A kind of LED chip insulating and heat-conducting crystal-bonding adhesive and preparation method thereof

A LED chip, insulation and heat conduction technology, applied in the direction of adhesives, epoxy resin glue, non-polymer adhesive additives, etc., can solve the problems of low thermal conductivity, restricting the application effect, and limited addition of heat-conducting fillers

Active Publication Date: 2021-02-09
YANTAI DARBOND TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Conductive silver glue, as the name suggests, is mainly used for heat conduction and electricity conduction, often used in vertical structures, and can also be used in horizontal structures, but there is a hidden danger of leakage in large-scale applications; insulating die-bonding glue can be used for heat conduction, mainly used in horizontal structures
At present, the thermally conductive fillers of insulating die-bonding adhesives are mainly alumina, aluminum nitride, and boron nitride, etc., and their thermal conductivity is mostly concentrated in the range of 50-200W / (M K). The thermal conductivity is concentrated at 0.3-0.5W / (M K), and the thermal conductivity is low, but if too much thermal conductive filler is added, although the thermal conductivity of the insulating die-bonding adhesive can be improved, its viscosity is relatively high and the adhesive force decreases , restricting its application effect
[0006] The general method of using thermally conductive fillers is to directly mix them with resins, crosslinking agents, catalysts, adhesives, etc., and disperse them evenly under high-speed stirring. The material is evenly dispersed, but in the microscopic state, there is still a distance between the thermally conductive fillers, and the resin matrix is ​​full, and the heat conduction efficiency is poor. Although the amount of thermally conductive filler can be added to shorten the distance between the filler and the filler, to increase The purpose of conduction efficiency, but it will be restricted by the overall viscosity of the colloid, resulting in a limited amount of thermally conductive fillers. Therefore, the thermal conductivity of insulating die-bonding adhesives is generally different from that of thermally conductive fillers.
[0007] To sum up, the existing insulating die-bonding adhesives have low thermal conductivity. Since there is no suitable thermally conductive filler, when the insulating die-bonding adhesive is added with too much thermally conductive filler, although it can improve the thermal conductivity of the insulating die-bonding adhesive system, but its viscosity is relatively high, and the adhesive force decreases, which restricts its application effect

Method used

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  • A kind of LED chip insulating and heat-conducting crystal-bonding adhesive and preparation method thereof
  • A kind of LED chip insulating and heat-conducting crystal-bonding adhesive and preparation method thereof
  • A kind of LED chip insulating and heat-conducting crystal-bonding adhesive and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0044] An insulating heat-conducting crystal-bonding adhesive for LED chips, the components of which include in parts by weight: 60 parts of polysiloxane resin containing vinyl organosilicon, 35 parts of hydrogen-containing silicone oil crosslinking agent, 0.3 parts of platinum catalyst Karstedt, nano 9 parts of titanium dioxide adhesive and 150 parts of special thermal conductive filler.

[0045] The preparation method of the above-mentioned LED chip insulation and heat-conducting crystal-bonding glue, the steps are as follows:

[0046] (1) Preparation of special thermally conductive filler

[0047] a. Add 100 parts of thermally conductive filler alumina (needle shape) into the high-speed disperser, add 1 part of linking agent, mix evenly, and store in airtight;

[0048] b. Add 100 parts of thermally conductive filler hexagonal boron nitride (spherical) into the high-speed disperser, add 0.2 parts of linking agent, mix evenly, and store in airtight;

[0049] c. Add the alum...

Embodiment 2

[0052] An insulating heat-conducting crystal-bonding adhesive for LED chips, the components of which include, in parts by weight: 80 parts of polysiloxane resin containing vinyl organosilicon, 45 parts of hydrogen-containing silicone oil crosslinking agent, 0.2 parts of platinum catalyst Karstedt, nano 8 parts of titanium dioxide adhesive and 120 parts of special thermal conductive filler.

[0053] The preparation method of the above-mentioned LED chip insulation and heat-conducting crystal-bonding glue, the steps are as follows:

[0054] (1) Preparation of special thermally conductive filler

[0055] a. Add 50 parts of thermally conductive filler alumina (flaky) into the high-speed disperser, add 0.5 parts of linking agent, mix evenly, and store in airtight;

[0056] b. Add 100 parts of thermally conductive filler hexagonal boron nitride (spherical) into the high-speed disperser, add 0.2 parts of linking agent, mix evenly, and store in airtight;

[0057] c. Add the aluminum...

Embodiment 3

[0060] An insulating heat-conducting crystal-bonding adhesive for LED chips, the components of which include, in parts by weight: 40 parts of E51 bisphenol A epoxy resin, 40 parts of alicyclic epoxy resin, and 85 parts of methyltetrahydrophthalic anhydride , 0.2 parts of 2-methylimidazole catalyst, 5 parts of nano-titanium dioxide adhesive and 180 parts of special thermally conductive filler.

[0061] The preparation method of the above-mentioned LED chip insulation and heat-conducting crystal-bonding glue, the steps are as follows:

[0062] (1) Preparation of special thermally conductive filler

[0063] a. Add 100 parts of thermally conductive filler alumina (needle shape) into the high-speed disperser, add 1 part of linking agent, mix evenly, and store in airtight;

[0064] b. Add 100 parts of thermally conductive filler alumina (spherical) into the high-speed disperser, add 1 part of linking agent, mix evenly, and store in airtight;

[0065] c. Add the alumina (needle-sha...

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Abstract

The invention belongs to the technical field of adhesives, and in particular relates to an insulating heat-conducting crystal-bonding adhesive for LED chips and a preparation method thereof. The special thermally conductive filler of the present invention is a mixture of thermally conductive fillers of different shapes, such as needle-shaped, flake-shaped or spherical. By pre-mixing the needle-shaped and spherical thermally-conductive fillers with a certain amount of connecting agent, the needle-shaped and spherical thermally-conductive fillers The fillers are connected together to form a certain three-dimensional structure, and then mixed with resin, crosslinking agent, catalyst, adhesive, etc., so that there is no distance between the thermally conductive fillers within a certain range, and the thermal conductivity is high. When the amount of filler is not high, it has little effect on the viscosity of the colloid, and has excellent bonding performance, which can significantly increase its thermal conductivity, thereby achieving the purpose of increasing the conduction efficiency.

Description

technical field [0001] The invention belongs to the technical field of adhesives, and in particular relates to an insulating heat-conducting crystal-bonding adhesive for LED chips and a preparation method thereof. Background technique [0002] Because LED lamps consume less energy than incandescent lamps and fluorescent lamps, have a longer lifespan, and can realize intelligent control, they have a very broad application market. According to incomplete statistics, my country's LED production capacity in 2010 was more than 70 billion yuan, and by 2013 it had increased by 7 times, and it has been widely used in various places such as industry, home, and office. [0003] At present, in the application process of LED lights, part of the light energy of the chip will be converted into heat energy during the light-emitting process, so that the operating temperature of the chip is too high, forming a junction temperature phenomenon, which seriously affects the luminous flux and ser...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J183/07C09J183/05C09J163/00C09J11/04
CPCC08K2003/2241C08K2201/011C08L2203/20C08L2205/025C09J11/04C09J163/00C09J183/04C08L83/04C08K13/04C08K7/08C08K7/18C08K3/22C08L63/00
Inventor 李龙陈维
Owner YANTAI DARBOND TECH
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