Wet etching-based preparation method for light trapping structure with Ag nanowires embedded into silicon surface
A technology of wet etching and light trapping structure, applied in the fields of photovoltaic power generation, final product manufacturing, sustainable manufacturing/processing, etc., can solve the problems of reducing the service life of transparent conductive electrodes, increasing the cost of electrodes, etc., and improving the light trapping ability , Increase the contact area, the effect of no special requirements
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Embodiment 1
[0019] a. Clean the silicon wafer: soak the silicon wafer in analytical pure acetone for 2 minutes at room temperature, put the silicon wafer soaked in acetone into an ultrasonic container filled with deionized water, and clean it for 5 minutes; use CP4A lotion, Scratch the surface of the ultrasonically treated silicon wafers until the surface roughness is 0.9nm; put the silicon wafers treated with CP4A washing solution into 7% hydrofluoric acid aqueous solution, soak for 7min, and the silicon wafers treated with hydrofluoric acid aqueous solution Soak the wafer in an ultrasonic container filled with deionized water, wash it for 4 minutes to obtain a silicon wafer with a clean surface, blow dry the silicon wafer with nitrogen gas, and store it in a desiccator;
[0020] b. Prepare Ag nanowire suspension: Add Ag nanowires with a diameter of 90nm and a length of 20μm into an ultrasonic container filled with ethanol. W / cm 3 Disperse for 4 minutes under ultrasonic wave to obtain A...
Embodiment 2
[0029] a. Clean the silicon wafer: soak the silicon wafer in analytical pure acetone for 2 minutes at room temperature, put the silicon wafer soaked in acetone into an ultrasonic container filled with deionized water, and clean it for 3 minutes; use CP4A lotion, Scratch the surface of the ultrasonically treated silicon wafers until the surface roughness is 0.7nm; put the silicon wafers treated with CP4A washing solution into 7% hydrofluoric acid aqueous solution, soak for 6min, and put the silicon wafers treated with hydrofluoric acid aqueous solution Soak the wafer in an ultrasonic container filled with deionized water, wash it for 4 minutes to obtain a silicon wafer with a clean surface, blow dry the silicon wafer with nitrogen gas, and store it in a desiccator;
[0030] b. Preparation of Ag nanowire suspension: Add Ag nanowires with a diameter of 120 nm and a length of 40 μm into an ultrasonic container filled with ethanol. The mass ratio of Ag nanowires to ethanol is 1:100....
Embodiment 3
[0039] a. Clean the silicon wafer: soak the silicon wafer in analytical pure acetone for 2 minutes at room temperature, put the silicon wafer soaked in acetone into an ultrasonic container filled with deionized water, and clean it for 5 minutes; use CP4A lotion, Scratch the surface of the ultrasonically treated silicon wafers until the surface roughness is 0.4nm; put the silicon wafers treated with CP4A washing solution into 7% hydrofluoric acid aqueous solution, soak for 7min, and the silicon wafers treated with hydrofluoric acid aqueous solution Soak the wafer in an ultrasonic container filled with deionized water, wash it for 4 minutes to obtain a silicon wafer with a clean surface, blow dry the silicon wafer with nitrogen gas, and store it in a desiccator;
[0040] b. Preparation of Ag nanowire suspension: Add Ag nanowires with a diameter of 150nm and a length of 20μm into an ultrasonic container filled with ethanol. W / cm 3 Disperse for 4 minutes under ultrasonic wave to ...
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