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Radiation curable quantum dot material sealant composition

A quantum dot material and radiation curing technology, applied in the field of sealants, can solve the problems of performance degradation and achieve effective protection, excellent weather resistance, and high bonding strength

Active Publication Date: 2018-01-09
东莞市联灏新材料技术开发有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The invention provides a radiation-curable quantum dot material sealant composition, which solves the technical problem in the prior art that the performance of quantum dot materials is reduced due to the penetration of water and oxygen

Method used

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  • Radiation curable quantum dot material sealant composition
  • Radiation curable quantum dot material sealant composition
  • Radiation curable quantum dot material sealant composition

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0042] A radiation-curable quantum dot material sealant provided in Embodiment 1, by weight, contains components and the percentages of each component are as follows:

[0043] Silicone modified hyperbranched acrylate (self-made) 50 parts, silicone modified polyurethane acrylate CN1963 15 parts, isobornyl acrylate (IBOA) 10 parts, 1,6 hexanediol diacrylate (HDDA)

[0044] 20 parts, 3 parts of photoinitiator 184, 0.8 part of octadecenylamine acetate, 0.2 part of antioxidant 1010, 1 part of γ-methacryloxypropyl trimethoxysilane (KH570).

[0045] Wherein, the silicone-modified hyperbranched acrylate is self-made, and by weight, the materials required for the resin synthesis reaction are: 40 parts of isophorone diisocyanate (IPDI) trimer, 40 parts of dialkylhydroxyphenylpolysilane 10 parts, 10 parts of hydroxyethyl acrylate, 10 parts of absolute ethanol, 0.2 parts of a catalyst, and 0.3 parts of a polymerization inhibitor, wherein the catalyst is a tertiary amine, and the polymeriz...

Embodiment 2

[0051] A radiation-curable quantum dot material sealant provided in Embodiment 2, by weight, contains components and the percentages of each component are as follows:

[0052] Silicone modified hyperbranched acrylate (self-made) 45 parts, silicone modified polyurethane acrylate (self-made) 25 parts, isobornyl methacrylate (MIBOA) 10 parts, tripropylene glycol diacrylate (TPGDA) 10 parts Parts, 5 parts of lauryl methacrylate, 2 parts of photoinitiator 184, 2 parts of photoinitiator TPO, 0.1 part of oleyl amino oleate, 0.4 part of antioxidant 2246, γ-methacryloxypropyl trimethyl 0.5 parts of oxysilane (KH570).

[0053] The organosilicon-modified hyperbranched acrylate is the organosilicon-modified hyperbranched acrylate prepared in Example 1, and the organosilicon-modified polyurethane acrylate is self-made. By weight, the materials required for the resin synthesis reaction are : 20 parts of isophorone diisocyanate (IPDI), 65 parts of hydroxyl-terminated polysiloxane, 10 parts ...

Embodiment 3

[0058] A radiation-curable quantum dot material sealant, by weight, contains components and the percentages of each component include: 40 parts of organosilicon-modified hyperbranched acrylate (self-made), organosilicon-modified polyurethane acrylate (Homemade) 10, 25 parts of isobornyl methacrylate (MIBOA), 22 parts of 1,6 hexanediol diacrylate, 2 parts of photoinitiator TPO, 0.5 parts of octadecylamine acetate, antioxidant 10100.2 parts, 0.2 parts of vinyltrimethylsilane, 0.1 part of 3-methacryloxypropyl trimethoxysilane, wherein, the organosilicon modified hyperbranched acrylate is the organic Silicon-modified hyperbranched acrylate; the organosilicon-modified urethane acrylate is the organosilicon-modified urethane acrylate prepared in Example 2.

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Abstract

The invention relates to the field of sealants and discloses a radiation curable quantum dot material sealant composition, which is prepared from the following materials in parts by weight: 25 to 50 parts of silicone-modified hyperbranched acrylate, 10 to 30 parts of silicone-modified urethane acrylate, 15 to 60 parts of reactive diluent, 0.1 to 4 parts of photoinitiator and 0.5 to 5 parts of auxiliary. According to the radiation curable quantum dot material sealant composition disclosed by the invention, the silicone-modified hyperbranched acrylate is used as main resin of the sealant, the water-oxygen transmission rate is effectively reduced, the bonding strength is higher, the sealant has good compatibility to a quantum dot material, and the effect on quantum dot luminous efficiency isless, weatherability and water-oxygen barrier performance are excellent, and the quantum dot material can be effectively protected.

Description

technical field [0001] The invention relates to the field of sealants, in particular to a radiation-curable quantum dot material sealant composition. Background technique [0002] Liquid crystal technology will usher in the "ultimate evolution" of the backlight system - quantum dot technology. Quantum dot display can be divided into photoluminescence and electroluminescence according to the different luminescence principles, which are respectively called quantum dot backlight technology (QD -LCD) and Quantum Dot Light Emitting Diode display technology (AMQLED). [0003] AMQLED is a self-luminous technology that does not require an additional light source, and its luminous principle and structure are similar to OLED technology. AMQLED has not yet been commercialized. The main reason is that the quantum dots of AMQLED are easily affected by heat and moisture. The industry believes that it will take at least 10 years before the commercialization of the real version of AMQLED. ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J175/14C09J11/06C08G18/79C08G18/32C08G18/67
Inventor 黄战光
Owner 东莞市联灏新材料技术开发有限公司
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