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A kind of ti5si3 intermetallic compound micro-nano wire and preparation method thereof

An intermetallic compound, micro-nano technology, applied in the direction of metal silicide, nanotechnology, nanotechnology, etc., can solve the problems of low efficiency of equipment requirements, less preparation and research, complicated preparation process, etc., and achieve low cost and low equipment requirements , The preparation process is simple and stable

Active Publication Date: 2019-04-02
NORTH CHINA ELECTRIC POWER UNIV (BAODING)
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Currently for Ti 5 Si 3 For intermetallic compounds, most of the research focuses on the development of structural materials, but there are still few preparations and researches on their micro-nano-ization, especially micro-nano wires.
Du Pi's research group at Zhejiang University invented an atmospheric pressure chemical vapor deposition (APCVD) method to prepare Ti 5 Si 3 and TiSi 2 A method for composite nanonails and nanowire clusters (ZL 200610050486.5 and ZL 200610050490.1), which realizes Ti 5 Si 3 and TiSi 2 The preparation of composite nanomaterials has lower requirements on equipment and higher efficiency, but the preparation process of this method is complicated and the cost is high

Method used

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  • A kind of ti5si3 intermetallic compound micro-nano wire and preparation method thereof
  • A kind of ti5si3 intermetallic compound micro-nano wire and preparation method thereof
  • A kind of ti5si3 intermetallic compound micro-nano wire and preparation method thereof

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] (1) Raw material preparation: ready to prepare Ti 5 Si 3 The raw materials required for intermetallic compound micro-nano wire materials are weighed by mass percentage, industrial pure copper 96.2%, copper powder 1.9%, titanium powder 1.4%, silicon powder 0.5%;

[0021] (2) Mixing and pressing: Fully mix the weighed copper powder, titanium powder and silicon powder, and then press the uniformly mixed powder into a prefabricated block with a length of 20 mm, a width of 20 mm, and a height of 15 mm;

[0022] (3) Melting and cooling: under the protection of argon, place the weighed industrial pure copper in a high-frequency induction furnace and heat it to 1300°C, add the pressed prefabricated block to the molten copper melt, and wait for the prefabricated block After it disappears completely, stir it evenly with a graphite rod. After 3 minutes of heat preservation, pour the alloy melt into a cast iron square mold to cool and solidify;

[0023] (4) Corrosion extraction: ...

Embodiment 2

[0026] (1) Raw material preparation: ready to prepare Ti 5 Si 3 The raw materials required for the intermetallic compound micro-nano wire material are weighed by mass percentage, 88.4% of industrial pure copper, 5.8% of copper powder, 4.3% of titanium powder, and 1.5% of silicon powder;

[0027] (2) Mixing and pressing: Fully mix the weighed copper powder, titanium powder and silicon powder, and then press the uniformly mixed powder into a prefabricated block with a length of 20 mm, a width of 20 mm, and a height of 15 mm;

[0028] (3) Smelting and cooling: under the protection of argon, place the weighed industrial pure copper in a high-frequency induction furnace and heat it to 1400°C, add the pressed prefabricated block to the molten copper melt, and wait for the prefabricated block After it disappears completely, stir it evenly with a graphite rod, and after holding the heat for 3 minutes, pour the alloy melt into a cast iron U-shaped mold to cool and solidify;

[0029] ...

Embodiment 3

[0032] (1) Raw material preparation: ready to prepare Ti 5 Si 3 The raw materials required for the intermetallic compound micro-nano wire material are weighed by mass percentage, 82.4% of industrial pure copper, 8.8% of copper powder, 6.5% of titanium powder, and 2.3% of silicon powder;

[0033] (2) Mixing and pressing: Fully mix the weighed copper powder, titanium powder and silicon powder, and then press the uniformly mixed powder into a prefabricated block with a length of 20 mm, a width of 20 mm, and a height of 15 mm;

[0034] (3) Melting and cooling: under the protection of argon, place the weighed industrial pure copper in a high-frequency induction furnace and heat it to 1500°C, add the pressed prefabricated block to the molten copper melt, and wait for the prefabricated block After it disappears completely, stir it evenly with a graphite rod. After 4 minutes of heat preservation, pour the alloy melt into a copper U-shaped mold to cool and solidify;

[0035] (4) Corr...

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Abstract

The invention belongs to the field of micro-nano materials of intermetallic compounds, and particularly relates to a Ti5Si3 intermetallic compound micro-nano wire and a preparation method thereof. The preparation method includes steps, such as material preparation, mixing and pressing, smelting and cooling, and corrosion and extraction. The invention has the characteristics of simple process, low equipment requirement, low cost and high production efficiency, and moreover, the size of the Ti5Si3 intermetallic compound micro-nano wire can be controlled by changing cooling speed in the process of alloy solidification; the prepared Ti5Si3 intermetallic compound micro-nano wire is in a crystalline state, has good thermostability and good high-temperature strength, and has certain flexibility and high temperature oxidation resistance, the diameter is 20nm to 200nm, and the length is 5mu m to 100mu m.

Description

Technical field: [0001] The invention belongs to the field of intermetallic compound micro-nano materials, in particular to a Ti 5 Si 3 Intermetallic compound micro-nano wire and its preparation method. Background technique: [0002] With the development of electronic technologies such as sensors and lasers, micro-nano materials have broad application prospects in microelectronics technology due to their excellent physical and chemical properties and help to realize the miniaturization of electronic devices. increasing attention and research. Researchers from various countries have successively developed micro-nanowire materials such as carbon nanotubes, SiC micro-nanowires, nano-diamond-coated Si micro-nanowires, and some metal oxides and intermetallic compounds. Ti 5 Si 3 Because intermetallic compounds have the same metal bonds as their metals and covalent bonds that do not exist in metals, they have some properties of both metals and ceramics, such as high electrica...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C01B33/06B82Y30/00B82Y40/00
CPCB82Y30/00B82Y40/00C01B33/06C01P2002/72C01P2004/03C01P2004/16
Inventor 丁海民王贤龙柳青石玉
Owner NORTH CHINA ELECTRIC POWER UNIV (BAODING)