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Flexible heat-conducting gasket and preparation method thereof

A thermal pad, flexible technology, applied in the field of potting glue, to achieve the effect of convenient use, good bonding, and simple operation

Active Publication Date: 2018-04-06
GUANGZHOU BAIYUN CHEM IND
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Based on this, it is necessary to provide an easy-release flexible thermal pad, the viscosity of which is properly controlled, for the sticky film or powder drop problem caused by the fact that the flexible thermal pad itself is too viscous and difficult to peel off from the release film. , while ensuring good adhesion to the substrate, it is also easy to peel off from the release film, which is convenient to use

Method used

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  • Flexible heat-conducting gasket and preparation method thereof
  • Flexible heat-conducting gasket and preparation method thereof
  • Flexible heat-conducting gasket and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0069] (1) Preparation of base glue: get 100 parts by weight of vinyl silicone oil (viscosity is 2000mPa·S, vinyl content is 0.22%) and put into kneader, add alumina filler (median particle size 25um) 900 weight in batches Knead at room temperature for 2 hours; raise the temperature to 150°C, and evacuate until the degree of vacuum reaches -0.1MPa, continue kneading for 3 hours, and obtain the base rubber after cooling.

[0070] (2) Preparation of hydrosilane: in a clean and dry reaction flask, add 64.5g ethyl chloride, 24g magnesium powder and 1g iodine initiator, carry out Grignard reaction in a mixed solution of 10mL tetrahydrofuran and 120mL xylene, Prepare the Grignard reagent at 35°C, then control the temperature at 10°C, add 44.7g of trichlorosilane, and raise the temperature to about 75°C for condensation reaction. After reacting for 6 hours, cool down to room temperature, and add the obtained reaction solution dropwise to ice water In the mixture, let stand to separat...

Embodiment 2

[0083] (1) Preparation of base glue: get 100 parts by weight of vinyl silicone oil (viscosity is 1000mPa·S, vinyl content is 0.3%) and put into kneader, add alumina filler (median particle size 25um) 900 weight in batches Knead at room temperature for 2 hours; raise the temperature to 150°C, and evacuate until the degree of vacuum reaches -0.1MPa, continue kneading for 2 hours, and obtain the base rubber after cooling.

[0084] (2) Preparation of hydrosilane: In a clean and dry reaction flask, add 78.5g of 2-chloropropane, 24g of magnesium powder and 1g of initiator iodine, and carry out a Grignard reaction in a mixed solution of 10mL of tetrahydrofuran and 150mL of xylene. Prepare the Grignard reagent at 145°C, then control the temperature at 10°C, add 38.7g of trichlorosilane, and the temperature rises to about 75°C for condensation reaction. After reacting for 8 hours, cool down to normal temperature, and add the resulting reaction solution dropwise to ice In the water mixt...

Embodiment 3

[0097] (1) Preparation of base glue: get 100 parts by weight of vinyl silicone oil (viscosity is 300mPa S, vinyl content is 0.54%) and put into kneader, add alumina filler (median particle size 25um) 900 weight in batches Knead at room temperature for 2 hours; raise the temperature to 150°C, and evacuate until the degree of vacuum reaches -0.1MPa, continue kneading for 3 hours, and obtain the base rubber after cooling.

[0098] (2) Preparation of hydrosilane: In a clean and dry reaction flask, add 92.5g of tert-chlorobutane, 24g of magnesium powder and 1g of iodine as an initiator, and perform a Grignard reaction in a mixed solution of 10mL of tetrahydrofuran and 160mL of xylene , make Grignard reagent at 75°C, then control the temperature at 10°C, add 34g of trichlorosilane, the temperature rises to about 75°C for condensation reaction, after reacting for 8 hours, cool down to normal temperature, and add the obtained reaction liquid dropwise to ice In the water mixture, let s...

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Abstract

The invention relates to a flexible heat-conducting gasket and a preparation method thereof. The flexible heat-conducting gasket is composed of a component A and a component B according to a certain proportion, wherein the component A comprises preparation raw materials of base rubber and a catalyst; and the component B mainly comprises the preparation raw materials of base rubber, a cross-linkingagent, a chain extender and hydrogen-containing silane. According to the invention, through reasonable controlling of the proportion of the preparation raw materials of the component A and the component B and the proportion of the component A and the component B, the flexible heat-conducting gasket prepared by using the method provided by the invention has low hardness, high thermal conductivityand well controlled viscosity, guarantees good bonding with a substrate, is easily stripped from a release film, and is convenient to use. The preparation method provided by the invention has simple operation and stable process, uses rubber materials with low viscosity, is convenient to discharge foam, and has good moldability and constructability.

Description

technical field [0001] The invention relates to the technical field of potting glue, in particular to a flexible heat-conducting gasket and a preparation method thereof. Background technique [0002] With the development of technology, electronic components, electrical power, circuit modules, and large-scale integrated circuits have further achieved high performance, high reliability, and miniaturization. The heat generated also increases dramatically. However, the "10°C Rule" in the electronics industry shows that for every 10°C increase in the operating temperature of electronic components, their service life will be reduced by half, and their reliability will be reduced by half. The speed will also increase. Therefore, dissipating heat quickly has become one of the key factors for the safe and stable operation of electronic components. [0003] In the solution of traditional technical solutions, the contact problem between the heat source interface and the heat dissipa...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J183/07C09J183/05C09J11/04C09J11/06C09J7/30
CPCC08K2003/0812C08K2003/2227C08K2003/2296C08K2003/282C08K2003/385C08K2201/003C08L2203/206C08L2205/025C08L2205/035C09J7/00C09J11/04C09J11/06C09J183/04C08L83/04C08K5/5419C08K3/22C08K3/38C08K3/28C08K3/08
Inventor 杨敦刘光华付子恩黄文哲陈建军
Owner GUANGZHOU BAIYUN CHEM IND
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