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Alkali soluble photosensitive compound, preparation method and application thereof

A photosensitive composition and photosensitive resin technology, which is applied in the field of photosensitive materials, can solve problems such as viscosity increase, alkali-soluble photosensitive composition system uncleanness, dry film cured product falling off, etc., and achieve the effect of improving reactivity

Active Publication Date: 2017-11-07
JIANGSU KUANGSHUN PHOTOSENSITIVITY NEW MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] By screen-printing or coating an alkali-soluble photosensitive composition on a substrate such as a printed circuit board and curing it with light or heat, it can be widely used as an insulating layer such as a solder resist layer. The photocurable composition is used as In the case of insulating layers of printed circuit boards on which light-emitting elements such as light-emitting diodes (LEDs) and electroluminescence (ELs) are mounted, in order to effectively use light sources, it is necessary to greatly increase the reflectance of visible light, so white solder resist inks with high reflectivity are required ;In order to improve the dynamic effect of the picture, high-density and refined surface mount technology must be used. Therefore, it is a development trend to invent solder resist inks that will not fall off or crack under high temperature. In order to obtain white solder resist inks with high reflectivity, it is necessary The amount of titanium dioxide in the system is greatly increased. When the alkali-soluble photosensitive composition is coated on a substrate such as a printed circuit board and cured by light, it is difficult for the light source to directly enter the coating due to the total reflection of the white toner (titanium dioxide). At the bottom of the layer, it is difficult to cure completely at the bottom. At the same time, the light scattering of the filler in the alkali-soluble photosensitive composition causes a large difference in curing between the surface layer and the bottom layer at the edge of the window opening of the coating, and the side erosion of the window opening is large. If printed The greater the side erosion of the dry film cured product on the surface of the circuit board, the worse its adhesion, and the worse the impact resistance to the potion during surface treatment, which will cause the dry film cured product to fall off or occur in high and low temperature thermal stress tests. Cracking and other issues
[0004] Some researchers also solve the above-mentioned problem of shedding or cracking by adding compounds that can generate highly active mercapto radicals under light irradiation, but in actual production and use, it is found that the activity of mercapto radicals is too high, resulting in alkali-soluble photosensitivity. The storage of the composition is very poor. The viscosity of the alkali-soluble photosensitive composition system rises sharply within one week. Starts to solidify and agglomerate and cannot be used normally

Method used

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  • Alkali soluble photosensitive compound, preparation method and application thereof
  • Alkali soluble photosensitive compound, preparation method and application thereof
  • Alkali soluble photosensitive compound, preparation method and application thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0047] A preparation method of an alkali-soluble photosensitive composition, the preparation method comprising the steps of:

[0048] (1) Preparation of component A main agent

[0049] ① First, 40 parts of alkali-soluble photosensitive resin (CCR-4959HW of Huayao Chemical Industry), 4 parts of photopolymerizable monomer (EM265 produced by Changxing Chemical), and 4 parts of diluent DCAC (produced by DOW Chemical in the United States) were mixed with a dispersing machine Stir and disperse for 10 minutes at a speed of 1500rpm;

[0050] ② Then add 4 parts of photoinitiator (3.6 parts of Irgacure 907 produced by Ciba, 0.4 parts of Irgacure ITX produced by Ciba), add while stirring, stir and disperse for 5 minutes at a speed of 1500rpm;

[0051] ③ Add 0.8 parts of amine catalyst (2E4MZ produced by Shikoku Chemicals, Japan), add while stirring, and stir and disperse at a speed of 1500rpm for 5 minutes;

[0052] ④Finally add 24 parts of titanium dioxide (DuPont R103) and 3.2 parts ...

