Methods for integration of organic and inorganic materials for OLED encapsulating structures

Abstract

The disclosure relates to methods for integration of organic and inorganic materials for OLED encapsulating structures. Embodiments of the disclosure provide interface integration and adhesion improvement methods used on a transparent substrate for OLED or thin film transistor applications. In one embodiment, a method of enhancing interface adhesion and integration in a film structure disposed on a substrate includes performing a plasma treatment process on an inorganic layer disposed on a substrate in a processing chamber to form a treated layer on the substrate, wherein the substrate includes an OLED structure, controlling a substrate temperature less than about 100 degrees Celsius, and forming an organic layer on the treated layer. Furthermore, an encapsulating structure for OLED applications includes an inorganic layer formed on an OLED structure on a substrate, an electron beam treated layer formed on the inorganic layer, and an organic layer formed on the electron beam treated layer.

Description

technical field [0001] Embodiments of the present disclosure generally relate to methods for improving interfacial adhesion and integration. More specifically, embodiments of the present disclosure relate to interface management methods performed on the surface of a substrate used in thin film transistor or OLED applications. Background technique [0002] Organic light-emitting diode displays (OLEDs) have recently attracted much attention in display applications due to their faster response time, larger viewing angle, higher contrast ratio, lighter weight, lower power, and compliance to flexible substrates. In general, conventional OLEDs emit light by using one or more layers of organic materials sandwiched between two electrodes. The one or more layers of organic material include one layer capable of unipolar (hole) transport and another layer for electroluminescence, and thus reduce the operating voltage required for OLED displays. [0003] In addition to organic materia...

AI Technical Summary

Problems solved by technology

Poor interfacial adhesion often allows film detachment or particle generation, thereby detrimentally contaminating the device structure 100 and ultimately leading to device failure

Additionally, poor adhesion at the interface 113, 114 can also increase the likelihood of film cracking, thereby allowing moisture or air to infiltrate the device structure 100, thereby degrading the device electrical performance

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