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Electromagnetic shielding film and preparation method thereof

A technology of electromagnetic shielding film and shielding layer, applied in conductive adhesives, film/sheet adhesives, epoxy resin adhesives, etc., can solve the problems of difficulty in obtaining, complicated preparation process, and decreased electromagnetic shielding performance, etc. To achieve the effect of easy adjustment of layer thickness, simple production process and excellent electromagnetic shielding performance

Pending Publication Date: 2017-12-26
GUANGDONG ZHENGYE TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The preparation process of the shielding layer in the above two patents is relatively complicated, and it is difficult to obtain a thicker shielding layer
However, a thin shielding layer is likely to cause a large number of defect points on the surface of the shielding layer, and bending during use will also produce a large number of micro-cracks, resulting in a decrease in electromagnetic shielding performance
[0005] The Chinese patent with application number 201210443949.X sets a layer of copper foil on the insulating layer as a shielding layer. Since the commercialized copper foil is relatively thick, generally greater than 8 μm, direct use will increase the thickness of the product, which does not meet the requirements of ultra-thin electronic products. Therefore, this technology also etches copper foil to obtain ultra-thin copper foil. The thickness of the shielding metal layer produced by this process is 1-3 μm
Although this patent can prepare a shielding layer with a moderate thickness, the preparation process is relatively complicated.

Method used

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  • Electromagnetic shielding film and preparation method thereof
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  • Electromagnetic shielding film and preparation method thereof

Examples

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preparation example Construction

[0042] The invention provides a kind of preparation method of electromagnetic shielding film, comprises the following steps:

[0043] a), coating the insulating layer slurry on one side of the carrier layer, curing to form an insulating layer;

[0044] b) coating the shielding layer slurry on the insulating layer to form a shielding layer; the shielding layer slurry includes: 3-15wt% epoxy resin composition, 4-15wt% toughening agent, 75-15wt% 90wt% conductive particles, 0.5-1wt% ion trapping agent and 0.5-1.5wt% curing agent;

[0045] c), coating the conductive adhesive layer slurry on the shielding layer to form a conductive adhesive layer;

[0046] d) Arranging a protective layer on the conductive adhesive layer to obtain an electromagnetic shielding film.

[0047] In the preparation method provided by the present invention, firstly, the insulating layer slurry is coated on one side of the carrier layer. Wherein, the slurry for the carrier layer and the insulating layer h...

Embodiment 1

[0057] 1) Using the dimple coating method, coat the insulating layer slurry on the 50 μm thick polyethylene terephthalate release film (the insulating layer slurry is CLV-B of Guangdong Zhengye Technology Co., Ltd. series of epoxy resin glue), the slurry is coated to form a slurry layer and then sent to the oven for baking. The oven is equipped with six temperature zones along the direction of the slurry coating layer, and each temperature zone is along the slurry coating layer. The length of the movement direction is 4m, and the relevant parameters are set as follows:

[0058]

[0059] The coated insulating layer was aged in an oven at 80° C. for 72 hours to obtain an insulating layer with a thickness of 8 μm and a curing degree of 70%.

[0060] 2) Fully mix the epoxy resin, conductive particles, ion scavenger and appropriate amount of solvent, then add the toughening agent and curing agent, and stir evenly to prepare the shielding layer slurry; use dimple coating to coat ...

Embodiment 2

[0068] 1) Using the dimple coating method, coat the insulating layer slurry on the 50 μm thick polyethylene terephthalate release film (the insulating layer slurry is CLV-B of Guangdong Zhengye Technology Co., Ltd. series of epoxy resin glue), the slurry is coated to form a slurry layer and then sent to the oven for baking. The oven is equipped with six temperature zones along the direction of the slurry coating layer, and each temperature zone is along the slurry coating layer. The length of the movement direction is 4m, and the relevant parameters are set as follows:

[0069]

[0070] The coated insulating layer was aged in an oven at 100° C. for 48 hours to obtain an insulating layer with a thickness of 8 μm and a curing degree of 80%.

[0071] 2) Fully mix the epoxy resin, conductive particles, ion scavenger and appropriate amount of solvent, then add the toughening agent and curing agent, and stir evenly to prepare the shielding layer slurry; use dimple coating to coat...

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Abstract

The invention belongs to the field of electromagnetic shielding and especially relates to an electromagnetic shielding film and a preparation method thereof. The electromagnetic shielding film comprises a carrier layer, an insulating layer, a shielding layer, a conductive adhesive layer and a protecting layer which are in contact with each other in turn; the shielding layer is formed by shielding layer slurry; the shielding layer slurry comprises the following components: 3-15wt% of epoxy resin compound, 4-15wt% of flexibilizer, 75-90wt% of conductive particle, 0.5-1wt% of ion capturer and 0.5-1.5wt% of curing agent. The shielding layer of the electromagnetic shielding film provided by the invention is formed by curing the shielding layer slurry; compared with the traditional shielding layer manufacturing technologies, such as, sputtering, vacuum plating and deposition plating, the manufacturing technology for the shielding layer of the electromagnetic shielding film provided by the invention is simple; the layer thickness is easily regulated and controlled; and the electromagnetic shielding performance is excellent.

Description

technical field [0001] The invention belongs to the field of electromagnetic shielding, in particular to an electromagnetic shielding film and a preparation method thereof. Background technique [0002] With the rapid development of electronics and informatization, the volume of electronic products is getting smaller and smaller, the operating frequency is getting higher and higher, and the accompanying electromagnetic radiation is getting stronger and stronger, and electromagnetic shielding has become an inevitable trend. [0003] At present, in order to achieve electromagnetic shielding, conductive paint can be sprayed on the hard shell or the metal layer can be used as a shielding layer by ion sputtering; on the printed circuit board, the metal shell stamped by a mold is usually directly welded on the outside of the electronic parts, so as to suppress Electromagnetic interference. On flexible circuit boards, it is usually in the form of a layer of electromagnetic shieldi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/02C09D163/00C09D7/12C09J163/00C09J9/02C09D11/102
CPCC09D11/102C09D163/00C09J9/02C09J163/00C08K2003/0806C08K2003/085C08L2205/025C09J2467/005C09J2301/314C09J2301/122C09J2301/312C08L13/00C08K9/02C08K3/08C08L63/00
Inventor 苏华弟李磊徐地华梅领亮
Owner GUANGDONG ZHENGYE TECH