Embodiment 2

[0058] A preparation method of an alkali-soluble photosensitive composition, the preparation method comprising the steps of:

[0059] 1) Preparation of component A main agent

[0060] ① First, 40 parts of alkali-soluble photosensitive resin (CCR-4959HW of Huayao Chemical Industry), 4 parts of photopolymerizable monomer (EM265 produced by Changxing Chemical), and 4 parts of diluent DCAC (produced by DOW Chemical in the United States) were mixed with a dispersing machine. Stir and disperse for 10 minutes at a speed of 1500rpm;

[0061] ② Then add 4 parts of photoinitiator (3.6 parts of Irgacure 907 produced by Ciba, 0.4 parts of Irgacure ITX produced by Ciba), add while stirring, stir and disperse for 5 minutes at a speed of 1500rpm;

[0062] ③ Add 0.8 parts of amine catalyst (2E4MZ produced by Shikoku Chemicals, Japan), add while stirring, and stir and disperse at a speed of 1500rpm for 5 minutes;

[0063] ④Finally add 24 parts of titanium dioxide (DuPont R103) and 3.2 parts ...

Embodiment 3

[0069] A preparation method of an alkali-soluble photosensitive composition, the preparation method comprising the steps of:

[0070] 1) Preparation of component A main agent

[0071] ① First, 40 parts of alkali-soluble photosensitive resin (CCR-4959HW of Huayao Chemical Industry), 4 parts of photopolymerizable monomer (EM265 produced by Changxing Chemical), and 4 parts of diluent DCAC (produced by DOW Chemical in the United States) were mixed with a dispersing machine. Stir and disperse for 10 minutes at a speed of 1500rpm;

[0072]② Then add 4 parts of photoinitiator (3.6 parts of Irgacure 907 produced by Ciba, 0.4 parts of Irgacure ITX produced by Ciba), add while stirring, stir and disperse for 5 minutes at a speed of 1500rpm;

[0073] ③ Add 0.8 parts of amine catalyst (2E4MZ produced by Shikoku Chemicals, Japan), add while stirring, and stir and disperse at a speed of 1500rpm for 5 minutes;

[0074] ④Finally add 24 parts of titanium dioxide (DuPont R103) and 3.2 parts o...

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Abstract

The invention discloses an alkali soluble photosensitive compound which is composed of a component A main ingredient and a component B curing agent, wherein the mass ratio of component A to component B at (75:25)-(85:15); the component A main ingredient contains the following raw materials by weight percent: 40-60% of alkali soluble photosensitive resin, 1-10% of photo-initiator, 1-10% of photo-polymerizing monomer, 1-10% of diluent, 0.1-2% of amine catalyst, 20-40% of titanium dioxide and 1-10% of inorganic filler; the component B curing agent contains the following raw materials by weight percent: 79-98.5% of epoxy resin, 1-20% of thiol compound and 0.1-1.5% of storage stabilizer. A curing mold formed by the alkali soluble photosensitive compound disclosed by the invention has the advantage of incapability of falling or cracking under high temperature and can be used for preparing a printed circuit board.

Description

technical field [0001] The invention relates to the technical field of photosensitive materials, in particular to an alkali-soluble photosensitive composition prepared by mixing two components of a main agent and a curing agent and its application. Background technique [0002] With the advancement and development of electronic technology, in addition to improving the display effect of the picture, LED TVs also need to effectively improve the smearing of dynamic pictures. Therefore, LED TVs need to pursue higher brightness and richer colors. In terms of design, it is necessary to change from the previous side-illuminated light source to a rear-projection full-board light source. [0003] By screen-printing or coating an alkali-soluble photosensitive composition on a substrate such as a printed circuit board and curing it with light or heat, it can be widely used as an insulating layer such as a solder resist layer. The photocurable composition is used as In the case of insu...

Claims

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Application Information

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IPC IPC(8): G03F7/004G03F7/027G03F7/032G03F7/031G03F7/029
CPCG03F7/004G03F7/027G03F7/029G03F7/031G03F7/032
Inventor 吴来喜朱民袁燕华刘光曜安丰磊查晓英
Owner JIANGSU KUANGSHUN PHOTOSENSITIVITY NEW MATERIAL
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