Manufacturing method of metal housing for packaging electronic assembly

Abstract

The invention provides a manufacturing method of a metal housing for packaging an electronic assembly. The metal housing comprises a metal housing main body and a diamond copper heat sink plate embedded into a bottom plate of the metal housing main body, wherein the electronic assembly is arranged on the diamond copper heat sink plate; and the metal housing main body is connected with the diamondcopper heat sink plate by adopting brazing. The adopted diamond copper heat sink plate is low in thermal expansion coefficient, low in density and high in heat conductivity; efficient heat dissipationcapacity is ensured while matching with the thermal expansion coefficient of the electronic assembly is ensured; failures of the metal housing and the electronic assembly due to an over-high workingenvironment temperature are avoided; the heat dissipation requirements of high-power components on the metal housing are met; and the metal housing main body and the diamond copper heat sink plate aresubjected to nickel-plated treatment and are connected by adopting a brazing method, wherein nickel and silver-copper eutectic solder are relatively low in price, so that the manufacturing cost of the metal housing is reduced.

Description

technical field [0001] The invention belongs to the field of encapsulation of electronic components, and in particular relates to a method for manufacturing a metal casing for encapsulating electronic components. Background technique [0002] The transmitting or receiving components of spaceborne and airborne radars are an important part of them. The transmitting or receiving components are high-density microwave circuits with many internal components, high assembly density, and large chip power dissipation, which will inevitably lead to increased heat generation of the circuit. , The working temperature rises, but the stability drops. In semiconductor devices, as the temperature rises, the possibility of failure increases, so the transmitting or receiving components have higher requirements on the heat dissipation capacity of the metal casing. The circuit assembled inside the transmitting or receiving component requires that the thermal expansion coefficient of the housing...

AI Technical Summary

Problems solved by technology

Gold-tin eutectic brazing uses Au80Sn20 solder, which is expensive, resulting in high manufacturing costs for the metal shell, and the melting point of Au80Sn20 solder is 280 ° C. The subsequent use of the metal shell using gold-tin eutectic brazing is limited and cannot be higher than 280°C

The thermal expansion coefficient of the aluminum silicon carbide heat sink plate is 8.0×10-6 / ℃, which is not completely matched with the conventional silicon chip circuit

And with the continuous improvement of internal circuit integration, the thermal conductivity of aluminum silicon carbide heat sink plate 170W / (m·K) can no longer meet the heat dissipation requirements of its internal circuit

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