Etching method of three-dimensional microstructures and application of three-dimensional microstructure

Abstract

The invention discloses an etching method of three-dimensional microstructures. The method comprises the steps as follows: a micro-nano particle suspension for inhibiting etching is applied to the surface of a substrate, drying treatment is performed to allow micro-nano particles to be deposed on the surface of the substrate, then the substrate is etched with an etching solution, and the substrate with the three-dimensional concave microstructures is obtained. Multiple concave microstructures are arranged on the surface of the substrate produced with the method, the substrate can be used for sorting and enriching large-flux, mark-free and large-size circulating tumor cells after being produced into a micro-fluidic chip, the capturing capacity for the circulating tumor cells can be improved, and the technical problems that substrates produced with traditional methods are poor in cell adhesion and low in cell capturing efficiency due to smooth surfaces are solved.

Description

technical field [0001] The invention belongs to the technical field of nanomaterials, and more specifically relates to a three-dimensional microstructure etching method and its application. Background technique [0002] The etching process is to remove the film layer not masked by the resist, so as to obtain exactly the same pattern on the film as on the resist film. Etching is to use chemical, physical or both chemical and physical methods to selectively remove the part of the film layer that is not masked by the resist, so that the pattern on the film is exactly the same as that on the resist film . Etching technology is mainly divided into dry etching and wet etching. Wet etching is a purely chemical reaction process, which refers to using the chemical reaction between the solution and the pre-etching material to remove the part not masked by the masking film material to achieve the purpose of etching. Wet etching has a wide range of applications in semiconductor proce...

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Problems solved by technology

[0004] Aiming at the above defects of the prior art, the present invention provides a method for etching three-dimensional microstructures. The surface of the substrate produced by this method has several concave microstructures, and the substrate can be used after being made into a microfluidic chip. Sorting and enriching large-throughput, label-free, and large-size circulating tumor cells can improve the ability to capture circulating tumor cells, thereby solving the problem of poor adhesion to cells caused by the smooth surface of substrates prepared by traditional methods and the technical problems of low cell capture efficiency

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