Multifunctional fully-automatic blue wafer integrated machine method and apparatus

Abstract

The invention discloses a method and a device for a multi-functional automatic blue mold all-in-one machine. On the workbench 1, the servo motor module is coordinated with the movement of each device, and the material is sucked and unloaded from the automatic material box device 10 by the vacuum suction plate 2. Dispense the sheet 5 to the multi-cartridge dispensing device 4 through the controller 7. After completion, the unloaded sheet 5 is transferred to the die-bonding system through the servo motor module, and then transferred to the graphite boat 48 through the servo motor module. Clamp the upper material 52 with the upper material 52 sucked by the automatic material box device 33 and the vacuum suction plate 46 from the left end, dispensing glue through the multi-plastic cartridge dispensing system, turning it over 180 degrees, and clamping it by the clamping jaw cylinder device Send to the material receiving cylinder device 50 and push it onto the material receiving guide rail 44 to realize automatic material receiving. Adopting the above-mentioned technical scheme, the installation is convenient, the floor space is small, the transmission is reliable, the automation program is high, and the labor cost is saved; the visualized man-machine interface is easy to operate, and the purpose of batch production is achieved, which can be popularized and applied in the field.

Description

technical field [0001] The invention belongs to the technical field of semiconductors and LED welding wires. More specifically, the present invention relates to a multi-functional and fully automatic blue-mode integrated machine method for automatic loading and unloading of blue-mode crystal chips, automatic dispensing, automatic crystal fixing, automatic dispensing and mold clamping, and automatic loading and unloading of graphite boats. device. Background technique [0002] With the country's "13th Five-Year Plan" vigorously promoting energy conservation and environmental protection, the midstream packaging technology of the semiconductor industry chain (die bonding machine, wire bonding machine, dispensing machine, etc.) In the process of assembly line operation, the automation equipment used, such as crystal bonding machine and glue dispensing machine, can only simply complete one process, the price of a single device is high, and each process requires manual loading an...

AI Technical Summary

Problems solved by technology

[0002] With the country's "13th Five-Year Plan" vigorously promoting energy conservation and environmental protection, the midstream packaging technology of the semiconductor industry chain (die bonding machine, wire bonding machine, dispensing machine, etc.) In the process of assembly line operation, the automation equipment used, such as crystal bonding machine and glue dispensing machine, can only simply complete one process, the price of a single device is high, and each process requires manual loading and unloading, and the whole shift is on duty ; and the time difference between dispensing and solid crystal cannot fully guarantee product consistency, the cost of product quality control is high, and a lot of manpower and material resources are consumed. It is still impossible to improve product consistency and product quality, let alone mass production. Production, to maximize the reduction of production costs, to meet production needs

[0003] like figure 1 Shown is the dispensing and solid crystal method of crystal chips currently on the market. The process of dispensing and solid crystal chips for crystal chips uses three different equipment: dispensing machine, crystal solid machine and dispensing and mold clamping. First of all, After the dispensing machine is started, it needs to be manually loaded1, and all the blanks are required to fix the position of the blank2, the positioning of the rubber cartridge during dispensing3, the optical positioning4 during the solid crystal, as well as loading and unloading The positioning of the rubber cylinder during mold closing requires position adjustment, which consumes a lot of time. In addition, after the dispensing of the blanks is completed, the dispensed blanks 5 are collected and fixed to the die bonder equipment one by one. When the die bonder is turned on, there is a large time difference between dispensing and die bonding. In addition, when the stability of the swing arm picking up the die 7 after the wafer is ejected 6 is poor, there are often cases of unqualified die bonding. The adjustment is troublesome and the scrapping situation is serious. After the solid crystal is completed, it is necessary to enter the stage of loading, unloading and mold clamping. If the position of the upper and lower material is not fixed accurately, and the graphite ship is in place at 8 o'clock, the position of the crystal chip and the dispensing position will be slightly misaligned, and the rate of unqualified products will increase significantly. The scrap rate of defective products is higher, and in many cases, qualified and defective products cannot be distinguished immediately, and the cost of later inspection is high

In the overall operation process, most of them rely on manual handling, positioning, and disassembly, which takes up a lot of manpower and material resources, and consumes more company resources. However, it is still impossible to control product costs, improve product quality and consistency, and cannot produce in large quantities. , control process links, reduce production costs

Images