Directed graphite-copper composite material with superhigh thermal conductivity and high strength and preparation method and application thereof

A composite material and graphite technology, used in transportation and packaging, metal processing equipment, etc., can solve the problem that the thermal conductivity of composite materials cannot be greatly improved, the uniformity of metal copper distribution cannot be guaranteed, and it is difficult to form a continuous whole, etc. question

Active Publication Date: 2017-12-22
宁波晨鑫维克工业科技有限公司
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  • Abstract
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  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] The above-mentioned various methods such as selection of scaly copper powder, chemical copper plating, shock vibration and other methods to obtain the direction consistency of graphite sheets, although the thermal conductivity of the composite material has been improved to a certain extent, there are still various problems, such as scales The selection of copper powder and the introduction of subsequent special processes have greatly increased the production cost and process complexity; and although the electroless copper plating process has improved the uniform distribution of metallic copper in graphite-copper composites to a certain extent, it is chemically Various compound ions are inevitably introduced during the copper plating process, which has a great influence on the stability of the composite material in humid air; although shock vibration can improve the arrangement of gra...

Method used

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  • Directed graphite-copper composite material with superhigh thermal conductivity and high strength and preparation method and application thereof
  • Directed graphite-copper composite material with superhigh thermal conductivity and high strength and preparation method and application thereof
  • Directed graphite-copper composite material with superhigh thermal conductivity and high strength and preparation method and application thereof

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preparation example Construction

[0093] The invention provides a method for preparing the composite material, which not only simply solves the problem of the uniformity of copper distribution in the graphite-copper composite material, but also provides a process for improving the direction consistency of graphite sheets. The thermal conductivity of the composite material prepared by the preparation method exceeds 800W / m·K.

[0094] Specifically, the method includes the steps of:

[0095] a-1) providing a first mixture comprising graphite powder, copper powder and an organic solvent;

[0096] a-2) using a double-center high-speed mixer to uniformly mix the first mixture to obtain a second mixture;

[0097] a-3) Vibrating the second mixture by using a reciprocating vibration platform to obtain a third mixture;

[0098]a-4) hot pressing and sintering the third mixture to obtain the composite material.

[0099] In another preferred example, the graphite powder is in the form of scales.

[0100] In another pre...

Embodiment 1

[0146] Embodiment 1 Graphite-copper composite material 1

[0147] Preparation of graphite-copper mixture (graphite powder volume fraction is 60vol.%)

[0148] Get the flaky graphite powder (63g) with a particle size of 500 μm and the metal copper powder (178g) and a small amount of alcohol (10g) with a particle size of 7 μm in a double-center high-speed mixer to make a mixed powder. At 1500 rpm, calculated according to the total fraction of the mixed powder, flake graphite accounts for 60vol.%, copper powder accounts for 40vol.%, and mixes the materials for 1 minute. The mixed metal copper powder adheres to the graphite sheet to obtain a graphite-copper mixture. 1.

[0149] figure 2 Be the optical micrograph of embodiment 1 gained graphite-copper mixture 1, image 3 It is a scanning electron micrograph of the graphite-copper mixture 1 obtained in Example 1.

[0150] From figure 2 and image 3 It can be seen that the granular copper powder evenly covers the surface of t...

Embodiment 2

[0157] Embodiment 2 graphite-copper composite material 2

[0158] Same as Example 1, the difference is that the graphite particle size is 600 μm-800 μm.

[0159] The graphite sheet direction thermal conductivity of the composite material 2 obtained in Example 2 is 904W / m K, and the thermal conductivity perpendicular to the graphite sheet direction is 66W / m K, and the thermal expansion coefficient of the composite material 2 is 6.02ppm / K.

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Abstract

The invention relates to a directed graphite-copper composite material with superhigh thermal conductivity and high strength and a preparation method and application thereof. Specifically, the composite material is formed by graphite sheet layers and copper layers through hot-pressing sintering, and the graphite sheet layers and the copper layers are arranged in parallel in a directed mode. The ratio of the thermal conductivity of the composite material in the direction parallel to the X-Y direction to the thermal conductivity of the composite material in the direction perpendicular to the X-Y direction is not smaller than 4, the thermal conductivity of the composite material in the direction parallel to the X-Y direction is not smaller than 500 W/m.K, and the X-Y direction is parallel to the graphite sheet layers and the copper layers at the same time. The invention further discloses the preparation method of the composite material. As the graphite sheet layers of the composite material are arranged in the directed mode in the height direction and the copper layers are evenly distributed between the graphite sheet layers, the composite material has quite high thermal conductivity and low coefficient of thermal expansion. The preparation method is simple, low in cost and quite suitable for being popularized on a large scale.

Description

technical field [0001] The invention relates to the field of heat-conducting materials, in particular to a directional ultra-high heat-conducting, high-strength graphite-copper composite material and a preparation method and application thereof. Background technique [0002] With the rapid development of high power, light weight and miniaturization of semiconductor components, the heat generated per unit area is getting higher and higher, while the effective heat dissipation area is decreasing day by day. Heat dissipation has become a hindrance to high-power electronic devices and high-power solid-state lighting devices. , ultra-large-scale and ultra-high-speed integrated circuits, and even the bottleneck of the development of the entire information industry. These high-power components and systems urgently need thermal conductive materials with better thermal conductivity, thermal expansion coefficient matching semiconductor chip materials (Si or GaAs), sufficient rigidity ...

Claims

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Application Information

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IPC IPC(8): C22C1/05C22C1/10C22C9/00C22C9/10C22C9/06C22C9/04C22C9/02B22F1/00B22F3/14
CPCC22C1/05C22C9/00C22C9/02C22C9/04C22C9/06C22C9/10B22F3/14B22F2003/145C22C2202/00B22F1/107
Inventor 白华薛晨江南马付根吕继磊戴丹徐群峰
Owner 宁波晨鑫维克工业科技有限公司
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