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Light-cured addition type organopolysiloxane composition and application in LED component packaging

A polysiloxane, addition-type technology, applied in the direction of electrical components, semiconductor devices, circuits, etc., can solve the problems of long time-consuming, high reaction temperature, etc., and achieve the effects of reducing damage, increasing reaction rate, and eliminating long heating time

Inactive Publication Date: 2017-06-13
江苏矽时代材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In order to overcome defects such as long time-consuming preparation of materials and high reaction temperature in the prior art, the present invention provides a photocurable addition polysiloxane composition, which mainly contains alkenyl-containing network or chain or chain polysiloxane , Hydrogen-based network or chain or chain polysiloxane, and UV light-initiated catalysts and functional materials are cured and formed by light irradiation at room temperature. The photo-molded polysiloxane material is especially suitable for LED component packaging Material

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036] A light-cured addition type organopolysiloxane material according to the present invention, the preparation method is as follows:

[0037] Add 80 parts of vinyl phenyl silicone resin {Me 2 (CH 2 =CH-)SiO 1 / 2} 0.13 {(CH 2 =CH-)MeSiO 2 / 2} 0.02 (Ph 2 SiO 2 / 2 ) 0.17 (Me 2 SiO 2 / 2 ) 0.1 (PhSiO 3 / 2 ) 0.58 , 19 parts of hydrogen-based phenyl silicone resin (HMe 2 SiO 1 / 2 ) 0.63 (Ph 2 SiO 2 / 2 ) 0.05 (Me 2 SiO 2 / 2 ) 0.04 (PhSiO 3 / 2 ) 0.28 , wherein the ratio of the carbon-carbon double bond to the Si-H bond is 1:1, 1.2 parts of oxynaphthone, 2 parts of 3-glycidoxypropyltrimethoxysilane, 4ppm 1-ethynylcyclohexyl Alcohol, add the UV photoinitiation catalyst platinum acetylacetonate of 6ppm converted into metal element mass, stir the above mixture at room temperature and then vacuum defoam, the obtained product has a refractive index of 1.53.

Embodiment 2

[0039] A light-cured addition type organopolysiloxane material according to the present invention, the preparation method is as follows:

[0040] Add 60 parts of vinyl methyl silicone resin {Me 2 (CH 2 =CH-)SiO 1 / 2} 0.12 (Me 3 SiO 1 / 2 ) 0.33 (SiO 4 / 2 ) 0.55 , 20 parts vinyl methicone {Me 2 (CH 2 =CH-)SiO 1 / 2} 0.05 (Me 2 SiO 2 / 2 ) 0.95 , 12 parts of hydrogen methyl silicone oil (HMe 2 SiO 1 / 2 ) 0.075 (HMeSiO 2 / 2 ) 0.6 (Me 2 SiO 2 / 2 ) 0.325 , wherein the ratio of the carbon-carbon double bond to the Si-H bond is 1:1, 1 part of oxynaphthone, 2 parts of 3-glycidoxypropyltrimethoxysilane, 4ppm 1-ethynylcyclohexyl Alcohol, add the UV photoinitiation catalyst platinum acetylacetonate of 5ppm converted into metal element mass, stir the above mixture at room temperature and then vacuum defoam, the obtained product has a refractive index of 1.41.

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PUM

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Abstract

The invention provides a light-cured addition type organopolysiloxane composition, which comprises the following ingredients (by weight): 80-90 parts of alkenyl netted or chain polysiloxane, 8-19.5 parts of polysiloxane containing a silicon-hydrogen bond, 2-60 ppm parts of an UV photo-initiation catalyst, 0.5-2 parts of a photo-initiation aid, and 2-50 ppm parts of a polymerization inhibitor. According to the invention, a siloxane material is cured by a room-temperature photocuring mode. In comparison with the prior art, long-time high-temperature heating is not required in the invention. Therefore, defects of long heating time and long total reaction time of a traditional material preparation method are eliminated. In addition, the product is applicable to a low-temperature thermolabile substrate. Thus, reaction time is saved, reaction rate is increased, and damage to a thermolabile substrate is reduced.

Description

technical field [0001] The invention belongs to the technical field of organosilicon polymer materials, and more specifically relates to a light-curing addition type polysiloxane composition and its application in LED element packaging. Background technique [0002] With the rapid development of LED technology in recent years, LED has been hailed as the fourth-generation light source after incandescent lamps, fluorescent lamps, and high-intensity gas discharge lamps. At present, most of the traditional packaging materials for LEDs use epoxy resin or silicone materials. Wherein the packaging material made of epoxy resin has problems such as easy yellowing and poor heat resistance. The packaging material made of silicone material has excellent heat resistance and UV aging resistance, and has been widely recognized as the best material for LED packaging adhesive. After several hours of high-temperature curing above 150°C, long-term high-temperature curing will have adverse eff...

Claims

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Application Information

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IPC IPC(8): C08L83/07C08L83/05C08K5/5435H01L33/56
CPCC08L83/04C08L2203/206C08L2205/025C08L2205/03H01L33/56C08K5/5435
Inventor 赵宇晖康润华黄山钱帆
Owner 江苏矽时代材料科技有限公司
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