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Single-liquid type low-temperature cured special glue for temperature fuse and preparation method thereof

A thermal fuse, low temperature technology, applied in the direction of adhesives, epoxy resin glue, adhesive types, etc., can solve the problems of affecting the electrical performance of fuses, deterioration of fuse performance, low bonding strength of glue, etc., to achieve good bonding performance, The effect of low curing temperature and high production efficiency

Inactive Publication Date: 2018-05-01
富邦(厦门)新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the curing temperature of the glue used in thermal fuses is basically higher than 110°C, and some of them reach 150°C. Low bonding strength, high volatility, and poor flame retardancy

Method used

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  • Single-liquid type low-temperature cured special glue for temperature fuse and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] A single-component low-temperature curing thermal fuse special adhesive, which is made of the following components in parts by weight: 45 parts of bisphenol A epoxy resin, 8 parts of flexible epoxy resin, 8 parts of rutile titanium dioxide, 0.7 parts of defoaming and leveling agent, 15 parts of diaminoimidazole triazine complex and 25 parts of phenoxy polyphosphazene.

[0030] The bisphenol A type epoxy resin is rectified bisphenol A type epoxy resin, its viscosity at 40°C is 1000-1500cps, the epoxy equivalent is 184-190, and the total chlorine content is lower than 1200ppm, specifically Shell 828E resin.

[0031] The flexible epoxy resin is a flexible long-chain epoxy resin with a viscosity of 100-150 cps at 40° C., an epoxy equivalent of 120-140, and zero halogen content. Specifically, Taiwan Nanya 331L modified resin can be selected.

[0032] The VOC content of the defoaming and leveling agent is less than 2wt%.

[0033] The particle size of the rutile titanium dio...

Embodiment 2

[0044] A single-component low-temperature curing special adhesive for thermal fuses, which is made of the following components in parts by weight: 40 parts of bisphenol A epoxy resin, 10 parts of flexible epoxy resin, 5 parts of nano-scale carbon black, 0.5 parts of defoaming and leveling agent, 25 parts of diaminoimidazole triazine complex and 20 parts of phenoxy polyphosphazene.

[0045] The bisphenol A type epoxy resin is rectified bisphenol A type epoxy resin, its viscosity at 40°C is 1000-1500cps, the epoxy equivalent is 184-190, and the total chlorine content is lower than 1200ppm, specifically Shell 828E resin.

[0046] The flexible epoxy resin is a flexible long-chain epoxy resin with a viscosity of 100-150 cps at 40° C., an epoxy equivalent of 120-140, and zero halogen content. Specifically, Taiwan Nanya 331L modified resin can be selected.

[0047] The VOC content of the defoaming and leveling agent is less than 2wt%.

[0048] The particle size of the nano-scale ca...

Embodiment 3

[0059] A single-component low-temperature-cured thermal fuse special adhesive, which is made of the following components in parts by weight: 50 parts of bisphenol A epoxy resin, 5 parts of flexible epoxy resin, 3 parts of rutile titanium dioxide, 2 parts of defoaming and leveling agent, 20 parts of diaminoimidazole triazine complex and 30 parts of aluminum hydroxide.

[0060] The bisphenol A type epoxy resin is rectified bisphenol A type epoxy resin, its viscosity at 40°C is 1000-1500cps, the epoxy equivalent is 184-190, and the total chlorine content is lower than 1200ppm, specifically Shell 828E resin.

[0061] The flexible epoxy resin is a flexible long-chain epoxy resin with a viscosity of 100-150 cps at 40° C., an epoxy equivalent of 120-140, and zero halogen content. Specifically, Taiwan Nanya 331L modified resin can be selected.

[0062] The VOC content of the defoaming and leveling agent is less than 2wt%.

[0063] The particle size of the rutile titanium dioxide is 25...

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Abstract

The invention provides a single-liquid type low-temperature cured special glue for a temperature fuse and a preparation method thereof. The special glue is prepared from the following components in parts by weight: 40-50 parts of bisphenol A type epoxy resin, 5-10 parts of flexible type epoxy resin, 3-8 parts of pigment, 0.5-2 parts of additives, 15-25 parts of curing agents and 20-30 parts of filling. The special glue is cured at low temperature, and does not influence the electrical performance of the fuse due to curing under heating in production process of the fuse. The special glue has the advantages of high flame resistance, low volatility, and high adhesion property.

Description

technical field [0001] The invention relates to a single-liquid low-temperature curing special adhesive for thermal fuses and a preparation method thereof. Background technique [0002] A thermal fuse is a common electronic component. At present, the curing temperature of the glue used in thermal fuses is basically higher than 110°C, and some of them reach 150°C. Low bonding strength, high volatility, and poor flame retardancy. Contents of the invention [0003] The invention provides a single-liquid low-temperature curing special adhesive for thermal fuses, which has low curing temperature, good bonding performance and good flame retardancy, and also provides a preparation method thereof. [0004] The present invention realizes through following technical scheme: [0005] A single-component low-temperature curing special adhesive for thermal fuses, which is made of the following components in parts by weight: 40-50 parts of bisphenol A epoxy resin, 5-10 parts of flexib...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J11/04C09J11/06C09J11/08
CPCC08K2003/2227C08K2003/2241C08K2201/011C08L2201/02C08L2205/02C08L2205/03C09J11/04C09J11/06C09J11/08C09J163/00C08L63/00C08L79/04C08K13/02C08K3/22C08K3/04
Inventor 陈玉真
Owner 富邦(厦门)新材料有限公司
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