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Lead material for power strip and preparation method of lead material

A plug-in board and wire technology, used in the field of wire and cable materials, can solve the problems of poor flame retardancy, poor toughness, poor thermal stability, etc., and achieve the effects of good wear resistance, good rigidity and good thermal stability.

Inactive Publication Date: 2017-09-19
HEFEI HUAGAI BIOTECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In order to solve the problems of poor thermal stability, poor flame retardancy and poor toughness in existing plug-in board wires, the purpose of the present invention is to provide a wire material for plug-in boards and a preparation method thereof, and the prepared wire for plug-in The wire material of the electric board has the advantages of good flame retardancy, good toughness and good thermal stability

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0043] A wire material for plug-in boards, comprising the following raw materials in parts by weight: 110 parts of polyvinyl chloride, 25 parts of dicyclopentadiene, 22 parts of GNA type neoprene, 27 parts of polysulfone resin, and 19 parts of acetal resin , 18 parts of neoprene rubber, 17 parts of phenolic resin, 13 parts of epoxy fatty acid octyl ester, 6 parts of barium stearate, 3.5 parts of aluminum hydroxide, 0.4 part of bispentamethylene thiuram tetrasulfide, trimethylol 0.4 parts of propane trimethacrylate, 16 parts of ceramic fiber, 10 parts of graphite powder, 7 parts of nickel oxide, 13 parts of nano silicon carbide, 2 parts of flame retardant, 1.5 parts of antioxidant, 1.8 parts of compatibilizer, curing agent 1.0 parts and 0.9 parts of light stabilizer.

[0044] Polysulfone resin is added to the raw material. Polysulfone resin has the advantages of good rigidity, good toughness, good high temperature resistance and good insulation.

[0045] Acetal resin is added ...

Embodiment 2

[0064] A wire material for plug-in boards, comprising the following raw materials in parts by weight: 100 parts of polyvinyl chloride, 20 parts of dicyclopentadiene, 20 parts of GNA type neoprene rubber, 24 parts of polysulfone resin, and 15 parts of acetal resin , 16 parts of neoprene rubber, 13 parts of phenolic resin, 11 parts of epoxy fatty acid octyl ester, 5 parts of barium stearate, 3 parts of aluminum hydroxide, 0.3 parts of bispentamethylene thiuram tetrasulfide, trimethylol 0.2 parts of propane trimethacrylate, 13 parts of ceramic fiber, 8 parts of graphite powder, 5 parts of nickel oxide, 11 parts of nano-silicon carbide, 1 part of flame retardant, 1 part of antioxidant, 0.7 parts of compatibilizer, curing agent 0.8 parts and 0.6 parts of light stabilizer.

[0065] Polysulfone resin is added to the raw material. Polysulfone resin has the advantages of good rigidity, good toughness, good high temperature resistance and good insulation.

[0066] Acetal resin is added...

Embodiment 3

[0085] A wire material for plug-in boards, comprising the following raw materials in parts by weight: 120 parts of polyvinyl chloride, 30 parts of dicyclopentadiene, 24 parts of GNA type neoprene rubber, 30 parts of polysulfone resin, and 23 parts of acetal resin , 20 parts of neoprene rubber, 21 parts of phenolic resin, 15 parts of epoxy fatty acid octyl ester, 7 parts of barium stearate, 4 parts of aluminum hydroxide, 0.5 parts of bispentamethylene thiuram tetrasulfide, trimethylol 0.6 parts of propane trimethacrylate, 19 parts of ceramic fiber, 12 parts of graphite powder, 9 parts of nickel oxide, 15 parts of nano silicon carbide, 3 parts of flame retardant, 2 parts of antioxidant, 2.9 parts of compatibilizer, curing agent 1.2 parts and light stabilizer 1.2 parts.

[0086] Polysulfone resin is added to the raw material. Polysulfone resin has the advantages of good rigidity, good toughness, good high temperature resistance and good insulation.

[0087] Acetal resin is added...

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PUM

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Abstract

The invention provides a lead material for a power strip and a preparation method of the lead material and relates to the field of wires and cables. The lead material for the power strip is prepared from raw materials in parts by weight as follows: polyvinyl chloride, dicyclopentadiene, GNA type chloroprene rubber, polysulfone resin, acetal resin, chloroprene rubber, phenolic resin, epoxy fatty acid octyl ester, barium stearate, aluminum hydroxide, bis(pentamethylene)thiuram tetrasulfide, trimethylolpropane trimethacrylate, ceramic fiber, graphite powder, nickel oxide, nano silicon carbide, a flame retardant, an antioxidant, a compatilizer, a curing agent and a light stabilizer. The preparation method comprises the steps as follows: (1) raw material weighing; (2) mixing and granulation; (3) internal mixing; (4) mixing; (5) extrusion, injection molding and forming. The problems that existing power strip leads are poor in thermal stability, flame retardance and toughness are solved.

Description

technical field [0001] The invention belongs to the field of wire and cable materials, and in particular relates to a wire material used for a plug-in board and a preparation method thereof. Background technique [0002] With the development of science and technology, there are more and more types of electrical appliances, and there are also many types of plug-in boards derived therefrom. However, there are many existing plug-in boards. The wire on the wire is heated and softened, and in severe cases, it may even melt and burn, which seriously threatens people's life safety. [0003] In addition, the existing wiring board wires also have the problems of high hardness and poor toughness. Contents of the invention [0004] In order to solve the problems of poor thermal stability, poor flame retardancy and poor toughness in existing plug-in board wires, the purpose of the present invention is to provide a wire material for plug-in boards and a preparation method thereof, and...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L27/06C08L11/00C08L81/06C08L61/06C08K13/04C08K5/098C08K3/22C08K5/40C08K7/04C08K3/04C08K3/34C08K5/18
CPCC08L27/06C08K2003/2227C08K2201/011C08K2201/014C08L2201/02C08L2201/08C08L2203/20C08L2205/035C08L2205/08C08L11/00C08L81/06C08L61/06C08K13/04C08K5/098C08K3/22C08K5/40C08K7/04C08K3/04C08K3/34C08K5/18
Inventor 张安育
Owner HEFEI HUAGAI BIOTECH CO LTD