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A kind of phase-change heat-conducting material and its preparation method and composition for preparing phase-change heat-conducting material

A phase change thermal conductivity and composition technology, applied in the field of thermal conductive materials, can solve the problems of insufficient contact of components, reduced thermal conduction efficiency, large contact thermal resistance, etc., and achieve the effects of easy acquisition, improved thermal conduction efficiency, and reduced contact thermal resistance.

Active Publication Date: 2019-08-02
KUSN ZHONGDI MATERIALS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the market mainly provides thermal pads with silicone gel system. Although silicone gel can achieve a hardness of shore C 20 or even lower, the material sacrifices strength and convenience, and the operability is greatly reduced.
On the other hand, the silicone gel system thermal pad is solid under the operating temperature environment, and the contact with the components is not sufficient, and there will always be a large contact thermal resistance, which directly reduces the heat conduction efficiency and is not conducive to timely heat dissipation

Method used

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  • A kind of phase-change heat-conducting material and its preparation method and composition for preparing phase-change heat-conducting material
  • A kind of phase-change heat-conducting material and its preparation method and composition for preparing phase-change heat-conducting material
  • A kind of phase-change heat-conducting material and its preparation method and composition for preparing phase-change heat-conducting material

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preparation example Construction

[0031] The embodiment of the present invention also provides a method for preparing the above-mentioned phase-change thermally conductive material, which includes: calendering a mixture of polymer monomers, thermally conductive powders, flame retardants and photoinitiators, and then photocuring and molding.

[0032] It should be noted that after photo-curing and molding, the polymer monomer undergoes a cross-linking reaction under the induction of the photo-initiator to form a spatial network structure, which tightly connects the heat-conducting powder and the flame retardant together.

[0033] After photocuring and molding, the network polymer is cured and formed, so that the phase change thermal conductive material forms a stable and excellent toughness space network skeleton, and each component is closely connected and embedded in the space network skeleton. This makes the toughness of the phase change thermally conductive material and the ability to adhere to components ver...

Embodiment 1

[0047] This embodiment provides a composition for preparing a phase-change thermally conductive material, which includes:

[0048] 10g of n-octyl acrylate, 30g of acrylonitrile, 60g of isopropyl methacrylate;

[0049] 225g of alumina powder;

[0050] 60g of aluminum hydroxide, 50g of fumed silica;

[0051] 2 g of 2-hydroxy-methylphenylpropan-1-one, 1 g of acylphosphine oxide.

Embodiment 2

[0053] This embodiment provides a composition for preparing a phase-change thermally conductive material, which includes:

[0054] 10g of 2-ethylhexyl acrylate, 40g of acrylonitrile, 50g of isopropyl methacrylate;

[0055] 150g of alumina powder, 50g of aluminum nitride powder;

[0056] 50g of aluminum hydroxide, 50g of fumed silica;

[0057] 1 g of acylphosphine oxide, 2 g of 2-methyl-1-(4-methylthiophenyl)-2-morpholino-1-propanone.

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Abstract

A phase-change heat-conducting material, a preparation method thereof, and a composition used for preparing the phase-change heat-conducting material relate to the technical field of heat-conducting materials. The composition comprises 10% to 45% of polymer monomers, 20% to 60% of heat conducting powder, 15% to 45% of flame retardants and the rest of photoinitiators by weight percentage. The polymer monomer includes at least one of acrylate, acrylonitrile, vinyl acetate and maleic acid. The preparation method includes pressing the mixture of polymer monomers, heat-conducting powder, flame retardant and photoinitiator, and then photocuring and forming. The phase-change heat-conducting material is prepared from the above-mentioned composition through the above-mentioned preparation method. The composition is easy to obtain, the cost is low, and the requirement for raw materials is reduced. The heat conduction material can reduce the contact thermal resistance with the components, and the heat conduction efficiency is high. The preparation method has a simple process, is easy to implement, and reduces investment costs.

Description

technical field [0001] The invention relates to the technical field of heat-conducting materials, in particular, to a phase-change heat-conducting material, a preparation method thereof, and a composition for preparing the phase-change heat-conducting material. Background technique [0002] As integration technology and microelectronic assembly become more and more intensive, the heat generated by electronic equipment tends to accumulate and increase rapidly. Every time the temperature of electronic components rises by 2°C, their reliability decreases by about 10%. Therefore, timely heat dissipation becomes an important factor affecting their service life. In order to ensure that electronic components can still work normally with high reliability under the ambient temperature, it is necessary to develop new thermal conductive materials to replace traditional materials. [0003] The thermal interface material is used to quickly transfer the heat emitted by the heating elemen...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08F220/18C08F220/44C08F118/08C08F283/10C08F299/06C08F122/02C08F291/12C08F2/44C08K3/22C08K3/36C08K3/28C08K3/00C08K3/04C08K13/02C09K5/14C09K5/02
CPCC09K5/02C09K5/14C08F2/44C08F118/08C08F122/02C08F220/18C08F220/44C08F283/008C08F283/105C08F299/065C08K3/00C08K3/04C08K3/22C08K3/28C08K3/36C08K13/02C08K2201/014C08K2003/2296C08K2003/282C08K2003/2227C08F220/1808
Inventor 刘伟德唐春峰
Owner KUSN ZHONGDI MATERIALS TECH
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