Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Strong anti-mismatch high-efficiency power amplifier based on transistor stacking technology

A power amplifier and power amplification technology, which is applied in the direction of amplifiers and amplifiers with semiconductor devices/discharge tubes, improving amplifiers to improve efficiency, etc., can solve the problems of reducing the efficiency of power amplifiers, difficult design, and limiting the power capacity of power transistors , to achieve the effect of improving power gain and power capacity, improving stability and reliability, and reducing design complexity

Pending Publication Date: 2018-02-27
CHENGDU GANIDE TECH
View PDF0 Cites 15 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] (1) Strong anti-mismatch characteristics and high-efficiency indicators in traditional balanced amplifiers restrict each other: since the output of the power amplifier in the microwave and millimeter-wave front-end transmitter needs to be connected to an antenna with poor standing wave characteristics, the antenna is not suitable for microwave The anti-mismatch characteristics of millimeter-wave power amplifiers pose a severe challenge; the existing balanced power amplifiers based on the Lange structure to achieve a 90° phase shift enhance the anti-mismatch characteristics, and often introduce large The in-band insertion loss reduces the efficiency of the power amplifier
Therefore, strong anti-mismatch characteristics and high efficiency indicators in traditional balanced amplifiers are mutually restricted
[0005] (2) It is difficult to design high-power and high-gain indicators of traditional balanced amplifiers in the microwave and millimeter wave bands: driven by the future 5G market, microwave and millimeter wave front-end transmitters urgently need high gain, high power, high efficiency, and strong mismatch resistance Power amplifiers, but the existing millimeter-wave frequency band application circuits must use semiconductor process transistors with small gate lengths. Affected by their low breakdown voltage, the voltage swing of power amplifiers will be greatly limited, so it is also limited The power capacity of the power transistor
[0008] In order to improve the anti-mismatch characteristics of the circuit, designers often need to use the Lange structure to achieve a 90° phase shift of the two balanced structure signals, and also reduce the introduced in-band loss as much as possible, while ensuring that the two balanced signals have similar The same in-band loss, in addition, it is necessary to cooperate with other matching structures to achieve impedance matching between the input of the transistor and the input port, which greatly increases the complexity and difficulty of circuit design
In order to compromise various design indicators, designers often need to introduce a certain in-band loss to achieve a 90° phase shift and impedance matching, which greatly reduces the efficiency indicators of the power amplifier.
[0009] (2) It is difficult to match the impedance of high-power transistors in the millimeter wave band
[0010] Since the amplifier works in the millimeter wave band, the power capacity of a single transistor is limited. In order to obtain a higher power capacity, the designer often needs a 2n times power combining structure. This structure often leads to a very low optimal load impedance of the output network, which is This kind of low load impedance will make the impedance matching of microwave and millimeter wave band balanced amplifiers more difficult

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Strong anti-mismatch high-efficiency power amplifier based on transistor stacking technology
  • Strong anti-mismatch high-efficiency power amplifier based on transistor stacking technology

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0033] Exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be understood that the implementations shown and described in the drawings are only exemplary, intended to explain the principle and spirit of the present invention, rather than limit the scope of the present invention.

[0034] An embodiment of the present invention provides a high-efficiency power amplifier with strong anti-mismatch based on transistor stacking technology, such as figure 1 As shown, including -45° phase-shift input matching network, +45° phase-shift input matching network, dual-channel balanced three-stack power amplifier network, +45° phase-shift output matching network, -45° phase-shift output matching network, The first power supply bias network and the second power supply bias network. The input end of the -45° phase-shifting input matching network is connected with the input end of the +45° phase-shifting input ma...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a strong anti-mismatch high-efficiency power amplifier based on a transistor stacking technology. The power amplifier comprises a -45-degree phase-shifting input matching network, a +45-degree phase-shifting input matching network, a double-path balance type three-stack power amplification network, a +45-degree phase-shifting output matching network, a -45-degree phase-shifting output matching network, a first power supply bias network and a second power supply bias network. According to the power amplifier, a three-stack transistor amplification network is adopted to realize an amplification function of the balance type amplifier, so that the power gain and the power capacity of the balance type power amplifier are improved, and meanwhile, a three-stage T-shaped filtering type phase-shifting circuit is used for realizing the + / -45-degree phase-shifting control of two paths of balance signals and input and output impedance matching, so that the anti-mismatch characteristic of the amplifier is greatly improved on the premise of ensuring low insertion loss and high efficiency, and thus the stability and the reliability of the circuit are improved. A strong anti-mismatch high-efficiency power amplifier chip circuit realized by the invention is high in output power, high in power gain and small in area.

Description

technical field [0001] The invention belongs to the technical field of field-effect transistor microwave millimeter wave power amplifiers and integrated circuits, and in particular relates to the design of a strong anti-mismatch high-efficiency power amplifier based on transistor stacking technology. Background technique [0002] With the rapid development of 3G, 4G-LTE and other civil communication markets, as well as the early layout of 5G communication, microwave and millimeter wave front-end transmitters are also developing in the direction of high performance, high integration, and high efficiency in microwave and millimeter wave bands; in addition, due to MIMO With the wide application of technology, the system puts a severe test on the anti-mismatch characteristics of the terminal power amplifier. Therefore, the market urgently needs strong anti-mismatch and high-efficiency power amplifier chips for microwave and millimeter wave frequency bands. [0003] However, in t...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H03F3/213H03F1/56H03F1/02
CPCH03F1/0205H03F1/565H03F3/213Y02D30/70
Inventor 邬海峰滑育楠王测天陈依军廖学介吕继平胡柳林童伟吴曦杨云婷
Owner CHENGDU GANIDE TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products