Ultraviolet-curable biological conductive adhesive and preparation method thereof
A conductive adhesive, ultraviolet light technology, applied in conductive adhesives, non-polymer organic compound adhesives, adhesives, etc., can solve the problems of residual monomer damage and insufficient polymerization, and achieve high biocompatibility, The production process is simple and environmentally friendly, and the conductivity is improved.
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[0034] A preparation method of ultraviolet light curing bioconductive adhesive, comprising the following steps:
[0035] 1) Take the filler, dissolve it in the dispersant, stir until it is completely dissolved, and obtain solution a;
[0036] 2) Take the crosslinking agent, dissolve it in part of the water, stir until it is completely dissolved, and obtain solution b;
[0037] 3) Take the neutralizing agent, dissolve it in part of the water, stir until completely dissolved, and obtain the neutralizing agent aqueous solution;
[0038] 4) Take AMPS, dissolve in the remaining water, stir and dissolve to obtain AMPS solution, add part of the neutralizer aqueous solution obtained in step 3) to make AMPS salt solution, and obtain solution c;
[0039] 5) Take acrylic acid, add the remaining neutralizer aqueous solution, and stir thoroughly to obtain solution d;
[0040] 6) adding solution d to solution c, and adding a conductive agent, stirring until completely dissolved to obtain ...
Embodiment 1
[0051] A kind of ultraviolet curing bioconductive adhesive of the present invention comprises the raw material of following weight part:
[0052]
[0053]
[0054] The preparation method of the above-mentioned bioconductive adhesive is as follows:
[0055] 1) Weigh 1.0g of fumed silica, dissolve it in 45g of glycerol, stir for 30min until completely dissolved, let it stand for 24h to defoam, and use it as solution a for later use.
[0056] 2) Weigh 0.05g of N,N-methylenebisacrylamide, dissolve it in 2.5g of deionized water, stir for 20min until completely dissolved, and use it as solution b for later use.
[0057] 3) Weigh 20g of AMPS powder, dissolve in 12g of water to make AMPS solution; weigh 5g of anhydrous sodium carbonate, dissolve in 10.3g of water, exothermically cool to about 35°C, slowly add its aqueous solution into the AMPS solution, and Stir rapidly for 15 minutes until completely dissolved, and use it as solution c for later use.
[0058] 4) Prepare 0.2g ...
Embodiment 2
[0064] A kind of ultraviolet curing bioconductive adhesive of the present invention comprises the raw material of following weight part:
[0065]
[0066]
[0067] The preparation method of the above-mentioned bioconductive adhesive is as follows:
[0068] 1) Weigh 3g of fumed silica, dissolve it in 30g of glycerol, stir for 30min until completely dissolved, let it stand for 24h to defoam, and use it as solution a for later use.
[0069] 2) Weigh 0.2g of N-(isobutoxy)methacrylamide, dissolve it in 7.25g of deionized water, stir for 20min until completely dissolved, and use it as solution b for later use.
[0070] 3) Weigh 30g of AMPS powder, dissolve in 24g of water to make AMPS solution; weigh 8g of anhydrous sodium carbonate, dissolve in 20g of water, exotherm and cool to about 35°C, slowly add its aqueous solution into the AMPS solution, and quickly Stir for 15 minutes until completely dissolved, and use it as solution c for later use.
[0071] 4) Prepare 0.5g of so...
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