Method and apparatus for multi-laser-beam-combined welding of glass material

Abstract

The invention discloses a method and apparatus for multi-laser-beam-combined welding of a glass material. According to the invention, laser beams emitted by an ultrafast pulsed laser and including glass-transmitting light and laser beams emitted by a continuous laser or long-pulse laser and including glass-transmitting light are combined onto a same optical axis and are then focused on the contact-making part of two pieces of glass by a scanning galvanometer and a field-scanning focusing mirror; the ultrafast pulsed laser beams produce non-linear absorption effect in the two pieces so as to allow the glass material in areas beside a focal point to be fused; the fused glass material has substantially improved absorptivity on continuous or long-pulse laser due to changes in absorptivity; more fused glass materials are produced through further inputting of energy so as to fill welding gaps and to eradicate etching effect, so welding of the area where the focal point is located is finished; and the glass material is scanned and welded until welding operation is finished. The method and apparatus provided by the invention can improve laser beam welding efficiency and can be applied through engineering approaches.

Description

Technical field [0001] The invention belongs to the technical field of laser processing applications, and specifically relates to a method and equipment for welding glass materials by combining multiple laser beams. Background technique [0002] Glass materials are excellent materials for the production of chip packaging such as implanted microelectronics, solar cells, organic light-emitting diodes (OLED), micro-electromechanical systems (MEMS), micro sensors and converters, and optoelectronic devices. Glass-encapsulated electronic chips are used in Various applications that sense key safety factors such as rotation, acceleration, and pressure have extremely broad and potential application value and market prospects in the automotive, train and other transportation industries, as well as in aerospace and other fields. For example, in space, soldered objects, including image sensors with packaged chip devices, must maintain a high degree of reliability and airtightness even under ...

AI Technical Summary

Problems solved by technology

Although adhesives can connect different materials, adhesive packaging has the following problems: first, the release of gas from the adhesive will cause contamination of surrounding devices, resulting in damage to chip performance; Decreased stability; finally, under the condition of undergoing huge temperature changes, the thermal degradation of the adhesive and the stress accumulation of thermal expansion will reduce the service life of the adhesive, resulting in a decrease in the life of the chip, and the adhesive bond strength performance is low, which cannot be used for high strength requirements. Application requirements in aerospace and other fields

[0007] However, at present, this method of ultrashort pulse laser micro-welding glass melts very little glass material, which cannot fill a large welding gap; and increasing the pulse energy will cause the pulse peak power density to be too high and form an etching removal material effect. The glass material is partially broken and a good weld cannot be formed, so the quality requirements for the flatness and smoothness of the glass surface are very high, and the glass must be fixed and clamped with a clamp so that the gap between the two pieces of glass is less than a quarter Only when the wavelength (or 100nm) reaches the optical contact, and the short focal length objective lens is used for focusing and welding, can the welding be successful

This method also has the disadvantages of strict requirements on the focus position and fluctuation, and the welding must be realized by moving the workbench. The speed can only be maintained at a few millimeters per second, and the efficiency is too low. It is difficult to realize engineering applications.

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