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Preparation method of soldering paste special for patch diode welding

A solder paste and diode technology, applied in the direction of welding equipment, welding media, welding/cutting media/materials, etc., can solve problems such as poor solderability, large residues, weak solder paste activity, etc., to inhibit oxidation and ensure soldering quality , Improve the effect of anti-oxidation performance

Inactive Publication Date: 2018-02-16
RUGAO XIAYUAN SCI & TECH ESTABLISH A BUSINESS SERVICES CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Because of its soft effect, the corrosiveness it brings is extremely small, and generally does not cause major harm. However, the prepared solder paste has weak activity and poor solderability, which is easy to cause virtual soldering.
2. There are many residues after welding
As a result, when the printed board assembly heats up rapidly during soldering and heating, the solvent in the solder paste cannot be completely evaporated and a large amount of residue is formed after soldering. Not only the appearance is not good, but also sticky
3. Poor thixotropy

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0017] The preparation method of the special solder paste for chip diode welding in this embodiment, the solder paste is composed of the following components by weight: 10 parts of tin-bismuth alloy solder powder, 60 parts of Sn-Ag-Cu series solder powder, nano titanium 2 parts of particles, 4 parts of graphene, 6 parts of phenolic resin, 1 part of malonic acid, 0.5 parts of lactic acid, 0.5 parts of benzoic acid, 6 parts of n-butyl lactate, 5 parts of ethylene glycol, 1.5 parts of alcohol polyoxyethylene ether And 1 part of nitromethane; The preparation method of described solder paste comprises the steps:

[0018] (1) Encapsulate the above-mentioned tin-bismuth alloy solder powder, Sn-Ag-Cu series solder powder and nano-titanium particles in a vacuum quartz tube, and then fill it with high-purity nitrogen protective gas;

[0019] (2) Put the packaged raw materials in step (1) into the reaction furnace for melting and heat treatment to obtain a completely melted melt;

[002...

Embodiment 2

[0023] The preparation method of the special solder paste for patch diode welding in this embodiment, the solder paste is composed of the following components by weight: 20 parts of tin-bismuth alloy solder powder, 80 parts of Sn-Ag-Cu series solder powder, nano-titanium 4 parts of particles, 6 parts of graphene, 10 parts of phenolic resin, 3 parts of malonic acid, 1.5 parts of lactic acid, 1.5 parts of benzoic acid, 12 parts of n-butyl lactate, 15 parts of ethylene glycol, 2.5 parts of alcohol polyoxyethylene ether And 3 parts of nitromethane; The preparation method of described solder paste comprises the steps:

[0024] (1) Encapsulate the above-mentioned tin-bismuth alloy solder powder, Sn-Ag-Cu series solder powder and nano-titanium particles in a vacuum quartz tube, and then fill it with high-purity nitrogen protective gas;

[0025] (2) Put the packaged raw materials in step (1) into the reaction furnace for melting and heat treatment to obtain a completely melted melt; ...

Embodiment 3

[0029] The preparation method of the special solder paste for patch diode welding in this embodiment, the solder paste is composed of the following components by weight: 14 parts of tin-bismuth alloy solder powder, 65 parts of Sn-Ag-Cu series solder powder, nano titanium 2.5 parts of particles, 4.5 parts of graphene, 7 parts of phenolic resin, 1.5 parts of malonic acid, 0.8 parts of lactic acid, 0.8 parts of benzoic acid, 8 parts of n-butyl lactate, 9 parts of ethylene glycol, 1.9 parts of alcohol polyoxyethylene ether And 1.5 parts of nitromethane; The preparation method of described solder paste comprises the steps:

[0030] (1) Encapsulate the above-mentioned tin-bismuth alloy solder powder, Sn-Ag-Cu series solder powder and nano-titanium particles in a vacuum quartz tube, and then fill it with high-purity nitrogen protective gas;

[0031] (2) Put the packaged raw materials in step (1) into the reaction furnace for melting and heat treatment to obtain a completely melted me...

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Abstract

The invention relates to a preparation method of a soldering paste special for patch diode welding. The soldering paste comprises the following components of, by weight, 10-20 parts of tin-bismuth alloy solder powder, 60-80 parts of Sn-Ag-Cu series solder powder, 2-4 parts of nano titanium particles, 4-6 parts of graphene, 6-10 parts of phenolic resin, 1-3 parts of malonic acid, 0.5-1.5 parts of lactic acid, 0.5-1.5 parts of benzoic acid, 6 to 12 parts of n-butyl lactate, 5-15 parts of ethylene glycol, 1.5-2.5 parts of alcohol-polyoxyethylene ether and 1-3 parts of nitromethane. The preparation method of the soldering paste special for patch diode welding has the advantages that by means of the components of the method and the appropriate proportion, the soldering paste can effectively guarantee the welding quality and then can be effectively applied to electronic components.

Description

technical field [0001] The invention relates to a solder paste, in particular to a special solder for patch diode welding [0002] The method of preparation of paste. Background technique [0003] Solder paste is a new type of soldering material that accompanies SMT. Solder paste is a complex system, which is a paste mixed with solder powder, flux and other additives. Solder paste has a certain viscosity at room temperature, which can initially stick electronic components to a predetermined position. At the soldering temperature, with the volatilization of solvents and some additives, the soldered components and printed circuit pads are welded together to form Permanent connection. [0004] Solder paste is widely used in high-precision electronic components. On the one hand, solder paste can isolate electronic components from the air, thereby achieving isolation and preventing oxidation; on the other hand, solder paste can ensure strong soldering performance of electronic...

Claims

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Application Information

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IPC IPC(8): B23K35/40B23K35/22
CPCB23K35/40B23K35/22
Inventor 曹建民
Owner RUGAO XIAYUAN SCI & TECH ESTABLISH A BUSINESS SERVICES CO LTD
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