Tunneling magnetoresistance device driven by magnetic phase transformation
A technology of tunnel magnetoresistance and device, applied in the field of magnetoelectricity, can solve the problems of generating magnetoresistance effect and limiting the practical process.
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Embodiment 1
[0027] Example 1. Preparation of magnetic tunnel junction with MgO / α-FeRh / MgO / γ-FeRh structure
[0028] Deposit α-FeRh (bottom electrode) / MgO (tunneling layer) / γ-FeRh (top electrode) multilayer film structure by magnetron sputtering on the single crystal MgO (100) substrate, that is, the present invention has ferromagnetic Fabrication of Tunneling Magneto-Resistance Devices with Phase-Change Metals. In the multilayer film structure, α-FeRh is antiferromagnetic at room temperature, the thickness of the α-FeRh layer is 30nm, the thickness of the tunneling layer MgO is 2.7nm, and the thickness of γ-FeRh is 10nm. Such as figure 1 From the electron microscope photos shown, it can be seen that the interface of the prepared multilayer film is clear and smooth, and it is epitaxial growth. Subsequently, the multilayer film was processed into a size of 5 × 3 μm by UV exposure, argon ion etching combined with metal lift-off method 2 ~100×60μm 2 (20×10μm 2 ) tunnel junction, two wire...
Embodiment 2
[0031] Example 2. Preparation of magnetic tunnel junction with MgO / α-FeRh / γ-FeRh / MgO / γ-FeRh structure
[0032] Deposition of α-FeRh (bottom electrode) / γ-FeRh (insertion layer) / MgO (tunneling layer) / γ-FeRh (top electrode) multilayer film structure on a single crystal MgO(100) sheet by magnetron sputtering , that is, the metal with ferromagnetic phase transition of the present invention prepares tunnel magnetoresistance devices. In the multilayer film structure, α-FeRh is antiferromagnetic at room temperature, the thickness of the α-FeRh layer is 30nm, the thickness of the insertion layer γ-FeRh is 0.2-1.2nm, the thickness of the tunneling layer MgO is 2.7nm, and the top electrode The thickness of γ-FeRh is 10 nm. The interface of the prepared multilayer film is clear and smooth, and it is epitaxial growth. Subsequently, the multilayer film was processed into a size of 20×10 μm by UV exposure, argon ion etching combined with metal lift-off method 2 Tunnel junction, lead two w...
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