Thermal-insulation three-dimensional hollow composite board and application thereof

A technology of three-dimensional hollow and composite panels, which is applied in the direction of synthetic resin layered products, layered products, transportation and packaging, etc., can solve the problems of limited application range, thermal insulation performance of three-dimensional hollow composite materials cannot meet technical requirements, etc., and achieve cost Low, excellent promotion value, good effect of deformation resistance

Active Publication Date: 2018-04-06
NANJING FIBERGLASS RES & DESIGN INST CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] Although the thermal insulation performance of three-dimensional hollow composite materials is excellent, its application range is more and more restricted, mainly because the requirements for the thermal insulation performance of materials in the f

Method used

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  • Thermal-insulation three-dimensional hollow composite board and application thereof
  • Thermal-insulation three-dimensional hollow composite board and application thereof

Examples

Experimental program
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Example Embodiment

[0031] Example 1

[0032] See figure 1 ,in figure 1 The appropriately marked arrow H indicates the thickness direction of the core layer, which is also the thickness direction of the insulated three-dimensional hollow composite panel.

[0033] The insulated three-dimensional hollow composite panel is a sandwich structure, including a core layer 30 and reinforcement layers located on both sides of the thickness direction H of the core layer 30. The core layer 30 includes a foam layer 31 and a foam layer 31 made of resin A. Into the reinforced rib 32. For the convenience of description, the reinforcement layers located on both sides of the core layer 30 are respectively referred to as the first reinforcement layer 10 and the second reinforcement layer 20. Both the first reinforcement layer 10 and the second reinforcement layer 20 are made of three-dimensional hollow composite materials. The resin B is compounded to the foam layer 31, and the reinforcing ribs 32 penetrate the foam la...

Example Embodiment

[0047] Example 2

[0048] This embodiment is basically the same as embodiment 1, and the difference lies in:

[0049] In this embodiment, the components of resin A and resin B are the same, both are unsaturated polyester resins, and are the same as the resin used in the resin matrix.

[0050] The diameter of the rib holes is 5mm, the rib holes are arranged in a matrix, and the center distance between adjacent rib holes is 25mm.

[0051] The thickness of each reinforcement layer in this embodiment is 15mm, and the areal density is 3kg / m 3 (The surface density of a traditional skin of equal thickness is 30kg / m 2 ). The resin matrix in the three-dimensional hollow composite material is an unsaturated polyester resin, and the mass ratio of the resin matrix to the reinforcement is 10:8.

[0052] The foam layer in the core layer is polyurethane foam, the thickness of the core layer is 20mm, and the surface density is: 120kg / m 3 , The reinforcing rib is made of unsaturated polyester resin, an...

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Abstract

The invention discloses a thermal-insulation three-dimensional hollow composite board. The board is of a sandwich structure, and comprises a core layer and reinforcement layers disposed on both sidesin the thickness direction of the core layer. The core layer includes a foam layer and reinforcing ribs arranged in the foam layer and prepared from resin A. A reinforcing layer is prepared from a three-dimensional hollow composite material, and is compounded on the foam layer via resin B, and the reinforcing ribs penetrate the foam layer and are connected to the reinforcing layer. The composite board has both the excellent thermal insulation properties of a foam material and the mechanical properties of a three-dimensional hollow composite material, and thus the use scope of the thermal insulation board is expanded. The present invention also discloses the application of the composite board.

Description

Technical field [0001] The invention relates to a heat-insulating hollow composite board, in particular to a heat-insulating three-dimensional hollow composite board and its application. Background technique [0002] At present, the main insulation panels are foam sandwich panels. The foam sandwich panels are composed of upper and lower skins and a middle foam core layer. The skin and the core layer are formed by secondary bonding. The thickness of the skin is thin and there are obvious Bonding the weak interface layer makes the foam sandwich panel poor in impact resistance, delamination resistance and overall rigidity. [0003] The three-dimensional hollow composite material is a sandwich composite material with a sandwich structure. The basis of the sandwich structure is the warp yarn and weft yarn of the surface layer and the Z-direction fiber connecting the two surface layers and forming the core. The material based on the sandwich structure has the characteristics of light we...

Claims

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Application Information

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IPC IPC(8): B32B27/36B32B27/40B32B3/08B32B27/12B32B7/12B32B33/00
CPCB32B3/08B32B5/06B32B5/18B32B5/26B32B7/12B32B27/12B32B27/36B32B27/40B32B33/00B32B2266/0264B32B2266/0278B32B2307/304B32B2307/558B32B2307/718B32B2307/72B32B2605/00
Inventor 张守玉周正亮陈同海戚洪强赵大娟姜龙骏
Owner NANJING FIBERGLASS RES & DESIGN INST CO LTD
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