Group IVA functionalized particles and methods of use thereof
A particle and aromatic compound technology, applied in the field of functionalized IVA family particles, can solve the problems of expensive, large-scale production equipment capital cost and high energy cost
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example 1
[0208] Silicon particles passivated by toluene
[0209] In one example, a resistivity of 2 to 4 ohms / cm2 (ohm / cm 2 ) of the p-type silicon wafer was crushed, then ground using a mortar and pestle, and then passed through a #60 mesh sieve. The powder is further reduced to submicron particles using a ball mill. In a 40 gram batch, the submicron silicon powder was added to a 250 ml polypropylene container along with 100 ml of hydrochloric acid and 4 to 8 ceramic balls (12 mm diameter). The screw top was closed and the container was rotated on a roller mill at 60 rpm for 2 hours. Pressure buildup in the container causes the container to expand. In some cases where larger quantities or lower grades of silicon are handled, the solution may be 2 Explosion due to accumulation of gas. After stirring on the roller mill for 2 hours, the bottle was allowed to stand still for a further 2 hours. The bottle was carefully opened to relieve the pressure, and the liquid in excess of the s...
example 2
[0212] Silicon particles passivated by benzene
[0213] In another example, after the same milling procedure described in Example 1, benzene (C 6 h 6 ) instead of toluene as the passivating hydrocarbon. Applied in a similar manner, benzene can be replaced by other hydrocarbons with stronger bonding functional groups in subsequent reactions. Benzene is one of the few organic hydrocarbons that will reversibly bond to silicon surfaces. Thus, the benzene-passivated Group IVA material is a convenient and stable intermediate for introducing other functional hydrocarbons onto the particle surfaces. This is one of the few forms of Group IVA materials where thermodynamics play an important role in surface chemistry, as opposed to kinetics dominating.
[0214] In another example, three different types of silicon wafers were ground to specification. Benzene is the solvent used during the milling process, but oxygen and traces of water are not excluded. The three types of silicon ar...
example 3
[0216] passivated silicon particles
[0217] In another example, 325 mesh Si powder was processed by a Netzsch Dynostar mill using 0.4 to 0.6 mm yttrium stabilized zirconia beads in benzene. The solids loading of the Si-benzene slurry was 30 to 40%. Particle size distribution (PSD) analysis indicated that the average particle size (APS) decreased to about 200 nm. Further processing to smaller APS requires changing the milling media to a smaller bead size. Beads changing to 0.1 mm diameter or smaller will allow the APS to be reduced to less than 100 nm. Below 100 nm, further APS reduction in benzene becomes difficult due to the rapid increase in viscosity of the slurry. Furthermore, tracking the progress of APS reduction by the light scattering PSDA method is difficult due to particle aggregation.
[0218] Removal of benzene from submicron particles was accomplished by evaporating benzene under reduced pressure. Care must be taken to provide heat to the vessel holding the ...
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Abstract
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