Modified epoxy resin for solvent-free copper-clad plate manufacturing procedure as well as preparation and application thereof
A technology of epoxy resin and liquid epoxy resin, which is applied in the field of modified epoxy resin for solvent-free copper-clad laminate manufacturing process, its preparation and application, and can solve the problem of insufficient performance, viscosity glass transition temperature, insufficient bonding performance, etc. problem, to achieve the effect of good adhesion, high glass transition temperature and low viscosity
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1～3
[0031] Embodiment 1~3, carry out according to the following steps:
[0032] Reaction of liquid bisphenol A type epoxy resin (epoxy equivalent of 170-175g / eq) (65-67)g and tetrabromobisphenol A (33-35)g at 170-180°C for 2-3 hours to obtain Modified epoxy resin. The physical properties of the finished product: the epoxy equivalent is 370-400g / eq, the bromine content is 19.5-20.5%, and the softening point is 60-65°C. Mix 100 parts by weight of the finished product, 2.5-3.5 parts by weight of the curing agent dicyandiamide and 0.001-2 parts by weight of the accelerator 2. methylimidazole in a mixing tank at 100-110°C, and then coat it on the glass fiber cloth , sent to a 170°C oven to bake into a prepreg, stacked the prepregs according to the thickness requirements, and sent them to a mill press at 170-190°C for compression molding. Embodiment 1~3 prepares the component consumption of modified epoxy resin as shown in the following table 1:
[0033] Table 1 (component dosage uni...
Embodiment 4～6
[0037] Liquid bisphenol A type epoxy resin (epoxy equivalent is 170 ~ 175g / eq) (46 ~ 52) g, high bromine epoxy resin (tetrabromobisphenol A epoxy resin, bromine content is 48 ~ 52%) (Epoxy equivalent is 380-400g / eq) (38-40) g, isocyanate MDI (10-15) g reacted at 160-170 °C for 3-4 hours to obtain a modified epoxy resin, and the physical properties of the obtained product: ring The oxygen equivalent is 330-400g / eq, the bromine content is 18.5-19.5%, and the softening point is 40-50°C. Repeat the making of the prepreg and the laminate in Example 1, replacing the curing agent dicyandiamide with phenolic resin. Embodiment 4~6 prepares the component consumption of modified epoxy resin as shown in the following table 2:
[0038] Table 2 (component dosage unit is g)
[0039] components Example 4 Example 5 Example 6 Liquid bisphenol A epoxy resin 46 48 52 High Brominated Epoxy Resin 38 39 40
[0040] After testing, the Tg of the plates obtained in...
Embodiment 7～9
[0042] React phenol novolac epoxy resin (softening point 20-30°C) (78-84g), reactive phosphorus compound DOPO (15-20g), tetraphenol ethane resin (1-2g) at 170-180°C for 2- After 3 hours, the modified epoxy resin is obtained, and the physical properties of the obtained finished product are as follows: the epoxy equivalent is 250-300g / eq, the phosphorus content is 2.0-2.8%, and the softening point is 60-70°C. Repeat the making of the prepreg and the laminate in Example 1. Embodiment 7~9 prepares the component consumption of modified epoxy resin as shown in the following table 3:
[0043] Table 3 (component dosage unit is g)
[0044] components Example 7 Example 8 Example 9 Phenol Novolac Epoxy Resin 78 80 84 reactive phosphorus compounds 15 18 20 tetraphenol ethane resin 2 1 1
[0045] After testing, the Tg of the plates obtained in Examples 7-9 is 150°C, and the flame retardancy reaches UL-94-V0. The properties are detailed in Table...
PUM
| Property | Measurement | Unit |
|---|---|---|
| Epoxy equivalent | aaaaa | aaaaa |
| Softening point | aaaaa | aaaaa |
| Epoxy equivalent | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
Login to View More