Biomass curing-acceleration phenolic resin and phenolic resin preparation method
A phenolic resin, biomass technology, applied in the directions of adhesive additives, polymer adhesive additives, non-polymer adhesive additives, etc., can solve problems such as no public reports, achieve low price, simple preparation process, Simple to use effects
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Embodiment 1
[0031] (1) Add 146 parts of 37wt% formaldehyde aqueous solution and 98 parts of phenol to the reactor, adjust the pH to 8.5~9.0 with 30% NaOH alkali solution, and heat to about 90°C;
[0032] (2) After 15 minutes, adjust the pH to 8.5~9.0 with 30% NaOH alkali solution;
[0033] (3) After another 15 minutes, adjust the pH to 8.5~9.0 with 30% KOH alkali solution;
[0034] (4) React to about 200% of water miscibility, cool to 40°C, adjust the pH to 8.5-9.0 with 30% NaOH alkali solution, cool and discharge to obtain phenolic resin.
[0035] (5) Before using the phenolic resin, add 4.6 parts of a biomass curing accelerator.
[0036] The test indicators for the curing temperature and curing time of the phenolic resin before (PF1) and after (PF2) curing accelerator are as follows by means of a differential scanning calorimetry analyzer DSC (heating rate 10K / min):
[0037] Phenolic Resin Curing time / min Curing start temperature / ℃ Curing peak temperature / ℃ PF114.1153.3161.0 PF2 12.7143.0156...
Embodiment 2
[0039] (6) Add 162 parts of 37wt% formaldehyde aqueous solution and 98 parts of phenol to the reaction kettle, adjust the pH to 8.5-9.0 with 30% KOH alkaline solution, and heat to about 90°C;
[0040] (7) After 15 minutes, adjust the pH value to 8.5~9.0 with 30% KOH alkali solution;
[0041] (8) After another 15 minutes, adjust the pH to 8.5~9.0 with 30% NaOH alkali solution;
[0042] (9) React until the water miscibility is about 200%, cool to 40°C, adjust the pH to 8.5-9.0 with 30% KOH alkali solution, cool and discharge to obtain phenolic resin.
[0043] (10) Before using the phenolic resin, add 5.8 parts of a biomass curing accelerator.
[0044] The test indicators of the curing temperature and curing time of the phenolic resin before (PF1) and after (PF2) curing accelerator are as follows by means of a differential scanning calorimeter DSC (heating rate 10K / min):
[0045] Phenolic Resin Curing time / min Curing start temperature / ℃ Curing peak temperature / ℃ PF113.2149.1155.6 PF2 ...
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