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Method of coupling VCSEL with grating structure in silicon-based photon integrated circuit

A photonic integrated circuit, grating structure technology, applied in the coupling of optical waveguides, light guides, optics, etc., can solve the problem of time-consuming processing, inability to directly apply actual circuits, stability, repeatability and processing efficiency It is difficult to meet large-scale manufacturing, etc. question

Inactive Publication Date: 2017-07-14
HUNAN CITY UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this excimer laser ablation method can only make wedge-shaped structures one by one, and the processing takes a long time. In addition, special LIFT technology is required to realize the electrical connection of VCSEL.
Therefore, it is difficult for this technology to meet the needs of large-scale manufacturing in terms of stability, repeatability and processing efficiency.
[0009] A bare chip (die) is a chip produced in a foundry (processing plant), that is, a chip that has not been packaged after the wafer has been cut and tested. This kind of bare chip has only pads for packaging and cannot be directly packaged. used in practical circuits

Method used

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  • Method of coupling VCSEL with grating structure in silicon-based photon integrated circuit
  • Method of coupling VCSEL with grating structure in silicon-based photon integrated circuit
  • Method of coupling VCSEL with grating structure in silicon-based photon integrated circuit

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Experimental program
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Effect test

Embodiment 1

[0042] Depend on figure 2 It can be seen that a coupling method of a VCSEL laser and a grating structure in a silicon-based photonic integrated circuit, which makes an optical intermediary 7 on the surface of a silicon-based coupling grating structure, comprises the following steps:

[0043] (1) Prepare a PIC wafer with a functional device or structure that has been fabricated, and the functional device or structure includes a coupling grating 6, a pad 8, and an alignment mark;

[0044] ⑵Prepare the grayscale photolithography mask with the structure to be exposed (the transmittance can be gradually changed) and the corresponding alignment mark;

[0045] (3) Coating photoresist on the surface of the PIC wafer;

[0046] (4) Exposing, developing and fixing by grayscale photolithography, removing the photoresist on the area of ​​the pad 8, so that the area of ​​the pad 8 is not covered by the photoresist, and producing a wedge-shaped structure covering the surface of the couplin...

Embodiment 2

[0055] A coupling method of a VCSEL laser and a grating structure in a silicon-based photonic integrated circuit, which manufactures an optical intermediary 7 on the light-emitting surface of the bare chip of the VCSEL laser, and includes the following steps:

[0056] (1) Prepare the VCSEL laser bare chip that has been made, and the VCSEL laser bare chip includes a substrate 2, and a P electrode 4, an N electrode 1, and a VCSEL laser 3 are made on the substrate 2;

[0057] ⑵Prepare the grayscale photolithography mask with the structure to be exposed (the transmittance can be gradually changed) and the corresponding alignment mark;

[0058] (3) Coating photoresist on the light-emitting surface of the VCSEL laser die;

[0059] (4) Expose, develop and fix by grayscale photolithography, remove the photoresist on the pad 8 area, so that the pad 8 area is not covered by the photoresist, and make a wedge-shaped structure covering the surface of the coupling grating 6;

[0060] (5) P...

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Abstract

The invention discloses a method of coupling a VCSEL (Vertical Cavity Surface Emitting Laser) with grating structure in a silicon-based photon integrated circuit, which can deflect light of the VCSEL. The characteristics are that an optical interposer is made on the surface of a silicon-based coupling grating structure or an optical interposer is made on a light-emitting surface of a die of the VCSEL. On the basis of a common photoetching technology among semiconductor processing technologies, an adopted flip-chip technology is compatible with the CMOS technology, the method meets large-scale manufacturing requirements in terms of stability, repeatability and processing efficiency, and thus the production cost of PICs is reduced. A wedge-shaped structure with partial refractive light effects is made on the silicon-based coupling grating or the surface of the die of the VCSEL through a gray-scale photoetching technology, so laser emitted from the VCSEL can be effectively coupled to a PIC through the grating structure. In an obtained structure, electric connection of the VCSEL exhibits good symmetry, thereby avoiding temperature rise asymmetry caused by distribution of current injected to the VCSEL and heat effects and helping the VCSEL to keep a working state.

Description

technical field [0001] The invention relates to an optical intermediary for coupling a VCSEL laser to a silicon-based photonic integrated circuit, in particular to a coupling method for a VCSEL laser and a grating structure in a silicon-based photonic integrated circuit. Background technique [0002] The development of supercomputers and data centers has put forward higher and higher demands on the working speed of microprocessors and the speed and bandwidth of communication between processors. Microprocessors based on transistor technology and the corresponding electrical interconnection communication between processors are becoming more and more unsustainable in the face of this growing demand for information processing and interconnection speed and bandwidth. The development of photonic integrated circuits (PIC) was put on the agenda. [0003] Silicon-based photonic integration technology is one of the possible ways to break through the above information processing bottl...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G02B6/42
CPCG02B6/4204G02B6/4244G02B6/4245
Inventor 田野
Owner HUNAN CITY UNIV