High-temperature planar transformer employing metal coated ceramic substrate

Abstract

A high-temperature planar transformer employing a metal coated ceramic substrate comprises a dual-annular closed-structure magnetic core and multiple groups of ceramic substrate planar coils employinga metal coated technology, wherein the dual-annular closed-structure magnetic core is formed by splicing a group of Fe-Ni-Mo metal magnetic powder cores, all planar coil assemblies form a primary winding and a secondary winding of the transformer, an installation hole is reserved in the ceramic substrate employed by the high-temperature planar transformer and is used for placing the metal magnetic powder core material magnetic cores, and two parts of magnetic cores are placed in the installation hole from two sides of the ceramic substrate and then are abutted and pasted to a whole. Comparedwith a traditional winding transformer and a planar transformer, the high-temperature planar transformer employing the metal coated ceramic substrate has the following advantages that the power density of the transformer can be substantially improved by employing the metal coated ceramic substrate, the leakage inductance and the distributed capacitance of the transformer are reduced, the cooling efficiency is improved, moreover, the transformer can work for a long time in a high-temperature environment of 200 DEG C or above, so that the cooling design of the transformer can be simplified, thesize and the weight of the transformer are reduced, and meanwhile, the design requirement of aerospace and oil drilling in high-temperature environment industry on a switch power supply is met.

Description

technical field [0001] The invention designs a planar transformer, mainly a high-temperature planar transformer using metal bonding ceramic substrates. Background technique [0002] Traditional planar transformers mostly use flat enameled wire winding technology, PCB printed circuit technology, or a hybrid structure of the two. The flat enameled wire winding process has a large volume, high leakage inductance, and poor consistency; the PCB printed circuit coil has a compact structure, but it cannot work at high frequency and high temperature. The PCB printed circuit process can also be replaced by a low-temperature co-fired ceramic LTCC process to enhance high-frequency performance, but the low-temperature co-fired ceramic process is formed by printing metal paste on the green tape and co-sintering, due to the shrinkage of the metal paste and the green tape The rate is inconsistent, and the width and thickness of the printed metal wires are limited, which cannot withstand l...

AI Technical Summary

Problems solved by technology

The flat enameled wire winding process has a large volume, high leakage inductance, and poor consistency; the PCB printed circuit coil has a compact structure, but it cannot work at high frequency and high temperature

The PCB printed circuit process can also be replaced by a low-temperature co-fired ceramic LTCC process to enhance high-frequency performance, but the low-temperature co-fired ceramic process is formed by printing metal paste on the green tape and co-sintering, due to the shrinkage of the metal paste and the green tape The rate is inconsistent, the printed metal wire width and thickness are limited, and cannot withstand large currents

The planar transformers used in traditional switching power supplies generally use ferrite cores. The Curie temperature is low, and the magnetic permeability decreases at high temperatures, making it unable to work normally. Drilling and other industries with high temperature environments have design requirements for high temperature and high power density of planar transformers in switching power supply modules

Images