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A kind of preparation method of special ceramic powder material for LED package

A technology of LED packaging and ceramic powder, which is applied in the direction of semiconductor devices, electrical components, circuits, etc., can solve the problems of unfavorable LED chip light transmission to the external space, ceramic powder agglomeration, and low light transmittance of materials, so as to avoid long-term Effects of large size and agglomeration, improvement of adsorption performance, and increase of specific surface area

Active Publication Date: 2020-07-28
YANCHUANG PHOTOELECTRIC TECH GANZHOU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The technical problem to be solved by the present invention is: Aiming at the serious agglomeration of ceramic powder used in traditional LED packaging, which leads to low light transmittance and low refractive index of the material, which is not conducive to transmitting the light emitted by the LED chip to the external space, a kind of Preparation method of special ceramic powder material for LED packaging

Method used

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Examples

Experimental program
Comparison scheme
Effect test

example 1

[0020]Weigh 400g of fresh pomelo peel, manually cut into pieces with a particle size of 1cm, and put the resulting pieces in a tray, and then move the tray into a greenhouse at a temperature of 26°C and a relative air humidity of 75%. , keep it at constant temperature and humidity for 10 days to mold naturally; when the natural mold is over, collect the moldy grapefruit peel fragments in the tray, rinse the moldy grapefruit peel fragments with clean water for 3 times, and then transfer the rinsed fragments to the oven. Dry at a temperature of 105°C to constant weight to obtain dry pieces, and place the obtained dry pieces in a carbonization furnace, and feed argon gas into the furnace at a rate of 10mL / min. ℃ / min rate program to heat up to 650°C, keep warm for 3 hours, cool to room temperature with the furnace, discharge, porous carbonized material; immerse the obtained porous carbonized material in a beaker with a mass concentration of 2g / L dopamine solution, soak After 30 mi...

example 2

[0023] Weigh 500g of fresh pomelo peel, manually cut into pieces with a particle size of 3cm, put the resulting pieces in a tray, and then move the tray into a greenhouse at a temperature of 30°C and a relative humidity of 80%. , constant temperature and humidity to stand for 15 days to mold naturally; when the natural mold is over, collect moldy grapefruit peel fragments in the tray, and rinse the moldy grapefruit peel fragments with clean water for 5 times, and then transfer the rinsed fragments to the oven. Dry to constant weight at a temperature of 110°C to obtain dried pieces, and place the obtained dry pieces in a carbonization furnace, and feed argon gas into the furnace at a rate of 20 mL / min. ℃ / min rate program temperature rise to 680 ℃, heat preservation carbonization 5h, cool to room temperature with the furnace, discharge, porous carbonized material; immerse the obtained porous carbonized material in a beaker filled with a mass concentration of 2g / L dopamine solutio...

example 3

[0026] Weigh 450g of fresh pomelo peel, manually cut into pieces with a particle size of 2cm, put the resulting pieces in a tray, and then move the tray into the greenhouse, at a temperature of 28°C and a relative humidity of 78%. , keep it at constant temperature and humidity for 12 days to naturally mold; when the natural mold is over, collect moldy grapefruit peel fragments in the tray, and rinse the moldy grapefruit peel fragments with clean water 4 times, and then transfer the rinsed fragments to an oven. Dry at a temperature of 108°C to a constant weight to obtain dry pieces, and place the obtained dry pieces in a carbonization furnace, and feed argon gas into the furnace at a rate of 15mL / min. ℃ / min rate program temperature rise to 665 ℃, heat preservation carbonization 4h, cool down to room temperature with the furnace, discharge, porous carbonized material; immerse the obtained porous carbonized material in a beaker filled with a mass concentration of 2g / L dopamine sol...

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Abstract

The invention belongs to the technical field of packaging materials, and particularly relates to a special LED (light-emitting diode) packaging ceramic powder material preparation method. Shaddock peels are mildewed and eroded by mould, pore structures are enriched, the mildewed shaddock peels are dried and carbonized to prepare porous carbonized materials, the porous carbonized materials are impregnated in dopamine solution to prepare modified porous carbonized wet materials, dopamine adhered to surfaces of the porous carbonized materials is used for complexing aluminum ions and yttrium ions in solution, generated deposits are adsorbed by the porous carbonized wet materials by taking ammonia water as a deposition agent, cores of the carbonized materials are removed by calcination to obtain calcined materials containing yttrium oxide and aluminum oxide, and finally, the calcined materials, nano-zirconia and the like are mixed, ball-milled, sprayed and granulated to obtain a special LED packaging ceramic powder material. The obtained powder material is good in dispersity and narrow in particle size distribution and effectively solves the problem of low light transmittance of traditional ceramic powder.

Description

technical field [0001] The invention belongs to the technical field of packaging materials, and in particular relates to a preparation method of a special ceramic powder material for LED packaging. Background technique [0002] As a new type of lighting source, LED is being more and more widely used in various occasions due to its outstanding advantages of energy saving, environmental protection, high luminous efficiency, and long life. Now it can be used as large and small lamps such as street lamps and advertising lamps. [0003] LED light-emitting diodes have become a research and application hotspot due to energy saving. The important part of the LED light-emitting diode is the chip, and the LED package refers to the package of the light-emitting chip, which is quite different from the package of the integrated circuit. Under normal circumstances, the die of a discrete device is sealed in a package body, and the function of the package is mainly to protect the die and c...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C04B35/10H01L33/56
CPCC04B35/10C04B2235/3225C04B2235/3244C04B2235/48C04B2235/483C04B2235/602C04B2235/656C04B2235/6562C04B2235/6567C04B2235/6581C04B2235/663C04B2235/96C04B2235/9607C04B2235/9646H01L33/56
Inventor 许丽君李雪晴
Owner YANCHUANG PHOTOELECTRIC TECH GANZHOU