Efficient energy-saving environment-friendly resin plate for diamond wire cutting silicon wafer and degumming method

Abstract

The invention relates to an efficient energy-saving environment-friendly resin plate for a diamond wire cutting silicon wafer. The resin plate is fixed to one side of a silicon ingot needed to be cut;the filler of the resin plate is glass fiber powder; the density of the resin plate is 0.6g / cm<3> when the thickness of the resin plate is controlled at 25mm by adding the glass fiber powder; at least two through holes are formed in the middle of the resin plate along the thickness direction of the resin plate, and the through holes are uniformly distributed in a spaced manner. According to the efficient energy-saving environment-friendly resin plate for the diamond wire cutting silicon wafer provided by the invention, the cutting efficiency can be improved, the processing efficiency of silicon wafer slicing time is improved, and the utilization ratio of equipment is improved; the use level of degumming and washing water is reduced; the weight of the integral resin plate is reduced, the light weight problem for treatment of the resin plate as a waste is solved, and the resin plate plays roles of being energy-saving and environment-friendly.

Description

technical field [0001] The invention belongs to the field of solar photovoltaic power generation, and relates to diamond wire slicing of silicon wafers, in particular to a high-efficiency, energy-saving and environment-friendly resin plate for diamond wire cutting silicon wafers and a degumming treatment method. Background technique [0002] In the field of solar photovoltaic power generation, when processing silicon ingots to form silicon wafers, it is necessary to slice through diamond wires and use resin board auxiliary materials to bond silicon ingots. After cutting, the silicon wafers need to be degummed and cleaned. The resin plate is separated. The defects of the traditional resin plate design and section degumming and rinsing method are: (1) The resin plate is made of resin and aluminum hydroxide as filler, Shore hardness is A93, and the thickness is thin (about 15mm). In order to prevent the diamond wire from being cut at the end If it exceeds the resin board, the ...

AI Technical Summary

Problems solved by technology

The defects of the traditional resin plate design and section degumming and rinsing method are: (1) The resin plate is made of resin and aluminum hydroxide as a filler, the Shore hardness is A93, and the thickness is thin (about 15mm). In order to prevent the diamond wire from being cut at the end If it exceeds the resin board, the speed of the table needs to be reduced in advance, and the closing time of the tail is about 40 minutes, which seriously affects the production efficiency; (2) The density of the traditional resin board is 1.5g / cm 3 About, after each cutting, the resin board needs to be scrapped. The weight of each resin board after cutting is about 1.3kg. According to the slice production capacity of different volumes, the processing weight of the resin board produced per month can reach about 15 tons. , bringing higher processing costs to environmental protection treatment; (3) After each cutting, it is necessary to put the silicon wafer 3 and the resin plate 1 into the degumming spray tooling for degumming and spraying cleaning of the silicon wafer, such as figure 1 As shown, the tap water is sprayed by the water pipes 4 on both sides. Since the water flow cannot reach the middle of the silicon wafer 3 during spraying, and the silicon wafer is thin, the high spray water pressure will cause the product to be scrapped and bring The problem of waste of spray water resources, the spray pressure is 0.1 Pa, the flushing time is 700 seconds long, and the water used for cleaning a crystal rod reaches about 600 liters

[0003] It can be seen that when the existing resin board design and section degumming and washing treatment method are cut, when the steel wire is close to the resin board, the equipment needs to be slowed down, which affects the processing time and causes waste in equipment utilization; the resin board is scrapped. Increase the pressure of environmental protection; during the cleaning process of silicon wafers, a large amount of tap water is required to rinse the silicon wafers, resulting in a waste of water resources

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