Ultraviolet (UV) adhesive tape and preparation method thereof
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A tape and adhesive layer technology, applied in the direction of adhesives, epoxy resin glue, adhesive types, etc., can solve the problems of easy residual glue, easy flying crystals, low degree of crosslinking, etc.
Pending Publication Date: 2018-03-06
上海固柯胶带科技有限公司 +1
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[0004] 1) The domestic use of acrylic resin is not appropriate, so that the adhesion effect is poor, the adhesion and cohesion are insufficient, and it is prone to flying crystals and residual glue;
[0005] 2) In China, unsaturated resins with 3 carbon-carbon double bonds are mostly used, and the adhesive tape has poor viscosity reduction; after ultraviolet irradiation, the adhesive force is about 50g/20mm, which is completely impossible to pick
[0006] 3) In addition, mostly trifunctional isocyanate crosslinking agents are used in China. After reacting with acrylic resin, the crosslinking degree of this crosslinking agent is relatively low, and the cohesion is relatively low, which is prone to residual glue
[0007] 4) A single photoinitiator is mostly used in China, and the tape’s viscosity reduction is poor; for example, 1-benzoylcyclohexanol is mostly used in China, and the UV adhesive layer is greatly affected by the shielding of the PVC film, so that the effect of reducing the adhesion is greatly affected. impact, totally impossible to pick
[0008] In addition, when the...
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Embodiment 1
[0063] Acrylic resin with a glass transition temperature of -20 to -30°C: 80 parts;
[0064] Polyunsaturated resin containing multiple carbon-carbon double bonds in a single molecule: 20 parts;
[0065] Absorption wavelength of 265nm ~ 410nm photoinitiator: 3 parts;
[0066] Epoxy resin cross-linking agent: 2 parts;
[0067] UV glue layer The thickness of the glue layer is 20μm;
[0068] Implementation Effect:
[0069] Adhesion before lighting: 1200gf / 20mm
[0070] Adhesion after light exposure: ≦10gf / 20mm
Embodiment 2
[0072] Acrylic resin with a glass transition temperature of -20 to -30°C: 75 parts;
[0073] Polyunsaturated resin containing multiple carbon-carbon double bonds in a single molecule: 25 parts;
[0074] Absorption wavelength of 265nm ~ 410nm photoinitiator: 3 parts;
[0075] Epoxy resin cross-linking agent: 5 parts;
[0076] Adhesive layer thickness 10μm;
[0077] Implementation Effect:
[0078] Adhesion before lighting: 300gf / 20mm
[0079] Adhesion after light exposure: ≦10gf / 20mm
Embodiment 3
[0081] Acrylic resin with a glass transition temperature of -20 to -30°C: 75 parts;
[0082] Polyunsaturated resin containing multiple carbon-carbon double bonds in a single molecule: 25 parts;
[0083] Absorption wavelength of 265nm ~ 410nm photoinitiator: 3 parts;
[0084] Epoxy resin cross-linking agent: 3 parts;
[0085] Adhesive layer thickness 20μm;
[0086] Implementation Effect:
[0087] Adhesion before lighting: 500gf / 20mm
[0088] Adhesion after light exposure: ≦10gf / 20mm
[0089] like figure 2 As shown, the technical solution of the present invention is aimed at the above-mentioned UV adhesive tape, and also provides a preparation scheme for UV adhesive tape, specifically including:
[0090] Step S1, using the PVC film guide roller to corona treat the PVC film on the surface of the PVC film through a corona treatment device; control the surface tension of the PVC film to be above 42 dynes;
[0091] Step S2, the PVC film after corona is transported to the UV ...
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Abstract
The invention relates to the technical field of wafer dicing adhesive glue, and particularly relates to an ultraviolet (UV) adhesive tape and a preparation method thereof. The UV adhesive tape comprises a PET (polyethylene terephthalate) released protective film, an UV (Ultraviolet) glue layer and a PVC (Polyvinyl Chloride) film which are sequentially stacked up and down; the UV glue layer is prepared from the following components in parts by mass: 50 to 100 parts of acrylic resin with a vitrified temperature of minus 20 to minus 30 DEG C, 0 to 5 parts of epoxy resin cross-linking agents, 0 to50 parts of carbon-carbon double-bond multi-element unsaturated resin and 0 to 10 parts of photoinitiator mixed liquid. According to the UV adhesive tape disclosed by the invention, the defect that aglue layer is too soft or too hard can be improved, adhesion and separation of glue residues formed in the back side of a wafer and an iron ring can be avoided, and the adhesion reduction effect of the adhesive tape also can be greatly improved so as to ensure that a picking rate is 100 percent; by utilizing polycondensation reaction on the epoxy resin cross-linking agents and the acrylic resin,glue materials are cross-linked in a net manner, and a hydroxyl functional group is produced, so that Van der Wals force between the hydroxyl functional group and a PVC film is greatly improved, and adhesive power and cohesion force are greatly enhanced; meanwhile, the UV adhesive tape has the characteristics of low cost, less pollution and the like.
Description
technical field [0001] The invention relates to the technical field of wafer cutting adhesives, in particular to a UV adhesive tape and a preparation method thereof. Background technique [0002] In the prior art, all the UV tapes used in China come from Japan. Its structure mainly includes PVC film, UV adhesive layer, and PET release protective film. When using, the release protective film is torn off and pasted on the back of the wafer. After the processing is completed, the adhesive force of the UV adhesive layer in the tape is rapidly reduced to almost zero through ultraviolet radiation from the direction of PVC, so that it is easy to pick. [0003] At present, the current situation of UV adhesive layer used in most domestic products is mainly reflected in the following points: [0004] 1) The domestic use of acrylic resin is not appropriate, so that the adhesion effect is poor, the adhesion and cohesion are insufficient, and it is prone to flying crystals and residual ...
Claims
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Application Information
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