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A preparation method of flux for solder paste and its ultrasonic rapid cooling system

A technology of flux and solder paste is applied in the field of preparation of flux for solder paste.

Active Publication Date: 2020-01-10
云南锡业新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, there are many types of fluxes for solder paste, and the flux components and ratios of each solder paste manufacturer are different, but there is a commonality of poor stability, which is mainly manifested in the fact that it is easy to separate after a period of time
In addition, the flux is also easy to crystallize during the cooling process, appearing sandy

Method used

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  • A preparation method of flux for solder paste and its ultrasonic rapid cooling system

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Experimental program
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Effect test

Embodiment 1

[0015] The preparation method of SnAgCu series flux for solder paste, the method steps are as follows:

[0016] (1) Place the modified rosin in the SnAgCu series flux in the emulsification equipment to heat and melt, the heating temperature is 140℃~145℃; among them, the modified rosin is the compound of KE-604 rosin and KR-610 rosin, the ratio It is 3:2.

[0017] (2) Slowly add the prepared solvents diethylene glycol dimethyl ether and diethylene glycol octyl ether into the emulsification equipment of melted modified rosin in proportion, keep the temperature at 135 ° C ~ 140 ° C, emulsify at high speed for 30 minutes, and emulsify The speed is 3000rpm and the weight ratio of the two ethers is 1:3.

[0018] (3) Add the active agent tetracosacic acid and succinic acid mixture, the thixotropic agent ricinoleoyl diethanolamine and lauryl hydroxystearic acid mixture amide in the emulsification equipment in proportion, keep the temperature at 125 ° C ~ 130 ° C, High-speed emulsifi...

Embodiment 2

[0021] The preparation method of SnPb series flux for solder paste, the method steps are as follows:

[0022] (1) Place the modified rosin in the SnPb series flux in the emulsification equipment to heat and melt. The heating temperature is 145°C-150°C. Among them, the modified rosin is a compound of KE-604 and water-white rosin, and the ratio is 1. :1.

[0023] (2) Slowly add the prepared solvents diethylene glycol dimethyl ether and diethylene glycol octyl ether into the emulsification equipment of melted modified rosin in proportion, keep the temperature at 130 ° C ~ 135 ° C, emulsify at high speed for 30 minutes, and emulsify The speed is 4000rpm, the weight ratio of the two ethers is 1:1

[0024] (3) Add the mixture of active agent lignoceric acid and adipic acid, the mixture of thixotropic agent ricinoleoyl diethanolamine and lauryl hydroxystearic acid amide into the emulsification equipment in proportion, keep the temperature at 120℃~125℃, Emulsify for 20 minutes, and ...

Embodiment 3

[0027] The preparation method of SnBi-X series flux for solder paste, the method steps are as follows:

[0028] (1) Prepare the modified rosin in the SnBi-X series flux according to the proportion, weigh it, place it in the emulsification equipment to heat and melt it, and the heating temperature is 140℃~150℃. Among them, the modified rosin is a compound of KE-604 rosin and water white rosin, the ratio is 1:2.

[0029] (2) Slowly add the prepared solvents diethylene glycol dimethyl ether and diethylene glycol octyl ether into the melted modified rosin in proportion, place in the emulsification equipment, keep the temperature at 130°C to 140°C, and emulsify at a high speed for 30 minutes, the emulsification speed is 3500rpm; the weight ratio of the two ethers is 3:2

[0030] (3) Add the mixture of active agent lignoceric acid and stearic acid, the mixture of thixotropic agent ricinoleoyldiethanolamine and lauryl hydroxystearic acid amide in the emulsification equipment, keep t...

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Abstract

A preparation method of flux for solder paste and its ultrasonic rapid cooling system. The preparation method of flux is to heat and melt modified rosin at 140°C to 150°C, and then slowly add solvent to the melted modified rosin, and keep the temperature at 130 ℃~140℃, high-speed emulsification for 30 minutes, the emulsification speed is 3000rpm~4000rpm; then add active agent and thixotropic agent, keep the temperature at 120℃~130℃, high-speed emulsification for 20 minutes, the emulsification speed is 3000rpm~4000rpm; emulsification is completed The material is poured into a glass container, and then placed in cooling water subjected to ultrasonic waves for rapid cooling until the material solidifies. The flux used for the solder paste prepared by the invention is fine and uniform, has good stability, and does not have the stratification phenomenon of the flux.

Description

technical field [0001] The invention relates to the technical field of preparation methods of soldering flux for solder paste. Background technique [0002] Solder paste is mainly used in surface mount technology (SMT) welding. With the development of electronic information equipment, SMT has become the mainstream technology of electronic assembly, and its usage is increasing day by day. [0003] At present, there are many types of fluxes for solder paste. The flux components and ratios of each solder paste manufacturer are different, but there is a common feature of poor stability, which is mainly manifested in the fact that it is easy to separate after a period of time. In addition, the flux is also easy to crystallize during the cooling process and appears sandy. This affects its performance to a certain extent. Contents of the invention [0004] The purpose of the present invention is to overcome the defects of the above-mentioned prior art, and provide a preparation...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/36B01F3/08B01F15/06
CPCB23K35/3613B01F23/4105B01F2035/98B01F35/92
Inventor 秦俊虎白海龙武信段雪霖沈海斌卢梦迪何欢吕金梅刘宝权张欣周建东陈希唐丽解秋莉
Owner 云南锡业新材料有限公司
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