Semiconductor production process and device

Abstract

The invention discloses a semiconductor production process and device. The semiconductor production process comprises the steps of providing a whole lead framework, performing pin semi-cutting after injection molding of the lead framework, and sequentially performing shaping, electroplating and single-particle separation, wherein the internal stress and arch deformation which are generated after pin semi-cutting can be eliminated by shaping. By adjusting the production process, a pin is immediately shaped after semi-cutting, the internal stress and the arch deformation which are generated by pin semi-cutting are eliminated, subsequent electroplating and single-particle separation can be smoothly performed, the problems of difficulty in equipment loading and uploading during electroplating and single-particle separation, material stuck and inaccurate positioning of a separation die are effectively prevented, and the product yield is improved; and meanwhile, the sheet width of the whole lead framework can also be expanded, the number of single-particle separation is increased, and the production efficiency is improved.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a semiconductor production process and device. Background technique [0002] Semiconductor (Semiconductor) refers to a material whose conductivity is between that of a conductor (Conductor) and an insulator (Insulator) at room temperature. In the process of semiconductor packaging, lead frames are often used as the chip carrier of integrated circuits. The key structural part of the circuit, it acts as a bridge connecting the external wires, most of the semiconductor integrated blocks need to use the lead frame, and it is an important basic material in the electronic information industry. At present, most semiconductor packaging products require tin plating on the side of the pins of the lead frame to improve the soldering firmness of the product on the PCB. The half-cut method of the pins of the lead frame can meet this requirement. The main process flow of the lead fram...

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Problems solved by technology

This process has the following defects: after the half-cutting of the pins, the entire lead frame will be arched and deformed, which will lead to problems such as difficulty in loading and unloading equipment, material jams, and inaccurate positioning of the separation mold during the process of electroplating and separating single products. The product is scrapped, and the amount of arching deformation after half-cutting the whole lead frame is proportional to its width, that is, the wider the lead frame is, the more serious the deformation is

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