Application of triamine-substituted phenol or triamine-substituted thiophenol and microetching treatment solution

A technology of micro-etching treatment and thiophenol, which is applied in the application of triamine-substituted phenol or triamine-substituted thiophenol and the field of micro-etching treatment solution, which can solve the problem of insufficient thickness of anti-oxidation protective film and rough appearance of copper surface , Copper pad area becomes smaller, etc.

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A technology of micro-etching treatment and thiophenol, which is applied in the application of triamine-substituted phenol or triamine-substituted thiophenol and the field of micro-etching treatment solution, which can solve the problem of insufficient thickness of anti-oxidation protective film and rough appearance of copper surface , Copper pad area becomes smaller, etc.

CN107022762BActive Publication Date: 2019-07-30GUANGDONG GUANGHUA SCI TECH +1

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Embodiment approach 1

[0050] Embodiment 1: According to the normal PCB production process, a copper-gold mixed board is prepared. The ratio of the area of the gold surface to the area of the copper surface is 500:1. Each micro-etching time is 1 minute, and the micro-etching amount is 1.0-1.5 μm. After different times of micro-etching, the reduction ratio of the copper area connected to the gold surface is tested. During the test, it is necessary to adjust the concentration of hydrogen peroxide in the solution to ensure that the microetching solution of the embodiment of the present invention and the microetching solution of the comparative example have the same microetching rate on the copper clad laminate (not connected to the gold surface).

Embodiment approach 2

[0051] Embodiment 2: Prepare a copper-gold mixed board, the ratio of the area of the gold surface to the area of the copper surface is 500:1, and it is processed through the following process:

[0052] Degreasing cleaning - washing - micro-etching - washing - OSP - washing - drying.

[0053] Among them, the acid degreasing agent TS-Acidclean 6151 of Dongshuo Company is used for degreasing and cleaning (a mature product of Dongshuo Company, which has been widely used by customers. Its function is to clean the copper surface and remove stains, fingerprints and oils on the copper surface. and other pollutants, provide a clean copper surface for the subsequent operation), the operating temperature is 40°C, and the treatment time is 1 minute; the microetching solution of the present invention is used for microetching, and its effect is to micro-roughen the copper surface, and the operating temperature is 30°C , the processing time is 1 minute, and the amount of microetching is ...

Embodiment 1

[0056]

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Abstract

The invention relates to micro-etching treating fluid. The micro-etching treating fluid comprises 30.0-60.0 g / L of sulfuric acid, 10.0-20.0 g / L of hydrogen peroxide, 0.1-1.0 g / L of hydrogen peroxide stabilizer, 2.0-5.0 g / L of inhibitor and 1 L of added water. The inhibitor is selected from the triamine base substituted phenol or the triamine base substituted thiophenol. The above micro-etching treating fluid is used for printed circuit board OSP pretreatment, a clean and rough copper surface can be formed, a protection film can be formed in combination with a copper face in the micro-etching process, the copper face electron supplying speed during the copper-gold electrochemical reaction is reduced, accordingly the potential difference between the copper and the gold is reduced, the biting corrosion rate of a copper welding pad is reduced, generation of the galvanic effect is restrained to the maximum degree, the phenomena of the color difference, area reduction or line excessive corrosion or even biting off cannot happen to the copper face connected with the gold face and obtained after micro-etching treatment, and meanwhile the phenomenon of coloring after OSP treatment can be effectively prevented from happening to the copper surface.

Description

technical field [0001] The invention relates to the technical field of printed circuit board chemicals, in particular to the application of triamine-substituted phenol or triamine-substituted thiophenol and a microetching treatment solution. Background technique [0002] During the rapid development of printed circuit boards, due to the high popularity of consumer electronic products such as smart phones and tablet computers, the traditional use of copper wires as signal transmission has been unable to adapt to the high-frequency and high-speed applications of the above-mentioned consumer electronic products. , a copper / gold hybrid printed circuit board is proposed and applied to the above-mentioned consumer electronic products. In the design of copper / gold mixed printed circuit boards, there are often gold-copper (Au-Cu) solder connections, especially when the gold / copper area ratio exceeds 200:1, when the organic solderable protective film (OSP) After treatment, on the co...

Claims

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Application Information

Patent Timeline

30 Jul 2019

Publication

CN107022762B

IPC: C23F1/18

CPC: C23F1/18

Inventors: 叶绍明; 肖定军