, P0.003%, S0.001% , Fe 0.05%, Al 0.01%, the balance is Sn and unavoidable impurities.

[0024] The preparation method of the gold-based soft solder of the present embodiment may further comprise the steps:

[0025] (1) Weigh P and half of the mass of Sn and put them in the vacuum melting furnace, cover the furnace cover, start the vacuum pump to form a negative pressure in the furnace cavity, the vacuum degree is -0.2MPa, and then turn on the heating power supply to heat the materials in the furnace , to 550°C, keep it for 3 hours and then stop heating. When the temperature of the material in the furnace drops to 420°C, open the furnace cover and stir the material at a stirring speed of 60 rpm, stir for 0.5 hours, and wait for the temperature to drop to 380-400°C , casting a strip-shaped Sn-P master alloy; ...

Embodiment 2

[0031] This embodiment provides a gold-based soft solder, which is made of the following raw materials in terms of mass percentage: Au10%, Si2%, Ge 12%, Ni 0.1-0.8%, Sb: 0.5%, P0.002%, S0.002 %, Fe 0.03%, Al 0.03%, the balance is Sn and unavoidable impurities.

[0032] The preparation method of gold-based soft solder of the present embodiment comprises the following steps:

[0033] (1) Weigh P and half of the mass of Sn and put them in the vacuum melting furnace, cover the furnace cover, start the vacuum pump to form a negative pressure in the furnace cavity, the vacuum degree is -0.2MPa, and then turn on the heating power supply to heat the materials in the furnace , to 500°C, keep it for 3 hours and then stop heating. When the temperature of the material in the furnace drops to 400°C, open the furnace cover and stir the material at a stirring speed of 60 rpm, stirring for 0.5 hours, until the temperature drops to 380-400 ℃, cast into a strip-shaped Sn-P master alloy;

[00...

Embodiment 3

[0039]This embodiment provides a gold-based soft solder, which is made of the following raw materials in terms of mass percentage: Au12%, Si1%, Ge 15%, Ni 0.1%, Sb: 0.8%, P0.001%, S0.003%, Fe 0.01%, Al 0.05%, the balance is Sn and unavoidable impurities.

[0040] The preparation method of gold-based soft solder of the present embodiment comprises the following steps:

[0041] (1) Weigh P and half of the mass of Sn and put them in the vacuum melting furnace, cover the furnace cover, start the vacuum pump to form a negative pressure in the furnace cavity, the vacuum degree is -0.2MPa, and then turn on the heating power supply to heat the materials in the furnace , to 580°C, keep it for 3 hours, then stop heating, when the temperature of the material in the furnace drops to 450°C, open the furnace cover, stir the material, the stirring speed is 60 rpm, stir for 0.5 hour, and wait for the temperature to drop to 380-400°C , casting a strip-shaped Sn-P master alloy;

[0042] (2) W...

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Abstract

The invention provides Au-base slicken solder and a preparation method thereof and belongs to the technical field of solder. The Au-base slicken solder is prepared from, by mass percent, the following raw materials: 8%-12% of Au, 1%-3% of Si, 10%-15% of Ge, 0.1%-0.8% of Ni, 0.3%-0.8% of Sb, 0.001%-0.003% of P, 0.001%-0.003% of S, 0.01%-0.05% of Fe, 0.01%-0.05% of Al and the balance Sn and unavoidable impurities. The Au-base slicken solder can enhance the oxidation resistance and the corrosion resistance of the solder better, improve the wettability and liquidity of the solder, reduce the melting point of the solder and the yield of solder splash, improve the welding performance, the metal plasticity, extension strength and other performance and is novel high-performance antioxidant Au-base slicken solder.

Description

technical field [0001] The invention relates to the technical field of solder, in particular to a gold-based soft solder and a preparation method thereof. Background technique [0002] In the electric vacuum industry, widely used solders include copper-based solder and silver-based solder. Due to its high price and high cost of use, the application of gold-based solder is greatly restricted. But in actual work, sometimes gold-based solder is still a necessary choice. Vacuum electronic devices require that the solder should not contain elements with high vapor pressure. If the vapor pressure of the solder is too high, it will evaporate due to the temperature rise during the manufacture and use of the device. Evaporate deposits on the ceramics, making the insulation of the ceramics worse, and depositing on the cathode will make the cathode seriously poisonous. In some special parts, such as electron guns, titanium pumps and energy output windows, gold-based solders can be u...

Claims

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Application Information

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IPC IPC(8): B23K35/26C22C13/00C22C1/03
CPCB23K35/262C22C1/03C22C13/00
Inventor 虞迎兵刘东枭
Owner ANHUI HUAZHONG WELDING MATERIAL CO LTD
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