Phase-change high-thermal-conductivity interface material and preparation method thereof

An interface material and high thermal conductivity technology, applied in the direction of heat exchange materials, chemical instruments and methods, etc., can solve the problems of poor thermal stability and achieve the effects of reducing contact thermal resistance, good repeatability, and good thermal conductivity

Inactive Publication Date: 2018-02-23
SUZHOU ENBRIGHTECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a phase change high thermal conductivity interface material and its p

Method used

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  • Phase-change high-thermal-conductivity interface material and preparation method thereof
  • Phase-change high-thermal-conductivity interface material and preparation method thereof
  • Phase-change high-thermal-conductivity interface material and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] The mass percent of each raw material is:

[0032]

[0033] 1) Add synthetic polymers with high melting point and alkane additives into the reaction kettle, stir at 160°C for 1 hour, then add synthetic polymers with low melting point, cool down to 120°C and stir for 30 minutes, then add phase change materials and modification additives , after stirring at 120°C for 1 hour, add high thermal conductivity filler particles treated by coupling agent surface, cool down to 90-100°C and stir in vacuum for 40 minutes, defoaming;

[0034] 2) After the product obtained in step 1) is melted on the overheated platform, the upper and lower layers are covered with a protective film, and rolled by a calender to obtain a phase-change high thermal conductivity interface material with a thickness of 0.15 mm.

Embodiment 2

[0036] The mass percent of each raw material is:

[0037]

[0038] 1) Add synthetic polymers with high melting point and alkane additives into the reaction kettle, stir at 160°C for 1 hour, then add synthetic polymers with low melting point, cool down to 120°C and stir for 30 minutes, then add phase change materials and modification additives , after stirring at 120°C for 1 hour, add high thermal conductivity filler particles treated by coupling agent surface, cool down to 90-100°C and stir in vacuum for 40 minutes, defoaming;

[0039] 2) After the product obtained in step 1) is melted on the overheated platform, the upper and lower layers are covered with a protective film, and rolled by a calender to obtain a phase-change high thermal conductivity interface material with a thickness of 0.25 mm.

[0040] The performance of the phase change high thermal conductivity interface material prepared in Example 1-2 is as follows:

[0041]

[0042]

[0043] It can be conclud...

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PUM

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Abstract

The invention relates to a phase-change high-thermal-conductivity interface material and a preparation method thereof. The phase-change high-thermal-conductivity interface material comprises a phase-change high-thermal-conductivity interface material layer, wherein protective film layers are arranged on the upper side and bottom side of the phase-change high-thermal-conductivity interface materiallayer and refer to one or several in PET (Polyethylene Terephthalate) release films, PE release films and release paper; and the phase-change high-thermal-conductivity interface material layer comprises a main composite phase-change base material, high-thermal-conductivity filler particles and performance additives. The phase-change high-thermal-conductivity interface material disclosed by the invention has excellent thermal cycling stability and impact resistance.

Description

technical field [0001] The invention relates to the field of phase-change thermally conductive materials, in particular to a phase-change high thermally conductive interface material and a preparation method thereof. Background technique [0002] The integration of modern electronic components and the complexity of circuit design are constantly increasing. With smaller areas and thinner thicknesses, the heat dissipation requirements brought about by the heating of these multifunctional electronic components are also more stringent. Traditional interface materials have already met No heat transfer requirements. [0003] Traditional interface materials (thermally conductive tape, thermally conductive silicone sheet, thermally conductive silicone grease, etc.) have their obvious defects, such as low thermal conductivity of the tape (about 1w / mk), and the thickness of the thermally conductive silicone sheet cannot be very thin (T≥0.3mm ), the performance of thermal grease is un...

Claims

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Application Information

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IPC IPC(8): C09K5/06
Inventor 谷旭宋丽萍
Owner SUZHOU ENBRIGHTECH
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