Flexible substrate repair structure, manufacturing method, and detection and repairing method

A technology of flexible substrates and manufacturing methods, applied in semiconductor/solid-state device manufacturing, circuit bendable/stretchable parts, circuits, etc. Waste and other problems, to achieve the effect of reducing manufacturing costs, good adhesion, and reducing color difference

Active Publication Date: 2017-08-01
HANNSTAR DISPLAY CORPORATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

After inspection, flexible substrates with these defects may be judged as rejects, increasing manufacturing costs
Otherwise, continu

Method used

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  • Flexible substrate repair structure, manufacturing method, and detection and repairing method
  • Flexible substrate repair structure, manufacturing method, and detection and repairing method
  • Flexible substrate repair structure, manufacturing method, and detection and repairing method

Examples

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Embodiment Construction

[0048] Please also refer to Figure 1A and figure 2 , The method for detecting and repairing a flexible substrate in this embodiment includes the following steps. Step S200 is performed to provide a flexible substrate 100 . The material of the flexible substrate 100 is, for example, polyimide (Polyimide; PI), polymethylmethacrylate (Polymethylmethacrylate; PMMA), polycarbonate (Polycarbonate; PC), polyethersulfone (Polyethersulfone; PES), polyamide (polyamide; PA), polynorbornene (polynorbornene; PNB), polyethylene terephthalate (polyethylene terephthalate; PET), polyether ether ketone (Polyether etherketone; PEEK), polyethylene naphthalate ( polyethylene naphthalate; PEN), polyethyleneimine (Polyethyleneimine; PEI) or a combination thereof.

[0049]In some embodiments, the flexible substrate 100 is formed on a rigid carrier 110 , and a de-bonding layer 108 has been formed on the rigid carrier 110 . In addition, the release layer 108 of a suitable material can be selected...

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Abstract

The invention provides a flexible substrate repair structure, a manufacturing method, and a detection and repairing method. The flexible substrate repair structure includes a flexible substrate and at least one repairing layer, regular sunken parts formed on the flexible substrate. The repairing layer is located on the flexible substrate and fills the regular sunken parts. The material of the at least one repairing layer includes a polysilazane compound, which is represented as the chemical formula (I), wherein Rx, Ry, and Rz are repsectively hydrogen atoms, substituted alkyl groups, non-substituted alkyl groups, alkenyl groups, or aromatic groups, carbon number being 1 to 10. The repairing layer can avoid or reduce problems of cracks or ruptures on a film layer on the flexible substrate.

Description

technical field [0001] The invention relates to the field of substrate manufacturing, in particular to a flexible substrate repair structure, a manufacturing method and a detection and repair method. Background technique [0002] During the manufacturing, post-treatment and transmission of flexible substrates (also known as flexible substrates, flexible substrates), defects may occur on the surface or inside. After inspection, the flexible substrate with these defects may be judged as waste, which increases the manufacturing cost. Otherwise, continuing the subsequent processing and production on the flexible substrate with these defects will reduce the product qualification rate. Therefore, how to repair the defects of the flexible substrate has become an important subject in this field. Contents of the invention [0003] In order to solve the above technical problems, the purpose of the present invention is to provide a flexible substrate repair structure, improve produ...

Claims

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Application Information

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IPC IPC(8): H01L21/02H01L23/13H01L23/14
CPCH01L21/02H01L23/13H01L23/14B29C37/0082B29C73/02B29K2995/0092H05K1/0281
Inventor 王朝仁何家充
Owner HANNSTAR DISPLAY CORPORATION
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