Method for preparing micron-order nickel-based high-temperature alloy powder transmission electron microscope film sample

A nickel-based superalloy, transmission electron microscope technology, which is applied in the preparation, sampling, measuring device and other directions of test samples, can solve the problems of long time consumption, poor coating quality, poor compatibility between copper and nickel powder, etc. Short time, good coating quality, good embedding effect

Active Publication Date: 2017-09-01
SOUTH CHINA UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, for powder materials that require no damage to the powder particles and are coarse and hard, it brings certain difficulties to sample preparation.
Although predecessors have made some achievements in the preparation of TEM films from powder materials: such as the use of electroless nickel plating, copper plating, glue embedding, etc., these methods are not suitable for the preparation of TEM film samples of large-particle nickel-based superalloy powders. still difficult
For example, the superalloy particles embedded by electroplating copper method, because the hardness of the particles is much higher than that of the embedded copper coating, and the compatibility of copper and nickel powder is worse than that of nickel, the particles will fall off during the ion thinning process, and the thinning process In , copper is more easily thinned, resulting in particles without a carrier
However, electroless nickel plating often takes a long time for the preparation of large-particle nickel-based superalloy powder transmission electron microscope films, and the quality of its coating is worse than that of electroplating, and the nickel powder cannot be tightly embedded.
In addition, when glue is used for embedding, since the hardness of the superalloy particles is much higher than that of the glue-embedded bonding matrix, direct slicing will come out of the matrix
Finally, in terms of mechanical thinning, block slicing has been used in the past, which takes a long time and has a low yield

Method used

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  • Method for preparing micron-order nickel-based high-temperature alloy powder transmission electron microscope film sample
  • Method for preparing micron-order nickel-based high-temperature alloy powder transmission electron microscope film sample
  • Method for preparing micron-order nickel-based high-temperature alloy powder transmission electron microscope film sample

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Embodiment

[0026] GH96 nickel-based superalloy powder (mass percentage of alloy: Cr: 16.10, Co: 12.92, W: 4.0, Mo: 4.0, Ti: 3.72, Ni: Bal.) transmission electron microscope film with a particle size of 63-75 μm Sample preparation method, specific steps are as follows:

[0027] (1) Prepare the electroplating solution, add 1g of micron-grade GH96 nickel-based superalloy powder into the electroplating solution, and use mechanical stirring to suspend the nickel-based superalloy powder particles to obtain a suspension; the composition of the electroplating solution is: NiSO 4 7H2O 150g, NaCl 10g, H 3 BO 3 35g, Na 2 SO 4 120g, sodium lauryl sulfate 0.1g, add deionized water to 1L.

[0028] (2) Put the cathode nickel sheet and the anode nickel sheet into the suspension obtained in step (1) in the manner that the cathode nickel sheet is down and the anode nickel sheet is facing up and down (its structural representation is as follows: figure 1 shown), the nickel-based superalloy powder is...

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Abstract

The invention belongs to the technical field of alloy material preparation and representation, and discloses a method for preparing a micron-order nickel-based high-temperature alloy powder transmission electron microscope film sample. The method comprises the following steps: adding nickel-based alloy powder into an electroplating liquid, and stirring so as to obtain a suspension; putting a cathode nickel piece and an anode nickel piece into the suspension so as to obtain uniform nickel-based alloy powder on the cathode nickel piece; connecting a power supply to implement electroplating, wrapping the nickel-based alloy powder with a nickel plated layer, performing mechanical thinning so as to obtain a circular piece of which the diameter is 3 mm, and further grinding so as to obtain a sample which takes the shape of a wedge in a thickness direction; and pasting the sample at the opening of an opened copper ring, enabling the thin end of the wedge to be close to the opening center of the copper ring, and putting the opened copper ring with the sample into an ion thinning instrument for ion thinning, thereby obtaining a film sample area for transmission electronic microscopy observation. The method provided by the invention has the advantages of being short in time, high in plated layer quality and good in wrapping effect of the nickel-based high-temperature alloy powder.

Description

technical field [0001] The invention belongs to the technical field of preparation and characterization of alloy materials, and in particular relates to a method for preparing a micron-sized nickel-based superalloy powder transmission electron microscope film sample. Background technique [0002] The microscopic analysis of powder materials is an important method to study the structure and properties of powders, and it is a necessary way to further improve the properties of materials. The microstructural analysis of powder materials necessarily involves the preparation of TEM samples. Some powder materials can be prepared by crushing the powder, grinding to make a suspension, and using a supported film dispersion method. However, for powder materials that require no damage to the powder particles and are coarse and hard, it brings certain difficulties to sample preparation. Although predecessors have made some achievements in the preparation of TEM films from powder materi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01N1/28
CPCG01N1/286G01N2001/2866
Inventor 焦东玲钟伟杰刘仲武许文勇李周张国庆
Owner SOUTH CHINA UNIV OF TECH
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