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Circuit board UV ink with high temperature resistance and preparation method thereof

A circuit board and high temperature resistant technology, which is applied in the field of high temperature resistant circuit board UV ink and its preparation, can solve the problems of poor high temperature resistance and weak adhesion, and achieve low cost, scientific formula, suitable for large-scale industrial production and Promoted app performance

Inactive Publication Date: 2017-11-28
BAUHINIA VARIEGATA INK & CHEM (ZHONGSHAN) LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The high temperature resistant circuit board UV ink prepared by this method has excellent adhesion, corrosion resistance, weather resistance, high temperature resistance, good printing adaptability and other properties, and will solve the problems of weak adhesion and high temperature resistance encountered by current domestic inks of the same type. Common technical issues such as poor performance

Method used

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  • Circuit board UV ink with high temperature resistance and preparation method thereof
  • Circuit board UV ink with high temperature resistance and preparation method thereof
  • Circuit board UV ink with high temperature resistance and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] A kind of high temperature resistant circuit board UV ink, by weight, comprises the following components:

[0033]

[0034]

[0035] A preparation method of high temperature resistant circuit board UV ink, comprising the following steps:

[0036] (1) Add novolac epoxy acrylic resin, bisphenol A diglycidyl ether diacrylate, adhesive, 2-ethylanthraquinone, and color paste into the mixing container according to the number of parts, and stir at high speed for 2 to 3 hours to make it Completely dissolve to obtain mixture A, while controlling the temperature of this process to ≤50°C;

[0037] (2) Add talcum powder to mixture A, stir for 0.5-3 hours, then slowly add fumed silica while stirring, and obtain mixture B after uniform dispersion, while controlling the temperature in this process to ≤65°C;

[0038] (3) Grinding the mixture B to a fineness of ≤40um, and then standing still for 10-20h to obtain the semi-finished product A;

[0039] (4) Add bifunctional acidic m...

Embodiment 2

[0043] A kind of high temperature resistant circuit board UV ink, by weight, comprises the following components:

[0044]

[0045]

[0046] A preparation method of high temperature resistant circuit board UV ink, comprising the following steps:

[0047] (1) Add novolac epoxy acrylic resin, bisphenol A diglycidyl ether diacrylate, adhesive, 2-ethylanthraquinone, and color paste into the mixing container according to the number of parts, and stir at high speed for 2 to 3 hours to make it Completely dissolve to obtain mixture A, while controlling the temperature of this process to ≤50°C;

[0048] (2) Add talcum powder to mixture A, stir for 0.5-3 hours, then slowly add fumed silica while stirring, and obtain mixture B after uniform dispersion, while controlling the temperature in this process to ≤65°C;

[0049] (3) Grinding the mixture B to a fineness of ≤40um, and then standing still for 10-20h to obtain the semi-finished product A;

[0050] (4) Add bifunctional acidic m...

Embodiment 3

[0054] A kind of high temperature resistant circuit board UV ink, by weight, comprises the following components:

[0055]

[0056]

[0057] A preparation method of high temperature resistant circuit board UV ink, comprising the following steps:

[0058] (1) Add novolac epoxy acrylic resin, bisphenol A diglycidyl ether diacrylate, adhesive, 2-ethylanthraquinone, and color paste into the mixing container according to the number of parts, and stir at high speed for 2 to 3 hours to make it Completely dissolve to obtain mixture A, while controlling the temperature of this process to ≤50°C;

[0059] (2) Add talcum powder to mixture A, stir for 0.5-3 hours, then slowly add fumed silica while stirring, and obtain mixture B after uniform dispersion, while controlling the temperature in this process to ≤65°C;

[0060] (3) Grinding the mixture B to a fineness of ≤40um, and then standing still for 10-20h to obtain the semi-finished product A;

[0061] (4) Add bifunctional acidic m...

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Abstract

The invention provides circuit board UV ink with high temperature resistance and a preparation method thereof. The circuit board UV ink with the high temperature resistance is prepared from the following components in parts by weight: 10-20 parts of phenolic epoxy acrylic resin, 5-15 parts of bisphenol epoxy acrylate, 1-1.5 parts of bifunctional acid metacrylic acid ester, 2-4 parts of hydroxyethyl methacrylate, 0.1-0.5 part of adhesives, 30-40 parts of talcum powder, 0.5-3 parts of 2-ethylanthraquinone, 1-10 parts of fumed silica, 0.1-0.5 part of defoaming agents and 3-10 parts of color paste. The ink has high adhesion, corrosion resistance, weather resistance, high temperature resistance and good printing adaptability, is easily available in raw materials and low in cost, and is suitable for large-scale industrial production, popularization and application.

Description

technical field [0001] The invention relates to the technical field of inks, in particular to a high-temperature-resistant circuit board UV ink and a preparation method thereof. Background technique [0002] The circuit board ink industry is at the front end of the electronic information industry chain, and plays an important role in the processing of electronic information products in the form of functional materials. The production of circuit board ink involves many disciplines such as chemistry, physics, material science, and electrical engineering. The research and development of new products of circuit board ink has very high requirements on the cross-field research and innovation capabilities of enterprises. [0003] UV solder resist ink is the most widely used light-curing material in single-panel production. There are many domestic R&D and production companies. Bisphenol A epoxy acrylate is used as the main resin to solve the problem of ink solder resist, but the do...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09D11/101C09D11/107C09D11/03
CPCC09D11/03C09D11/101C09D11/107
Inventor 刘白桦廖辉谢建新
Owner BAUHINIA VARIEGATA INK & CHEM (ZHONGSHAN) LTD
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