Composite system LTCC material, and preparation method thereof

Abstract

The invention belongs to the field of electronic ceramic material and manufacturing of electronic ceramic material, and more specifically relates to a composite system LTCC material, and a preparation method thereof. The general chemical formula of the composite system LTCC material is Li<2x>(Zn<0.96>Co<0.05>)<2-x>SiO<4-y>LMZBS (0.125<=x<=0.375, and y ranges from 1 to 2wt%); the principal crystalline phase is (Zn,Co)<2>SiO<4> with a rhombohedron structure; the secondary crystalline phase is Li<1.6>Zn<1.2>SiO<4> with an orthorhombic system structure; the composite system LTCC material is prepared via low temperature sintering at 900 to 950 DEG C; the dielectric constant epsilon<r> ranges from 6.1 to 6.5; the Q*f value is higher than 130000GHz, and the highest Q*f value is 230602GHz; the temperature coefficient of resonance frequency tau<f> ranges from -41 to -22ppm / DEG C. The raw materials are cheap; the preparation method is simple; operation is convenient; production cost is low; and the composite system LTCC material is capable of reducing the loss of microwave devices or modules as a LTCC microwave medium or device.

Description

technical field [0001] The invention belongs to the field of electronic ceramic materials and its manufacture, and in particular relates to a composite system LTCC material and a preparation method thereof. Background technique [0002] In recent years, whether it is general-purpose electronic machines, communication equipment or consumer electronic products in the world, they are rapidly developing in the direction of miniaturization, light weight, integration, multi-function and high reliability. LTCC (Low Temperature Co-fired Ceramics) technology, as an advanced three-dimensional assembly and integration technology, has created conditions for the development of passive devices and passive / active device hybrid integration, and has been rapidly obtained in stacked chip passive devices. a wide range of applications. Many electronic materials and components manufacturers and universities have developed and produced various LTCC chip passive devices and components. In order t...

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Problems solved by technology

But Zn 2 SiO 4 A prominent disadvantage of ceramic materials is that the sintering temperature is too high. If the sintering temperature is lowered to 900°C by directly adding oxides or glass, the doping amount needs to be large, which will lead to a significant increase in dielectric loss.

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