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Alkali-soluble resin, photosensitive resin composition, and use thereof

A technology of alkali-soluble resin and solvent, which is applied in the direction of optics, optomechanical equipment, instruments, etc., can solve the problems of difficult pattern formation and poor developability, and achieve the effect of inhibiting crosslinking reaction

Active Publication Date: 2017-05-24
NATOCO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If a photosensitive resin containing an acrylic copolymer with such an increased molecular weight is used, the developability during exposure to light will be very poor, and it will be difficult to form a suitable pattern.

Method used

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  • Alkali-soluble resin, photosensitive resin composition, and use thereof
  • Alkali-soluble resin, photosensitive resin composition, and use thereof
  • Alkali-soluble resin, photosensitive resin composition, and use thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1~15 and comparative example 1~3

[0104] (Examples 1-15 and Comparative Examples 1-3, preparation of alkali-soluble resin)

[0105] The solvents shown in Table 1 were charged into a flask equipped with a stirrer, a thermometer, a condenser, and a nitrogen gas introduction tube, and the temperature was raised to an appropriate temperature under a nitrogen atmosphere. In addition, the monomers and polymerization initiators shown in Table 1 were mixed to prepare a liquid mixture, and this liquid mixture was dropped into the solvent over 4 hours. Thereafter, it was reacted for 3 hours to prepare an alkali-soluble resin. In addition, the compounding quantity in Table 1 shows a mass part.

[0106] 【Table 1】

[0107]

[0108] The simplified symbols in Table 1 are expressed as follows.

[0109] AA: Acrylic

[0110] MAA: methacrylic acid

[0111] KBM503: γ-Methacryloxypropyltrimethoxysilane

[0112] KBM502: γ-Methacryloxypropylmethyldimethoxysilane

[0113] KBE503: γ-Methacryloxypropyltriethoxysilane

[0114...

Embodiment 16~33 and comparative example 4~6

[0135] (Examples 16-33 and Comparative Examples 4-6, preparation and evaluation of photosensitive resin composition)

[0136] The alkali-soluble resins of Examples 1 to 15 and Comparative Examples 1 to 3 (alkali-soluble resins prepared at the initial stage and left to stand at 40° C. for 2 weeks) and the crosslinking agents shown in Table 3 and The photosensitive agents are mixed to prepare a photosensitive resin composition. In addition, the compounding quantity in Table 3 represents a mass part.

[0137] 【table 3】

[0138]

[0139] The simplified notation in Table 3 is as follows.

[0140] Crosslinker A: 3,4-epoxycyclohexylmethyl 3,4-epoxycyclohexyl carboxylate

[0141] Crosslinking agent B: Etherified methylol melamine [NIKALAC MW30M manufactured by Sanwa Chemical Co., Ltd.]

[0142] Crosslinking agent C: silica-doped epoxy resin [Compoceran E102B manufactured by Arakawa Chemical Industry Co., Ltd.]

[0143] Crosslinker D: Trimethylolpropane trimethacrylate

[0144...

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PUM

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Abstract

This alkali-soluble resin comprises a copolymer dissolved in a solvent, the copolymer including a polymeric unit containing a carboxyl group based on an unsaturated carboxylic acid, etc. and a polymeric unit containing an alkoxysilyl group based on a monomer of formula (1) below. The solvent is a specific alcohol having a linear or branched chain alkyl group having 4 or 5 carbon atoms. The specific alcohol is preferably a primary alcohol with an alkyl group having 4 carbon atoms, and more preferably 1-butanol. X-(CH2)a-Si(OR)b(CH3)3-b (1) In formula (1), X is a vinyl group, styryl group, or (meth)acryloyl group, R is a methyl group or ethyl group, a is an integer of 0-3, and b is an integer of 1-3.

Description

technical field [0001] The present invention relates to an alkali-soluble resin, a photosensitive resin composition, and uses thereof, which are excellent in electrical insulation, heat resistance, water resistance, chemical resistance, and mechanical strength, and are suitable as surface protective films and interlayers of semiconductor elements Insulation film and other materials are used. Background technique [0002] In recent years, in the field of electronic materials, in circuit elements such as computers, smartphones, and tablet PCs, along with the rapid development of high-definition, in order to maintain the aperture ratio of pixels, the thinning of wiring lines has been promoted. Along with this, the electrical insulating film for protecting wiring is also required to be thinner. For example, in a TFT liquid crystal display element, an organic EL display element, an integrated circuit display element, etc., an interlayer insulating film is formed to electrically ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L101/10C08K5/05G03F7/075
CPCC08K5/05C08L101/10G03F7/075C08F2/48
Inventor 九泽昌祥深津优太饭田启雄
Owner NATOCO
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