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Tungsten copper alloy and its processing method and application

A technology of tungsten-copper alloy and processing method, which is applied in the field of alloy materials, can solve the problems of alloy thermal conductivity, reduced electrical conductivity, and low alloy sintering ability, and achieve the effects of increasing density, improving sintering performance, and good sintering ability

Active Publication Date: 2019-02-22
YUANMENG PRECISION TECH SHENZHEN INST
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Problems solved by technology

[0007] In view of the low sintering ability of the current tungsten-copper alloy, and although conventional sintering aids can improve the sintering ability, the thermal conductivity and electrical conductivity of the alloy are reduced, etc., the embodiment of the present invention provides a tungsten-copper alloy and its processing method

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  • Tungsten copper alloy and its processing method and application
  • Tungsten copper alloy and its processing method and application
  • Tungsten copper alloy and its processing method and application

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Embodiment

[0055] In order to save space, the formulation components of each embodiment and comparative example are listed in Table 1.

[0056] Table 1 embodiment and comparative example formula table

[0057]

[0058]

[0059] It can be seen from Table 1 that the W-Cu-Ag alloy with higher sintered density and performance can be obtained at the same sintering temperature by adding an appropriate amount of Ag.

[0060] from figure 1 It can be seen that the calcined silver-containing copper tungstate powder is easy to form large solids due to high temperature. In order to obtain materials that are convenient for further processing, it is necessary to reduce its particle size through ball milling.

[0061] from figure 2 It can be seen that the particle size of the powder can reach the submicron level after ball milling at a ball-to-material ratio of 3:1 (mass) and a rotational speed of 700RPM for 3 hours. Because the powder is a compound, it is brittle and can be ball milled to a ...

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Abstract

The invention discloses a tungsten-copper alloy and a machining method and application of the tungsten-copper alloy. The tungsten-copper alloy comprises, by mass percent, 4%-50% of copper, 50%-85% of tungsten and 0.05%-15% of silver. According to the tungsten-copper alloy of the embodiment, due to the fact that the silver element is added, wettability of the tungsten phase and the copper phase is improved due to the silver, meanwhile, the defects between tungsten and copper particles is overcome, clearances between alloys are eliminated, density of the alloy is improved, and the alloy can show a good sintering capability; and in addition, the heat conduction performance of the tungsten-copper alloy is maintained not lower than 210 DEG C, and the electric conductivity is not smaller than 30% of the IACS. Thus, the tungsten-copper alloy is very suitable for being applied to electromagnetic packaging and heat sinking materials.

Description

technical field [0001] The invention belongs to the technical field of alloy materials, and in particular relates to a tungsten-copper alloy and its processing method and application. Background technique [0002] Tungsten-copper pseudoalloy has the characteristics of high temperature resistance, high hardness, low expansion coefficient, high thermal conductivity and good plasticity of both tungsten and copper, so it is widely used in electronic packaging, heat sink and other fields. [0003] The existing preparation methods of tungsten-copper alloy include: porous tungsten is used as the skeleton to infiltrate liquid copper, thermally compressed tungsten-copper composite powder, liquid phase sintering and recompression, explosive compression and other techniques. [0004] However, due to the very small miscibility between different components in the tungsten-copper system, it is difficult to achieve complete densification of tungsten-copper pseudoalloys even when liquid cop...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C22C27/04C22C1/04
CPCC22C1/045C22C27/04
Inventor 李云平聂炎李军旗
Owner YUANMENG PRECISION TECH SHENZHEN INST
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