Boron nitride nanosheet and polyacrylic acid gel composite thermal interface material and preparation method

Abstract

The invention provides a boron nitride nano sheet-polyacrylic acid gel composite thermal interface material and a preparation method thereof. The thermal interface material comprises a polyacrylic acid gel matrix and a thermal conductive filling material. The polyacrylic acid gel matrix comprises trivalent iron ion-polyacrylic acid gel or modified silicon ball-polyacrylic acid gel, and the thermalconductive filling material comprises boron nitride nano sheets. The preparation method of the thermal interface material comprises the following steps: evenly mixing acrylic acid, water, and trivalent iron salts / silicon balls; adding boron nitride nano sheets, evenly mixing, stirring, carrying out reactions for 30 to 40 minutes under stirring in the presence of an initiator, and then carrying out reactions at a temperature of 33 to 37 DEG C for 40 to 48 hours in a stationary state to obtain the thermal interface material. The provided thermal interface material is a deformable and recoverable gel-like thermal interface material, has an excellent heat conduction performance, and can be tightly adhered on a surface that needs heat dissipation so that no air flows in the gap between a heating element and the surface of a radiator.

Description

technical field [0001] The invention relates to a boron nitride nanosheet and polyacrylic acid gel composite thermal interface material and a preparation method thereof, belonging to the technical field of thermal interface materials. Background technique [0002] With electronic products such as computer chips, high-power electronic equipment, and optoelectronic devices, household and industrial appliances such as air conditioners, televisions, refrigerators, and LED lighting, and modern transportation equipment such as automobiles, airplanes, ships, and high-speed rails, the trend toward lightweight, miniaturized, and high-speed With the development of power, the heat generated per unit area is getting higher and higher, which puts forward higher requirements for the thermal control system. Therefore, how to quickly and safely take away the heat on the heating element has become an important issue restricting the development of many industrial fields. [0003] In the abov...

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Problems solved by technology

[0005] In recent years, the existing thermal interface materials have been unable to meet the heat dissipation requirements of the further improvement of integration and power density in electronic technology, and the mechanical properties of the existing thermal interface materials (including elasticity, viscosity, tensile strength, etc.) Further improvement is still needed, so developing a new type of thermal interface material using boron nitride nanosheets as a thermally conductive filler has become one of the problems to be solved in this field.