Flexible transparent circuit manufacturing method

Abstract

The application relates to a flexible transparent circuit manufacturing method comprising the following steps: a circuit template is made, a solidified transparent carrier having a groove circuit structure is made of flexible transparent high-molecular material on the circuit template, an electroconductive material solution is coated in a groove of the solidified transparent carrier, and a circuitwhich is high in transparency and electric conductivity is obtained after the solution is volatilized. Electroconductive material adopted in the flexible transparent circuit manufacturing method is in a solid state, the whole circuit is transparent, and a circuit board is high in electric conductivity and transparency. The circuit can be designed and manufactured as needed, and precision can reach a micrometer or nanometer level. The method disclosed in the invention is simple and high in reappearance, and portability of the manufactured circuit is improved. The circuit can be stretched, bentor distorted repeatedly. The circuit is light in weight and is high in biologic compatibility. The circuit manufactured via the method is expected to be applied to a plurality of fields of intelligent contact lenses, rollable transparent electronic devices, electronic skin and the like.

Description

[0001] This application is a divisional application with the application number 2017103567120, the application date is May 19, 2017, and the invention name is "a method for preparing a flexible transparent circuit". technical field [0002] The invention belongs to the field of circuits and circuit boards, and in particular relates to a preparation method of a flexible transparent circuit. Background technique [0003] With the rapid development of wearable medical devices and transparent electronic equipment industries, more and more researchers have begun to pay attention to flexible transparent circuits. The breakthroughs in flexible transparent circuit materials and methods are of great significance to the above two fields. Currently, there are only a few reports on flexible transparent circuits, and the most commonly used material is graphene. But regarding the transparent circuit formed by graphene, it has the following weaknesses: [0004] 1. Graphene film is easy to...

AI Technical Summary

Problems solved by technology

[0004] 1. Graphene film is easy to form wrinkles, especially large-area graphene film

[0005] 2. Graphene film is difficult to carry out precise quality control, and the film is prone to damage

[0006] 3. Graphene films are difficult to mass-produce

However, this method is complicated in process, the circuit control is not precise, and the circuit cannot obtain good conductivity, transparency and flexibility at the same time, which limits its application.

[0009] Chinese patent CN101505575A discloses a method for preparing a biocompatible flexible circuit based on PDMS. Although the substrate PDMS of the patent is transparent, the liquid metal tin-indium-gallium alloy in the circuit part is non-transparent, that is, the substrate is transparent. Circuits with opaque conductive substances

At the same time, the conductive part of the flexible circuit is liquid metal, and liquid leakage is likely to occur where the conductive parts and wires are in contact with the liquid metal, and cannot be plugged in and out casually, otherwise the circuit will fail

Since the conductive part of the flexible circuit is liquid metal, another sheet must be covered on the substrate with holes, so that the sheet and the substrate together form a complete closed hole, so that the conductive metal liquid can be kept in the hole without loss , so the requirements for the sealing of the channel are very high, if the sealing is not good, the leakage of liquid metal is prone to occur, causing a short circuit

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