Dry type flexible grinding and polishing method and matching cutter and device thereof

Abstract

The invention discloses a dry type flexible grinding and polishing method and a matching cutter and device of the dry type flexible grinding and polishing method. The dry type flexible grinding and polishing method involves application of dry type grinding and polishing cutters and flexible copying elastic mats to a dry type flexible grinding and polishing device. The invention further provides the dry type flexible grinding and polishing device comprising a ring flow grinding mechanism. The ring flow grinding mechanism comprises a grinding head support, a main shaft, a revolution disk, a revolution motor and grinding tool modules. Each grinding tool module comprises a rotation blank polishing motor and a dry abrasive grinding wheel. The dry abrasive grinding wheels are provided with dry type grinding and polishing cutters and flexible copying elastic mats. According to the cutter, a ceramic bond wraps diamond or cubic boron carbide or the like, an abrasive material good in grinding and polishing performance is obtained through sintering, after the abrasive material is smashed so as to obtain abrasive particles, the abrasive particles are mixed with a binding agent, and then the wear-proof heat-insulating cutter good in holding effect and used for dry grinding and polishing is manufactured. The problem that during dry type grinding and polishing, generated high temperature shortens the service life of the cutter is solved. The dry grinding and polishing theory is converted into an operable machining manner, and then a traditional wet grinding and polishing manner can be thoroughly abandoned.

Description

technical field [0001] The invention relates to the technical field of plate processing equipment such as ceramics and stone materials. Background technique [0002] At present, the polishing production of ceramic stone adopts wet grinding and polishing. Water is usually used as the grinding and polishing medium to cool down, prevent tool overheating, and remove chips. This method can meet the surface processing of ceramic and stone industries. However, wet grinding and polishing has the following disadvantages: ①The grinding and polishing medium will form a liquid film on the brick surface, and the liquid film will generate buoyancy on the working surface of the cutter and hinder the bonding of the cutter. Therefore, the grinding and polishing machine needs to exert downward force on the abrasive tool The pressure to compress the thickness of the liquid film, so that the abrasive grains on the working surface of the tool can cut the plate normally, but the thickness of the ...

AI Technical Summary

Problems solved by technology

However, wet grinding and polishing has the following disadvantages: ①The grinding and polishing medium will form a liquid film on the brick surface, and the liquid film will generate buoyancy on the working surface of the cutter and hinder the bonding of the cutter. Therefore, the grinding and polishing machine needs to exert downward force on the abrasive tool The pressure to compress the thickness of the liquid film, so that the abrasive grains on the working surface of the tool can cut the plate normally, but the thickness of the liquid film will be affected by the original roughness of the brick surface and change, making it difficult for the required pressure strength of the abrasive tool Be sure, if the pressure is insufficient, the grinding and polishing efficiency will be reduced, and if the pressure is too high, the brick surface will be damaged; ② It is necessary to configure a circulation treatment system for grinding and polishing media, which will cause problems such as large water consumption and sewage discharge, and will also corrode the equipment, affecting grinding and polishing ③During the grinding and polishing process, the grinding and polishing medium will squeeze into the slits of the brick surface under the action of molecular adsorption along the path of abrasive cutting, and the wedge force generated by it will cause secondary damage, making the slits Expansion, reducing the surface properties of the brick surface

However, the industry today lacks the application and exploration of perfect dry grinding and polishing theory and methods

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