Etching method of three-dimensional microstructures and application of three-dimensional microstructure

A microstructure and three-dimensional technology, applied in the field of nanomaterials, can solve the problems of low cell capture efficiency and poor cell adhesion, and achieve the effect of changing poor cell adhesion, increasing roughness, and low price

Inactive Publication Date: 2017-09-26
WUHAN TEXTILE UNIV
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  • Abstract
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  • Claims
  • Application Information

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Problems solved by technology

[0004] Aiming at the above defects of the prior art, the present invention provides a method for etching three-dimensional microstructures. The surface of the substrate produced by this method has several concave microstructures, and the substrate can be used after being made into a microfluidic chip. Sorting and enriching large-throughput, label-free, and large-size circulating tumor cells can improve the ability to capture circulating tumor cells, thereby solving the problem of poor adhesion to cells caused by the smooth surface of substrates prepared by traditional methods and the technical problems of low cell capture efficiency

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  • Etching method of three-dimensional microstructures and application of three-dimensional microstructure

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Embodiment 1

[0031] 1. Take a piece of optical glass (area: 25*75mm 2 ), and then the optical glass was ultrasonically cleaned, dried, and then the TiO 2 Suspensions of micronanoparticles (TiO 2 The diameter of micro-nano particles is 0.5-1μm, TiO 2 The mass percent concentration of the suspension is 0.5%) sprayed on one surface of the optical glass sheet, and the optical glass sheet was dried at 25°C for 10 minutes, so that the surface of the optical glass sheet was deposited with TiO 2 micron particle coating;

[0032] 2. Soak the optical glass sheet in the etching solution for etching, the etching rate is 1 μm / min, the etching time is 20 minutes, the etching solution is a mixed solution of nitric acid and hydrofluoric acid, and the mass percentage concentration of nitric acid is 10%, the mass percentage concentration of hydrofluoric acid is 11.56%, after the etching is completed, the optical glass sheet is ultrasonically cleaned for 80 minutes, the ultrasonic frequency is 45KHz, and ...

Embodiment 2

[0037] 1. Take a piece of optical glass (area: 25*75mm 2 ), and then the optical glass was ultrasonically cleaned, dried, and then the TiO 2 Suspensions of micronanoparticles (TiO 2 The diameter of micro-nano particles is 1-1.5μm, TiO 2 The mass percent concentration of the suspension is 3%) sprayed on one surface of the optical glass sheet, and the optical glass sheet was dried in the air at 25°C for 10 minutes, so that TiO was deposited on the surface of the optical glass sheet 2 micron particle coating;

[0038] 2. Soak the optical glass sheet in the etching solution for etching. The etching rate is 10 μm / min, and the etching time is 12 minutes. The etching solution is a mixed solution of nitric acid and hydrofluoric acid, and the mass percentage concentration of nitric acid is 13%, and the mass percent concentration of hydrofluoric acid is 15.04%. After the etching is completed, the optical glass sheet is ultrasonically cleaned for 80 minutes, the ultrasonic frequency i...

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Abstract

The invention discloses an etching method of three-dimensional microstructures. The method comprises the steps as follows: a micro-nano particle suspension for inhibiting etching is applied to the surface of a substrate, drying treatment is performed to allow micro-nano particles to be deposed on the surface of the substrate, then the substrate is etched with an etching solution, and the substrate with the three-dimensional concave microstructures is obtained. Multiple concave microstructures are arranged on the surface of the substrate produced with the method, the substrate can be used for sorting and enriching large-flux, mark-free and large-size circulating tumor cells after being produced into a micro-fluidic chip, the capturing capacity for the circulating tumor cells can be improved, and the technical problems that substrates produced with traditional methods are poor in cell adhesion and low in cell capturing efficiency due to smooth surfaces are solved.

Description

technical field [0001] The invention belongs to the technical field of nanomaterials, and more specifically relates to a three-dimensional microstructure etching method and its application. Background technique [0002] The etching process is to remove the film layer not masked by the resist, so as to obtain exactly the same pattern on the film as on the resist film. Etching is to use chemical, physical or both chemical and physical methods to selectively remove the part of the film layer that is not masked by the resist, so that the pattern on the film is exactly the same as that on the resist film . Etching technology is mainly divided into dry etching and wet etching. Wet etching is a purely chemical reaction process, which refers to using the chemical reaction between the solution and the pre-etching material to remove the part not masked by the masking film material to achieve the purpose of etching. Wet etching has a wide range of applications in semiconductor proce...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/306B82Y30/00B82Y40/00
CPCB82Y30/00B82Y40/00H01L21/30604H01L21/30608
Inventor 刘侃高易凡张守坤张南刚李颂战
Owner WUHAN TEXTILE UNIV
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