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Polyphenyl ether resin and applications thereof

A technology of polyphenylene ether resin and general formula, applied in the field of polyphenylene ether resin, can solve the problems of affecting product stability, high risk factor, and large shrinkage rate

Active Publication Date: 2017-11-07
JIANGSU HECHENG ADVANCED MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] (4) flame retardant, self-extinguishing
However, the preparation method of butyllithium is relatively harsh and the risk factor is high
[0012] The allyl group is reacted with the terminal hydroxyl group to form a modified polyphenylene ether terminated by the terminal allyl group, but due to the activity of the allyl group, the hardening temperature is relatively high and the shrinkage rate is large
The introduction of bismaleimide-modified allyl-terminated polyphenylene ether solves the shortcomings of high hardening temperature and large shrinkage, but increases the reaction steps and the complexity of the product process, which in turn affects the product stability
[0013] The curing temperature of polyphenylene ether terminated with acrylate groups is more suitable, but the adhesion of acrylate-modified polyphenylene ether to the substrate is not enough

Method used

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  • Polyphenyl ether resin and applications thereof
  • Polyphenyl ether resin and applications thereof
  • Polyphenyl ether resin and applications thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0133] Preparation of compound Ⅱ-a-1

[0134]

[0135] Dissolve 1kg of polymer polyphenylene ether into 10L of toluene solution, heat and stir to make it fully dissolved. 10% by weight of BPO and bisphenol A were added. Keep at 110°C for 6 hours.

[0136] After the reaction was stopped, most of the toluene solution was removed under reduced pressure, and then 5L of methanol was added to precipitate 930g of white solid, which was designated as resin a.

[0137] Resin a was dissolved in toluene, and 10 g of sodium methoxide, 10 g of 4-bromobenzocyclobutene, and 10 g of cuprous chloride were added again, and reacted at 110° C. for 10 hours. After cooling, the solution was filtered, the solvent was distilled off, and methanol was added to precipitate a solid, which was the desired compound II-a-1.

Embodiment 2

[0139] Preparation of compound Ⅱ-a-2

[0140]

[0141] Dissolve 1kg of polymer polyphenylene ether into 10L of toluene solution, heat and stir to make it fully dissolved. 10% by weight of BPO and tetramethylbisphenol A were added. Keep at 110°C for 6 hours.

[0142] After the reaction was stopped, most of the toluene solution was removed under reduced pressure, and then 5L of methanol was added to precipitate 960g of white solid, which was designated as resin b.

[0143] Resin b was dissolved in toluene, and 10 g of sodium methoxide, 10 g of 4-bromobenzocyclobutene, and 10 g of cuprous chloride were added again, and reacted at 110° C. for 10 hours. After cooling, the solution was filtered, the solvent was distilled off, and methanol was added to precipitate a solid, which was the desired compound II-a-2.

Embodiment 3

[0145] Preparation of compound Ⅱ-f-1

[0146]

[0147] Dissolve 1kg of polymer polyphenylene ether into 10L of toluene solution, heat and stir to make it fully dissolved. 10% by weight of BPO and hexafluorobisphenol A were added. Keep at 110°C for 6 hours.

[0148] After the reaction was stopped, most of the toluene solution was removed under reduced pressure, and then 5L of methanol was added to precipitate 910g of white solid, which was recorded as resin c.

[0149] Dissolve resin c in toluene, add 10 g sodium methoxide, 10 g 4-bromobenzocyclobutene, 10 g cuprous chloride, and react at 110° C. for 10 hours. After cooling, the solution was filtered, the solvent was distilled off, and methanol was added to precipitate a solid, which was the desired compound II-f-1.

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Abstract

The invention provides an epoxy terminated polyphenyl ether resin having a structure represented by the formula (I); a benzocyclobutene terminated polyphenyl ether resin having a structure represented by the formula (II); and a polyphenyl ether resin composition comprising the structure represented by the formula (I) and the structure represented by the formula (II). The disclosed polyphenyl ether resin composition has the advantages of low dielectric constant, low dielectric loss, low water absorption, low shrinkage, and enough substrate adhesive force.

Description

technical field [0001] The invention relates to a polyphenylene ether resin, a prepreg comprising the polyphenylene ether resin of the invention and its application in the field of copper clad laminates. Background technique [0002] Copper clad laminate (CCL) is an important board material of printed circuit board (PCB). As the PCB industry gradually develops towards high-speed transmission and light and thin body, the demand for copper clad laminate is getting higher and higher, and the demand for high frequency copper clad laminate is very strong. [0003] Polyphenylene ether (PPE) is a thermoplastic engineering plastic with excellent performance, which has the following advantages: [0004] (1) Excellent physical and mechanical properties. Low density, non-toxic, high mechanical strength, low molding shrinkage; [0005] (2) Excellent heat resistance. The glass transition temperature (Tg) is the highest among thermoplastics, about 210°C, the crystallinity is about 50%,...

Claims

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Application Information

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IPC IPC(8): C08G65/48H05K1/03
CPCC08G65/485C08G2650/04H05K1/0353
Inventor 黄达王宇谭玉东
Owner JIANGSU HECHENG ADVANCED MATERIALS
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