Aluminum substrate printed circuit board chemical nickel palladium gold process

A technology for printed circuit boards and aluminum substrates, applied in metal material coating technology, liquid chemical plating, coatings, etc., can solve the problem of rough and loose zinc replacement layer, short service life of nickel plating bath, and large attack on aluminum substrates and other issues to achieve the effect of easy operation, wide operation window and small attack

Active Publication Date: 2018-02-02
SHENZHEN CHENGGONG CHEM
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, the zinc replacement of the traditional aluminum substrate is a strong alkaline solution, and the general alkali equivalent is above 2.0, which has a great attack on the aluminum substrate itself and the covering film on the circuit, and the zinc replacement layer is rough and loose, which is easy to cause plating problems. The life of the nickel tank is short, and the secondary zinc dipping operation time of the alkaline zinc replacement process is only 15-35 seconds, the operating window is narrow, and the control is inconvenient. It is not suitable for the field of precision printed circuit boards.

Method used

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  • Aluminum substrate printed circuit board chemical nickel palladium gold process
  • Aluminum substrate printed circuit board chemical nickel palladium gold process
  • Aluminum substrate printed circuit board chemical nickel palladium gold process

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0050] Example 1: The following are examples according to the process steps:

[0051] 1> Cleaning: Commercial potion

[0052] 2> Two washes

[0053] 3> 50% nitric acid soaking: 20℃, 1min

[0054] 4> Two washes

[0055] 5> One-time acid zinc dip: 30g / L zinc sulfate, 50g / L nickel sulfate, 30g / L ammonium acetate, 10g / L DTPMP (diethylene triamine pentamethylene phosphonic acid) 10g / L; 30°C, pH 5.5, 1min;

[0056] 6> Two washes

[0057] 7> 50% nitric acid soaking: 20℃, 1min

[0058] 8> Secondary acid zinc dip: zinc sulfate 30g / L, nickel sulfate 50g / L, ammonium acetate 30g / L, DTPMP (diethylene triamine pentamethylene phosphonic acid) 10g / L; 30°C, pH 5.5, 5min.

[0059] 9> Two washes

[0060] 10> Electroless nickel plating: nickel sulfate 25g / L, citric acid 20g / L, sodium hypophosphite 20g / L, lactic acid 20g / L, succinic acid 10g / L, thiourea 1mg / L, pH value adjusted to 4.5 with ammonia, The temperature is 89°C, 25min.

[0061] 11> Two washes

[0062] 12> Electroless palladium plating: palladium sulfat...

example 2

[0066] Example 2: The following examples follow the process steps:

[0067] 1> Cleaning: Commercial potion

[0068] 2> Two washes

[0069] 3> 50% nitric acid soaking: 20℃, 30S

[0070] 4> Two washes

[0071] 5> One-time acid zinc dip: 45g / L zinc sulfate, 30g / L nickel sulfate, 10g / L ammonium acetate, 20g / L DTPMP (diethylene triamine pentamethylene phosphonic acid) 20g / L; 25°C, pH 5.2, 2min;

[0072] 6> Two washes

[0073] 7> 50% nitric acid soaking: 20℃, 1min

[0074] 8> Secondary acid zinc dip: 45g / L zinc sulfate, 30g / L nickel sulfate, 10g / L ammonium acetate, 20g / L DTPMP (diethylene triamine pentamethylene phosphonic acid) 20g / L; 25℃, pH value 5.2, 3min;

[0075] 9> Two washes

[0076] 10> Electroless nickel plating: nickel sulfate 20g / L, citric acid 20g / L, sodium hypophosphite 30g / L, lactic acid 15g / L, succinic acid 15g / L, thiourea 3mg / L, pH value adjusted to 4.5 with ammonia, The temperature is 70°C, 25min.

[0077] 11> Two washes

[0078] 12> Electroless palladium plating: palladium sulfat...

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PUM

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Abstract

The invention discloses a chemical NiPdAu technology for an aluminum base material printed wiring board. The technology includes the following steps of cleaning, nitric acid pickling, primary acid-stage zinc replacement, nitric acid zinc deplating, secondary acid-stage zinc replacement, chemical nickel plating, chemical palladium plating and chemical gilding. By the adoption of the primary acid-stage zinc replacement and the secondary acid-stage zinc replacement in the technology, compared with a traditional alkaline zinc dipping solution, the acid-base environment of an acid zinc dipping solution adopted is mild, attack to aluminum is small, the reaction speed is relatively low in times of zinc replacement, a zinc layer is quite compact. Nickel sulfate and zinc sulfate are included in the chemical NiPdAu technology and can be dissolved into water in the acid environment, and nickel replacement can happen while zinc replacement is conducted. Due to the existence of nickel, a catalytic activity center is provided for chemical nickel plating, the amount of zinc entering a chemical nickel-plating solution is reduced, and the service life of the chemical nickel-plating solution is prolonged.

Description

Technical field [0001] The invention relates to the technical field of integrated circuits, in particular to an aluminum substrate printed circuit board chemical nickel-palladium-gold process. Background technique [0002] Printed circuit boards (PCB circuit boards), also known as printed circuit boards, are providers of electrical connections for electronic components. Printed circuit boards have developed from single-layer to double-sided, multilayer and flexible boards, and are constantly developing in the direction of high precision, high density and high reliability. Continuously shrinking volume, reducing costs, and improving performance have enabled printed circuit boards to maintain strong vitality in the development of future electronic products. In the future, the development trend of printed circuit board manufacturing technology is to develop in the direction of high density, high precision, fine aperture, fine wire, small spacing, high reliability, multilayer, high-...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C18/36C23C18/44C23C18/48C23C18/18
CPCC23C18/1637C23C18/1651C23C18/1844C23C18/36C23C18/44C23C18/48
Inventor 王江锋沈文宝汪文珍刘可王辉
Owner SHENZHEN CHENGGONG CHEM
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