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Nanometer single-component flexible epoxy compound for magnetic core adhesion, and preparation method thereof

A nano-scale, one-component technology, applied in the direction of epoxy resin glue, adhesive type, polymer adhesive additives, etc., can solve the problem of glass transition temperature drop, poor dilution effect, linear expansion coefficient increase, etc. problem, to achieve the effect of reducing the coefficient of linear expansion and excellent process performance

Active Publication Date: 2018-02-02
MIANYANG WELLS ELECTRONICS MATERIAIS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Today, the core shells on the market are represented by MX-125, MX-154, MX-257 of Kaneka Company of Japan, W35 of Wacker Company of Germany, or EXL-2314, EXL-2655, EX-2620 of DOW Chemical Company of the United States. Rubber is also widely used. Although these tougheners obtained by blending with ordinary epoxy resins have good heat resistance (Tg will hardly decrease), they have high viscosity. It is difficult to add enough filler to reduce the linear expansion coefficient of the system
[0004] In order to reduce the viscosity, the conventional method is to add a reactive epoxy diluent, but adding a diluent will also bring about a decrease in the glass transition temperature and an increase in the linear expansion coefficient; in addition, multifunctional epoxy diluents have a diluting effect Not good, the brittleness of the system increases, which affects the use

Method used

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  • Nanometer single-component flexible epoxy compound for magnetic core adhesion, and preparation method thereof
  • Nanometer single-component flexible epoxy compound for magnetic core adhesion, and preparation method thereof
  • Nanometer single-component flexible epoxy compound for magnetic core adhesion, and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] Pre-mix 100g of tetrafunctional silicone-modified epoxy resin and 12.5g of Dow Chemical Company’s EXL-2620 nano-core-shell rubber particles. Under planetary stirring, gradually add the remaining 12.5g of EXL-2620 nano-core-shell rubber particles. Stir for 60 minutes under planetary stirring; then grind the mixture once with three rolls, and finally degas the nano-core-shell rubber toughening agent a, which has a viscosity of 1360mPa·s at 25°C.

[0030] First, 100g of E51 bisphenol A epoxy resin, 60g of nano-core shell rubber toughening agent a, 0.2g of defoamer, 0.2g of coupling agent, 150g of spherical silica powder with average particle size of 0.2μm, and 10g of thixotropic agent nano calcium carbonate Pre-mixing; stir under planetary stirring for 60 minutes, then add 14g of curing agent dicyandiamide and 10g of accelerator instead of urea while stirring, and then stir for 60 minutes under planetary stirring and vacuum degassing to obtain one-component tough epoxy composi...

Embodiment 2

[0032] Pre-mix 100g of tetrafunctional silicone-modified epoxy resin and 16.5g of Dow Chemical Company EXL-2620 nano core-shell rubber particles. Under planetary stirring, gradually add the remaining 16.5g EXL-2620 nano-core shell rubber particles, and then Stir for 60 minutes under planetary stirring; then, grind the mixture once with three rolls, and finally degas the nano-core-shell rubber toughening agent b with a viscosity of 5100 mPa·s at 25°C.

[0033] First, 100g of E51 bisphenol A epoxy resin, 45g of nano-core shell rubber toughening agent b, 0.2g of defoaming agent, 0.2g of coupling agent, 150g of spherical silica powder with an average particle size of 0.2μm, and 10g of thixotropic agent nano calcium carbonate Pre-mixing; stir for 60 minutes under planetary stirring, then add 12g of curing agent dicyandiamide and 8g of accelerator instead of urea while stirring, then stir for 60 minutes under planetary stirring and vacuum degassing to obtain one-component tough epoxy co...

Embodiment 3

[0035] Pre-mix 100g of tetrafunctional silicone modified epoxy resin and 12.5g of W35 nano core-shell rubber particles from Wacker. Under planetary stirring, gradually add the remaining 12.5g W35 nano-core shell rubber particles, and then under planetary stirring Stir for 60 minutes; then grind the mixture once with three rolls, and finally degas the nano-core-shell rubber toughening agent c, which has a viscosity of 1250 mPa·s at 25°C.

[0036] First, E51 bisphenol A epoxy resin 100g, nano core shell rubber toughening agent c 60g, defoaming agent 0.2g, coupling agent 0.2g, average particle size 0.2μm spherical silicon powder 150g, thixotropic agent nano calcium carbonate 10g Pre-mixing; Stir for 60 minutes under planetary stirring, then add 14g of curing agent dicyandiamide and 8g of accelerator imidazole while stirring, then stir for 60 minutes under planetary stirring and vacuum deaeration to obtain a one-component tough epoxy compound .

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Abstract

The invention discloses a nanometer single-component flexible epoxy compound for magnetic core adhesion. The nanometer single-component flexible epoxy compound for magnetic core adhesion comprises thefollowing components in parts by mass: 100 parts of epoxy resin, 4 to 30 parts of a curing agent, 4 to 20 parts of an accelerant, 0 to 5 parts of color paste, 3 to 60 parts of tetrafunctional organosilicon modified epoxy resin, 1 to 20 parts of nanometer rubber core-shell, 0.05 to 0.2 part of a defoaming agent, 0 to 0.2 part of a coupling agent, 0 to 0.2 part of a dispersing agent, 1 to 30 partsof a thixotropic agent and 10 to 300 parts of fillers. The invention also provides a preparation method of the single-component epoxy resin compound. The nanometer single-component flexible epoxy compound for magnetic core adhesion has the following advantages: the viscosity is low and the adding amount is small; the functionality degree is high, the adhesion can be improved and the linear expansion coefficient can be reduced; the brittleness of a Si-O bond in the curing process is lower than that of a C-C bond multifunctional diluent.

Description

Technical field [0001] The invention relates to an epoxy composite, in particular to a nano-level single-component tough epoxy composite for magnetic core bonding and a preparation method thereof, and belongs to the technical field of epoxy resin composites. Background technique [0002] One-component epoxy resin compound as an adhesive for magnetic cores, transformers and other electronic components has the advantages of strong adhesion and low linear expansion coefficient. However, due to the large stress when the epoxy resin is cured, it is easy to cause the magnetic core Cracked. Therefore, it is very important to toughen the epoxy compound and reduce its linear expansion coefficient. [0003] The general way to toughen epoxy is to add a toughening agent. Common toughening agents such as polyurethane modified epoxy, nitrile rubber modified epoxy, dimer acid modified epoxy, etc. These toughening methods can improve the toughness of the cured epoxy resin, but the disadvantage i...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J11/04C09J11/06C09J11/08
CPCC08K2003/265C08K2201/003C08K2201/011C08L2205/02C08L2205/025C08L2205/035C08L2207/53C09J11/04C09J11/06C09J11/08C09J163/00C08L63/00C08L9/00C08L83/04C08L9/06C08K7/18C08K3/26
Inventor 周鸿飞卓虎陆南平
Owner MIANYANG WELLS ELECTRONICS MATERIAIS
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