Assembling method of low-energy exploding foil initiator
An assembly method and technology of explosive foil, applied in the direction of blasting barrels, weapon accessories, offensive equipment, etc., can solve the problems of volume substrate processing and assembly difficulty, high integration, etc., and achieve volume reduction, high integration, and small volume Effect
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Embodiment 1
[0017] A method for assembling a low-energy detonating foil detonator, the detonating unit of the detonating foil detonator comprises a ceramic substrate, a metal Ti / Cu layer, a PC layer, an upper electrode Ti / W / Ti / Cu / Au, and a Schottky diode And Su8 acceleration bore, it is characterized in that its assembly method comprises the steps of following order:
[0018] (1) Pre-assembly preparation of the PCB board: smooth the surrounding area of the prefabricated PCB board with sandpaper, and rinse it with a Freon cleaning machine. The washing steps are Freon spraying for 1 minute, hot steaming for 3 minutes, and spraying for 1 minute;
[0019] (2) Adhesive substrate: Use XXX type single-component insulating adhesive to bond the processed substrate to a suitable position on the PCB board and cure it. The curing conditions are: temperature 150°C, time 60 minutes;
[0020] (3) Bonding Schottky diodes: Use XXX type two-component conductive adhesive to reversely bond Schottky diodes ...
Embodiment 2
[0025] A method for assembling a low-energy detonating foil detonator, the detonating unit of the detonating foil detonator comprises a ceramic substrate, a metal Ti / Cu layer, a PI layer, an upper electrode Ti / W / Ti / Cu / Au, and a Schottky diode and Su8 accelerated bore, characterized in that it comprises the steps in the following order:
[0026] (1) Preparation before assembly of the PCB board: sand the prefabricated PCB board around it smooth with sandpaper, and rinse it with a Freon cleaning machine. The washing steps are Freon spraying for 1 minute, hot steaming for 1 minute, and spraying for 1 minute;
[0027] (2) Adhesive substrate: Use XXX type single-component insulating adhesive to bond the processed substrate to a suitable position on the PCB board and cure it. The curing conditions are: temperature 145°C, time 70 minutes;
[0028] (3) Adhesive Schottky diode: use XXX type two-component conductive adhesive to reversely bond the Schottky diode to the upper electrode Ti / ...
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