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MEMS encapsulation structure with encapsulation spacing capable of being controlled in high precision and encapsulation method

A packaging structure and packaging method technology, applied in the manufacture of microstructure devices, microstructure devices, microstructure technology, etc., can solve the problem of uncontrollable packaging spacing, and achieve the effect of reducing manufacturing difficulty, realizing output, and improving output

Active Publication Date: 2018-01-12
HUAZHONG UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In view of the defects of the prior art, the purpose of the present invention is to provide a MEMS packaging structure and packaging method with high-precision control of the packaging spacing, aiming to solve the technical problem that the packaging spacing cannot be controlled when the bonding material has a certain fluidity

Method used

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  • MEMS encapsulation structure with encapsulation spacing capable of being controlled in high precision and encapsulation method
  • MEMS encapsulation structure with encapsulation spacing capable of being controlled in high precision and encapsulation method
  • MEMS encapsulation structure with encapsulation spacing capable of being controlled in high precision and encapsulation method

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preparation example Construction

[0060] Preferably, the preparation method of the encapsulation limiting device includes the following steps: preparing a metal seed layer on the surface of the silicon wafer by etching or stripping; preparing a patterned photoresist mask on the seed layer by using photolithography alignment technology During electroplating, the photoresist mask is used as an inverted mold to limit the electroplating position; for electroplating, different electroplating times are used to control the thickness of electroplating in different functional areas, so as to realize three-dimensional electroplating; after electroplating is completed, the photoresist mask is removed ; According to actual needs, the etching method is used to remove the seed layer in some parts.

[0061] Preferably, the position of the limiting device should be near the packaging ring. The plating thickness of the limiting device can be prepared by selecting different plating times according to the needs of the device itse...

Embodiment 1

[0074] A MEMS packaging method with high-precision controllable packaging spacing provided by the present invention comprises the following steps:

[0075] (1) Prepare a scattered metal seed layer on the surface of the silicon substrate by etching or stripping. The position of the metal seed layer corresponds to the position of the limiting device, the first packaging ring and the first metal plate. The metal The seed layer is used to fix the limiting device, the first packaging ring and the first metal plate on the upper end of the silicon substrate.

[0076] For example, the metal seed layer 17 (Cr / Au) required for the device can be prepared on the silicon substrate 1 by deposition, etching or stripping processes, and the thickness of the silicon wafer is 500 μm (as shown in FIG. 5( a )).

[0077] Further, step (1) includes the following steps:

[0078] (1-1) successively depositing a chromium film and a gold film on the upper end of the silicon substrate 1 by thermal evapo...

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Abstract

The invention discloses a MEMS encapsulation structure with encapsulation spacing capable of being controlled in high precision and an encapsulation method. The encapsulation structure comprises a silicon substrate, a limiting device, a first encapsulation ring, an upper cap and a second encapsulation ring, wherein the height of the limiting device is higher than the height sum of the first encapsulation ring and the second encapsulation ring; the limiting device and the first encapsulation ring are arranged on the silicon substrate, the second encapsulation ring is arranged on the upper cap,and a location of the first encapsulation ring is corresponding to that of the second encapsulation ring; one-surface contact of the encapsulation ring is manufactured on the limiting device and the upper cap; encapsulation solder with fluidity is born on the first encapsulation ring, thereby enabling the first encapsulation ring and the second encapsulation ring to perform the bonding encapsulation under the effect of the encapsulation solder with fluidity; the melting point of the limiting device is higher than that of the alloy formed by the solder, the first encapsulation ring and the second encapsulation ring, thereby enabling the limiting device to maintain the solid-state and fix the encapsulation spacing when the first encapsulation ring and the second encapsulation ring perform the bonding encapsulation. The high-precision control on the encapsulation spacing is realized through the limiting device.

Description

technical field [0001] The invention belongs to the technical field of microelectronic device packaging, and more specifically relates to a MEMS packaging structure and a packaging method whose packaging spacing can be controlled with high precision. Background technique [0002] Micro-Electro-Mechanical Systems (MEMS) is an industrial technology that integrates microelectronics technology and mechanical engineering. The earliest MEMS devices can be traced back to 1966. After more than half a century of development, the MEMS market is growing and the prospects are encouraging, but there are always various problems in the MEMS process of "packaging". Most academic institutions engaged in research and development of MEMS devices ignore packaging, and the methods proposed by units engaged in packaging technology research cannot be compatible with all devices. Commercial groups with their own products have kept silent about such difficulties and challenges due to cost considera...

Claims

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Application Information

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IPC IPC(8): B81B7/00B81C1/00
Inventor 范继伍文杰涂良成刘金全邱文瑞
Owner HUAZHONG UNIV OF SCI & TECH
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